公开(公告)号：WO2011017226A3

公开(公告)日：2011-02-10

申请号：PCT/US2010/043956

申请日：2010-07-30

Applicant: APPLIED MATERIALS, INC. ,  POLYAK, Alexander S. ,  CHO, Tom K. ,  GOMEZ, Oscar

Inventor： POLYAK, Alexander S. ,  CHO, Tom K. ,  GOMEZ, Oscar

IPC: H01L21/68 ,  H01L21/683 ,  G02F1/13

Abstract: A method and apparatus for a lift pin is described. In one embodiment, a lift pin head is described. The lift pin head includes a base member having a body made of a first material having a first coefficient of thermal expansion, and a tip disposed on the base member, the base member having a body made of a second material that is flexible at room temperature and having a second coefficient of thermal expansion, the first coefficient of thermal expansion being less than the second coefficient of thermal expansion.

公开(公告)号：WO2008141191A1

公开(公告)日：2008-11-20

申请号：PCT/US2008/063259

申请日：2008-05-09

Applicant: APPLIED MATERIALS, INC. ,  BACHRACH, Robert Z. ,  TEPMAN, Avi ,  POLYAK, Alexander S.

Inventor： BACHRACH, Robert Z. ,  TEPMAN, Avi ,  POLYAK, Alexander S.

IPC: C23C16/00

CPC classification number: B25J15/0052 ,  B25J15/0226 ,  H01L21/67236 ,  H01L21/67276 ,  H01L21/67715 ,  H01L21/67721 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67748

Abstract: The present invention generally comprises equipment for an automated high volume batch work-piece manufacturing factory comprising work-piece handling and work-piece processing in a high productivity factory architecture capable of producing 1,000 or more work-piece an hour. The work-pieces may be presented to the equipment from a stacked supply to a parallel array. Additionally, the work-pieces may be transferred between manufacturing architectures by an array to array batch transfer. The work-pieces may be transferred within the manufacturing architecture in a parallel to parallel batch transfer operation. The robotic operations may be between robotic devices, between robotic devices and processing equipment, and within processing equipment.

Abstract translation: 本发明通常包括用于自动化大批量批量工件制造工厂的设备，其包括能够每小时生产1,000个或更多个工件的高生产率工厂结构中的工件处理和工件加工。 工件可以从堆叠的供应提供给设备到并行阵列。 另外，工件可以通过阵列在制造架构之间转移到阵列批量传输。 工件可以在并行批量传输操作的同时在制造架构内转移。 机器人操作可以在机器人设备之间，机器人设备和处理设备之间以及处理设备内。

公开(公告)号：WO2022051581A1

公开(公告)日：2022-03-10

申请号：PCT/US2021/049000

申请日：2021-09-03

Applicant: APPLIED MATERIALS, INC.

Inventor： KRISHNA, Gopu ,  POLYAK, Alexander S. ,  BALUJA, Sanjeev

IPC: C23C16/458 ,  C23C16/455 ,  H01L21/687

Abstract: Process chambers and methods for calibrating components of a processing chamber while the chamber volume is under vacuum are described. The process chamber includes a motor shaft connected to the process chamber with a plurality of motor bolts. A support plate is positioned under the chamber floor to accommodate for deflection of the chamber floor due to vacuum conditions within the chamber volume. A bellows assembly extending from the chamber floor to the support plate maintains vacuum conditions within the chamber.

公开(公告)号：WO2018102519A1

公开(公告)日：2018-06-07

申请号：PCT/US2017/063891

申请日：2017-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： SRINIVASAN, Mukund ,  PONNEKANTI, Hari ,  YUDOVSKY, Joseph ,  POLYAK, Alexander S.

IPC: H01L21/02 ,  C23C16/455 ,  H01L21/67 ,  H01L21/677

CPC classification number: C23C16/45544 ,  C23C16/45534 ,  C23C16/45542 ,  C23C16/45551 ,  C23C16/4583 ,  C23C16/54 ,  H01L21/02005 ,  H01L21/28562 ,  H01L21/67098 ,  H01L21/67167 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/68764 ,  H01L21/68771

Abstract: Processing platforms having a central transfer station with a robot, a first batch processing chamber connected to a first side of the central transfer station and a first single wafer processing chamber connected to a second side of the central transfer station, where the first batch processing chamber configured to process x wafers at a time for a batch time and the first single wafer processing chamber configured to process a wafer for about 1/x of the batch time. Methods of using the processing platforms and processing a plurality of wafers are also described.

