公开(公告)号：WO2011092761A1

公开(公告)日：2011-08-04

申请号：PCT/JP2010/005584

申请日：2010-09-13

Applicant: 富士電機機器制御株式会社 ,  高谷 幸悦 ,  大久保 幸治 ,  中 康弘 ,  鈴木 健司

Inventor： 高谷　幸悦 ,  大久保　幸治 ,  中　康弘 ,  鈴木　健司

IPC: H01H50/04 ,  H01H49/00

CPC classification number: H01H50/045 ,  H01H9/20 ,  H01H50/541 ,  H01H50/546 ,  Y10T24/4544 ,  Y10T29/49826

Abstract: 　付属ユニット（２）のユニット側連結面（２ａ）に設けた可動フック部（１３）は、可動爪（２３ａ）及び被押圧片（２２）を形成したフック部本体（１４）と直線ばね（１５）とを備え、ユニット側連結面（２ａ）に形成した本体収容凹部（１６）にフック部本体（１４）をスライド自在に収容し、フック部本体（１４）のスライド方向に直交してユニット側連結面（２ａ）に形成したばね収容凹部（１７ａ）に、長さ方向の中間部をフック部本体（１４）に係合させて直線ばね（１５）を収容している。被押圧片（２４）を押して可動爪（２３ａ）及び電磁接触器（１）の引掛け穴（８ａ）が非係合状態となる非係合方向にフック部本体（１４）をスライドさせると、弓状に弾性変形した直線ばね（１５）の弾性復元力が、フック部本体（１４）に対して前記非係合方向と逆方向に作用するようにした。

Abstract translation: 在辅助单元（2）的单元侧连接表面（2a）上设置有可动钩部（13），其具有：钩部主体（14），其由爪（23a）和 按压构件（22）; 和线性弹簧（15）。 钩部主体（14）可滑动地容纳在形成在单元侧连接面（2a）中的主体容纳凹部（16）中，线性弹簧（15）容纳在形成的弹簧容纳凹部（17a）中 在垂直于钩部主体（14）的滑动方向的方向上的单元侧连接面（2a）中，线状弹簧（15）的纵向中央部与钩部主体（14）卡合， 。 当推压按压构件（22）时，使钩部主体（14）沿电磁接触器（1）的爪（23a）和钩孔（8a）脱离的脱离方向滑动， 弹性变形为弧形的直线弹簧（15）的弹性恢复力沿与分离方向相反的方向作用在钩部主体（14）上。

公开(公告)号：WO2004013039A3

公开(公告)日：2004-12-16

申请号：PCT/US0314930

申请日：2003-05-13

Applicant: FREESCALE SEMICONDUCTOR INC

Inventor： FOERSTNER JUERGEN A ,  SMITH STEVEN M ,  ROOP RAYMOND MERVIN

IPC: B81B3/00 ,  B81B7/02 ,  B81C1/00 ,  H01H49/00 ,  H01H59/00

CPC classification number: B81C1/0038 ,  B81B2201/018 ,  B81B2201/0292 ,  B81C1/00246 ,  B81C2201/0164 ,  B81C2203/0735 ,  H01G5/18

Abstract: A method is provided for making a MEMS structure (69). In accordance with the method, a CMOS substrate (51) is provided which has interconnect metal (53) deposited thereon. A MEMS structure is created on the substrate through the plasma assisted chemical vapor deposition (PACVD) of a material selected from the group consisting of silicon and silicon-germanium alloys. The low deposition temperatures attendant to the use of PACVD allow these materials to be used for MEMS fabrication at the back end of an integrated CMOS process.

Abstract translation: 提供了一种用于制造MEMS结构（69）的方法。 根据该方法，提供了具有沉积在其上的互连金属（53）的CMOS衬底（51）。 通过等离子体辅助化学气相沉积（PACVD）在基材上形成MEMS结构，该材料选自由硅和硅 - 锗合金组成的组。 伴随使用PACVD的低沉积温度允许这些材料在集成CMOS工艺的后端用于MEMS制造。

公开(公告)号：WO03088288A2

公开(公告)日：2003-10-23

申请号：PCT/EP0303877

申请日：2003-04-11

Applicant: ABB SERVICE SRL ,  MAURA MASSIMO ,  GAMBA FEDERICO

Inventor： MAURA MASSIMO ,  GAMBA FEDERICO

IPC: H01R4/02 ,  H01H1/58 ,  H01H49/00 ,  H01H71/08 ,  H01H73/02 ,  H01R3/00 ,  H01R4/18 ,  H01R43/02 ,  H01H

CPC classification number: H01H1/5822 ,  H01H71/08 ,  H01H2011/0087 ,  H01R43/0221

Abstract: A Junction between a flexible conductor and a connection terminal, whose particularity consists of the fact that it comprises: a connection terminal that is shaped substantially like a parallelepiped and has an upper face and a lower face, two side faces and an end face, and has, on the end face, one or more slots shaped substantially like a parallelepiped, which run through the entire thickness of the connection terminal; at least one flexible conductor, in which one end part is shaped so as to mate substantially with the inner walls of the slots; the end part being inserted in the slots, and the flexible conductor protruding substantially at right angles from one of the upper, lower or end faces; at least one laser welding bead, which runs at said slots along at least one of the two faces from which the flexible conductor does not protrude.

Abstract translation: 柔性导体和连接端子之间的结，其特性包括以下事实：其包括：连接端子，其形状基本上类似于平行六面体，并具有上表面和下表面，两个侧面和端面，以及 在端面上具有基本上类似平行六面体的一个或多个槽，其穿过连接端子的整个厚度; 至少一个柔性导体，其中一个端部成形为基本上与槽的内壁配合; 所述端部插入到所述槽中，并且所述柔性导体从所述上表面，下表面或所述端面中的一个基本上以直角突出; 至少一个激光焊接珠，其沿着所述两个表面中的至少一个在所述狭槽处延伸，柔性导体从该表面不突出。

公开(公告)号：WO0135433A3

公开(公告)日：2001-12-27

申请号：PCT/US0023197

申请日：2000-08-23

Applicant: HRL LAB LLC

Inventor： CHOW LAP-WAI ,  HSU TSUNG-YUAN ,  HYMAN DANIEL J ,  LOO ROBERT Y ,  OUYANG PAUL ,  SCHAFFNER JAMES H ,  SCHMITZ ADELE ,  SCHWARTZ ROBERT N

IPC: B81B3/00 ,  B81C1/00 ,  H01H1/021 ,  H01H1/58 ,  H01H49/00 ,  H01H59/00 ,  H01H50/00

CPC classification number: B81C1/00246 ,  B81B2201/014 ,  B81C2201/014 ,  B81C2203/0714 ,  B81C2203/0735 ,  H01H1/58 ,  H01H59/0009 ,  H01H2001/0057

Abstract: A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with the process of a particular foundry, resulting in a device which is both low cost and readily integrable with other circuits. The processing steps include making contacts for the MEM switch from metal plugs which are ordinarily used as viasto connect metal layers which are separated by a dielectric layer. Such contact vias are formed on either side of a sacrificial metallization area, and then the interconnect metallization is removed from between the contact vias, leaving them separated. Dielectric surrounding the contacts is etched back so that they protrude towards each other. Thus, when the contacts are moved towards each other by actuating the MEM switch, they connect firmly without obstruction. Tungsten is typically used to form vias in CMOS processes, and it makes an excellent contact material, but other via metals may also be employed as contacts. Interconnect metallization may be employed for other structural and interconnect needs of the MEM switch, and is preferably standard for the foundry and process used. Various metals and dielectric materials may be used to create the switches, but in a preferred embodiment the interconnect metal layers are aluminum and the dielectric material is SiO2, materials which are fully compatible with standard four-layer CMOS fabrication processes.

Abstract translation: 通过使用标准制造多个金属层集成电路（如CMOS）的处理步骤，廉价地制造了微机电（MEM）开关。 可以将精确的步骤调整为与特定代工厂的过程兼容，从而导致低成本且易于与其他电路集成的装置。 处理步骤包括从通常用作通过电介质层分离的永久连接的金属层的金属插头形成用于MEM开关的触点。 这种接触通孔形成在牺牲金属化区域的任一侧，然后从接触通孔之间移除互连金属化，使它们分开。 围绕触点的介质被回蚀，使得它们彼此突出。 因此，当通过致动MEM开关使触点彼此移动时，它们牢固地连接而不阻塞。 钨通常用于在CMOS工艺中形成通孔，并且它制成优良的接触材料，但也可以使用其它通孔金属作为接触。 互连金属化可以用于MEM开关的其他结构和互连需求，并且优选地是用于所使用的铸造和工艺的标准。 可以使用各种金属和介电材料来制造开关，但是在优选实施例中，互连金属层是铝，并且介电材料是SiO 2，与标准四层CMOS制造工艺完全兼容的材料。