公开(公告)号：WO2017117213A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/068863

申请日：2016-12-28

Applicant: APPLIED MATERIALS, INC.

Inventor： POLYAK, Alexander S. ,  YUDOVSKY, Joseph ,  KWONG, Garry K.

IPC: H05B3/14 ,  H01L21/67 ,  H05B3/40

CPC classification number: H05B6/105 ,  H01L21/67103 ,  H01L21/68764 ,  H01L21/68771 ,  H05B6/362

Abstract: Heater assemblies comprising a cylindrical body with a surface and a central axis including a plurality of heating elements are described. The plurality of heating elements is axially spaced on the surface of the cylindrical body. Each of the heating elements forms an axially spaced heating zone. Each heating element has a spiral shape with an inner end and an outer end defining a length of the heating element. Each coil of the spiral shape is spaced from an adjacent coil by a distance sufficient to prevent arcing between adjacent coils.

Abstract translation: 描述了加热器组件，该加热器组件包括具有表面和包括多个加热元件的中心轴线的圆柱形主体。 多个加热元件在圆柱形主体的表面上轴向间隔开。 每个加热元件形成轴向间隔开的加热区。 每个加热元件具有螺旋形状，其具有限定加热元件的长度的内端和外端。 螺旋形状的每个线圈与相邻线圈隔开足以防止相邻线圈之间发生电弧的距离​​。

公开(公告)号：WO2013036619A2

公开(公告)日：2013-03-14

申请号：PCT/US2012/053932

申请日：2012-09-06

Applicant: APPLIED MATERIALS, INC. ,  MUNGEKAR, Hemant P. ,  POLYAK, Alexander S. ,  COX, Michael S.

Inventor： MUNGEKAR, Hemant P. ,  POLYAK, Alexander S. ,  COX, Michael S.

IPC: H01L21/205

CPC classification number: H01J37/3244 ,  C23C16/45504 ,  C23C16/45557 ,  C23C16/45563 ,  C23C16/4584 ,  C23C16/50 ,  C23C16/52 ,  C23C16/54 ,  H01J37/32779

Abstract: A method and apparatus for processing a substrate is described. One embodiment of the invention provides an apparatus for forming thin films. The apparatus comprises a chamber defining an internal volume, a plasma source disposed within the internal volume, and at least one gas injection source disposed adjacent the plasma source within the internal volume, wherein the at least one gas injection source comprises a first channel and a second channel for delivering gases to the internal volume, the first channel delivering a gas at a first pressure or a first density and the second channel delivering a gas at a second pressure or a second density, the first pressure or the first density being different than the second pressure or the second density.

Abstract translation: 描述了用于处理衬底的方法和设备。 本发明的一个实施例提供了一种用于形成薄膜的设备。 该装置包括限定内部容积的腔室，设置在内部容积内的等离子体源以及设置在内部容积内的等离子体源附近的至少一个气体注入源，其中至少一个气体注入源包括第一通道和 第二通道，用于将气体输送到内部容积，第一通道输送处于第一压力或第一密度的气体，第二通道输送处于第二压力或第二密度的气体，第一压力或第一密度不同于 第二压力或第二密度。

公开(公告)号：WO2011009007A3

公开(公告)日：2011-01-20

申请号：PCT/US2010/042199

申请日：2010-07-15

Applicant: APPLIED MATERIALS, INC. ,  PAI, Uday ,  LOPEZ, Oscar ,  OH, Jeonghoon ,  CHO, Tom K. ,  WHITE, John M. ,  JAMES, Silja ,  POLYAK, Alexander S.

Inventor： PAI, Uday ,  LOPEZ, Oscar ,  OH, Jeonghoon ,  CHO, Tom K. ,  WHITE, John M. ,  JAMES, Silja ,  POLYAK, Alexander S.

IPC: H01L21/68 ,  H01L21/205 ,  G02F1/13

Abstract: Lift pin guides include bearing elements with rollers having liners comprised of a material that provides both self lubrication and cushioning in order to prevent lift pin binding and extend the life of the lift pins and the lift pin guides. In one embodiment, each lift pin guide includes an upper bearing element near the upper surface of a substrate support and a lower bearing element disposed a distance beneath the substrate support in order to reduce stresses experienced by the lift pin. The lift pin guides may be used in a vacuum deposition chamber adapted to deposit materials onto substrates to form electronic devices such as thin film transistors, organic light emitting diodes, photovoltaic devices or solar cells, including chemical vapor deposition chambers and physical vapor deposition chambers. The lift pin guides may also be used in load lock chambers, etching chambers or other applications where lift pins are utilized.