公开(公告)号：WO0044020A3

公开(公告)日：2001-02-01

申请号：PCT/US0002145

申请日：2000-01-27

Applicant: TELEDYNE TECH INC ,  STEENBERGE ROBERT W

Inventor： STEENBERGE ROBERT W

IPC: H01H1/00 ,  H01H49/00 ,  H01H50/00 ,  B81C3/00

CPC classification number: H01H50/005 ,  H01H1/0036 ,  H01H49/00 ,  H01H2001/0073 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49204

Abstract: The present invention discloses a laminated-based electromechanical device and a method of fabricating laminate-based electromechanical devices. The device includes two or more layers of laminate bonded together to form a unitary laminate structure. The layers of laminate include a layer of organic dielectric material that may have at least a portion of one layer of electrically conductive material adherent thereto. The layers of organic dielectric material are bonded to form a unitary laminate structure through a process of lamination. The structures that make up the electromechanical device may be formed either before or after bonding. In particular, the various electromechanical structures that make up the electromechanical device are formed from the layers of organic dielectric material and the layers of electrically conductive material adherent thereto using a predetermined sequence of additive and subtractive fabrication techniques.

Abstract translation: 本发明公开了一种基于层压的机电装置和一种制造基于层压板的机电装置的方法。 该装置包括两层或多层层压结合在一起以形成整体层压结构。 层压层包括有机介电材料层，其可以具有与其粘合的一层导电材料的至少一部分。 有机介电材料层通过层压工艺结合形成整体叠层结构。 构成机电装置的结构可以在接合之前或之后形成。 特别地，构成机电装置的各种机电结构由有机电介质材料层和与其附着的导电材料层使用预定的添加剂和减法制造技术的顺序形成。

公开(公告)号：WO00068963A1

公开(公告)日：2000-11-16

申请号：PCT/EP2000/003991

申请日：2000-05-04

IPC: H01H1/029 ,  H01H49/00 ,  H01H50/04 ,  H01H50/14 ,  H01H50/16 ,  H01H1/02

CPC classification number: H01H49/00 ,  H01H1/029 ,  H01H50/04 ,  H01H50/14 ,  H01H50/16 ,  H01H2050/166 ,  H01H2050/446

Abstract: The relay and the method for producing said relay are characterized by their simplicity in terms of production. Instead of using different materials for the coil body, the core device and the elements of the load circuit, the ferromagnetic or electrically conductive metals are replaced at least in part by plastic materials to which ferromagnetic or electrically conductive properties are added. In one embodiment, the whole relay consists of plastic parts except for the winding, which have been produced in a multicomponent injection molding process.

Abstract translation: 中继站和它的制备方法的特征在于其制造Einfachhheit。 这是由铁磁或导电金属来实现至少部分地由塑料材料所取代，而不是使用不同的材料，例如，绕线管，芯部组件和负载电路的元件，它与铁磁或导电性共享相加。 在一个可能的实施例中，整个继电器是高达多组分注射成型制造塑料部件的卷绕。

公开(公告)号：WO99022392A1

公开(公告)日：1999-05-06

申请号：PCT/DE1998/002729

申请日：1998-09-15

IPC: H01H11/06 ,  H01H49/00 ,  H01H50/04 ,  H01H50/14 ,  H01H50/26 ,  H01H50/36 ,  H01H50/44 ,  H01H50/54

CPC classification number: H01H49/00 ,  H01H11/06 ,  H01H50/042 ,  H01H50/14 ,  H01H50/26 ,  H01H50/36 ,  H01H50/443 ,  H01H50/54 ,  H01H2011/0087 ,  Y10T29/4902 ,  Y10T29/49073

Abstract: A coil form (1) is injection moulded to form the base body of the relay. At least one fixed contact carrier (3,4), one contact-spring contact pin (5) and coil contact pins (9,10) embodied as wire sections in the form of drawn semi-finished products are introduced into the mould and extrusion-coated. The core (16) can also be embedded into the material of the coil form (1) if so desired. This dispenses with assembly processes involving the abrasion of plastic particles which can later become deposited on the contacts. All connector pieces can be mounted in a cost-effective manner in the injection mould, requiring as little material as possible by virtue of the fact that there is no wastage when the semi-finished wires are separated.

Abstract translation: 在继电器中，线圈体（1）被形成为通过注射成型的基体，至少一个固定触点载体（3，4），并在绘制半成品推进到模具线部分的形式的接触弹簧Anchlussstift（5）和线圈连接销（9，10） 与封装。 任选地，所述芯（16）可以被嵌入在线圈主体（1）的材料中。 出现这种情况的不连接过程，刮成塑料粒子，并可能在以后的接触达到。 以这种方式，所有衬套的装配，在注射模具用最少可能使用的材料，即不浪费单独导线的半成品成本步骤中使用。

公开(公告)号：WO9859351A3

公开(公告)日：1999-03-18

申请号：PCT/DE9801386

申请日：1998-05-20

Applicant: SIEMENS AG ,  BAUR RUDOLF ,  HENDEL HORST

Inventor： BAUR RUDOLF ,  HENDEL HORST

IPC: H01H49/00 ,  H01F7/08 ,  H01H50/36 ,  H01H

CPC classification number: H01H50/36 ,  H01F7/081 ,  H01H2050/367

Abstract: The invention relates to an electromagnet system, comprising a yoke (1) and a round core (2) having a cylindrical shaft and an enlarged conical segment (25) extending outwards, towards a fixing end. The shaft of the core is inserted into a round hole (13) of the yoke from the outside. The conical segment (25) of the core also has a thread used to screw the conical section (25) into the threadless round hole (13) of the yoke (1). This enables the core to be positioned accurately and provides a tight fit and a good magnetic coupling.

公开(公告)号：WO98059351A2

公开(公告)日：1998-12-30

申请号：PCT/DE1998/001386

申请日：1998-05-20

IPC: H01H49/00 ,  H01F7/08 ,  H01H50/36 ,  H01H

CPC classification number: H01H50/36 ,  H01F7/081 ,  H01H2050/367

Abstract: The invention relates to an electromagnet system, comprising a yoke (1) and a round core (2) having a cylindrical shaft and an enlarged conical segment (25) extending outwards, towards a fixing end. The shaft of the core is inserted into a round hole (13) of the yoke from the outside. The conical segment (25) of the core also has a thread used to screw the conical section (25) into the threadless round hole (13) of the yoke (1). This enables the core to be positioned accurately and provides a tight fit and a good magnetic coupling.

Abstract translation: 具有磁轭（1）和一个圆形芯（2）的附接朝向向外延伸的锥形部分（25）端部电磁体系统具有圆柱形柄和。 芯被插入其在所述磁轭的一个圆形孔（13）前部柄部从外部。 此外，芯部的锥形部分（25）具有与它是通过在磁轭（1）的非螺纹圆形孔（13）把它螺合的螺纹。 以这种方式，核心可以被精确地定位，并达到良好的紧密配合和良好的磁耦合。

公开(公告)号：WO1990005989A1

公开(公告)日：1990-05-31

申请号：PCT/GB1989001409

申请日：1989-11-24

Applicant: P E D LIMITED ,  CONNELL, Richard ,  WEBB, Edwin, Thomas

Inventor： P E D LIMITED

IPC: H01H49/00

CPC classification number: H01H50/18 ,  H01H11/0056 ,  H01H49/00 ,  H01H50/443 ,  H01H51/2209 ,  H01H2050/446 ,  H01H2051/2218

Abstract: A method of constructing an encapsulated relay is described in which the relay includes an intensely magnetised actuator/armature formed from a chromium/cobalt/iron alloy after fabrication is assembled and encapsulated in a clean environment before being magnetised and heat treated. A relay construction which includes such an actuator/armature is described in which the relay components are accurately located on an insulating base which itself is moulded out of a sheet of conductive material so as to leave protruding lugs which can be bent upwardly and downwardly to form (or provide supports for) some of the component parts of the relay.

Abstract translation: 描述了一种构造封装的继电器的方法，其中继电器包括在制造组装之后由铬/钴/铁合金形成的强磁化的致动器/电枢，并且在被磁化和热处理之前被封装在干净的环境中。 描述了包括这样的致动器/电枢的继电器结构，其中继电器部件被精确地定位在绝缘基底上，绝缘基体本身由导电材料片模制而成，以便留下突出的凸耳，其可以向上和向下弯曲以形成 （或提供支持）继电器的一些组成部分。