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    LAMINATE-BASED APPARATUS AND METHOD OF FABRICATION
    5.
    发明申请
    LAMINATE-BASED APPARATUS AND METHOD OF FABRICATION 审中-公开
    基于层压的装置和制造方法

    公开(公告)号：WO0044020A3

    公开(公告)日：2001-02-01

    申请号：PCT/US0002145

    申请日：2000-01-27

    Applicant: TELEDYNE TECH INC ,  STEENBERGE ROBERT W

    Inventor： STEENBERGE ROBERT W

    IPC: H01H1/00 ,  H01H49/00 ,  H01H50/00 ,  B81C3/00

    CPC classification number: H01H50/005 ,  H01H1/0036 ,  H01H49/00 ,  H01H2001/0073 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49204

    Abstract: The present invention discloses a laminated-based electromechanical device and a method of fabricating laminate-based electromechanical devices. The device includes two or more layers of laminate bonded together to form a unitary laminate structure. The layers of laminate include a layer of organic dielectric material that may have at least a portion of one layer of electrically conductive material adherent thereto. The layers of organic dielectric material are bonded to form a unitary laminate structure through a process of lamination. The structures that make up the electromechanical device may be formed either before or after bonding. In particular, the various electromechanical structures that make up the electromechanical device are formed from the layers of organic dielectric material and the layers of electrically conductive material adherent thereto using a predetermined sequence of additive and subtractive fabrication techniques.

    Abstract translation: 本发明公开了一种基于层压的机电装置和一种制造基于层压板的机电装置的方法。 该装置包括两层或多层层压结合在一起以形成整体层压结构。 层压层包括有机介电材料层，其可以具有与其粘合的一层导电材料的至少一部分。 有机介电材料层通过层压工艺结合形成整体叠层结构。 构成机电装置的结构可以在接合之前或之后形成。 特别地，构成机电装置的各种机电结构由有机电介质材料层和与其附着的导电材料层使用预定的添加剂和减法制造技术的顺序形成。

    ELECTROMAGNETIC RELAY AND METHOD FOR THE PRODUCTION THEREOF
    6.
    发明申请
    ELECTROMAGNETIC RELAY AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
    电磁继电器和方法及其

    公开(公告)号：WO00068963A1

    公开(公告)日：2000-11-16

    申请号：PCT/EP2000/003991

    申请日：2000-05-04

    IPC: H01H1/029 ,  H01H49/00 ,  H01H50/04 ,  H01H50/14 ,  H01H50/16 ,  H01H1/02

    CPC classification number: H01H49/00 ,  H01H1/029 ,  H01H50/04 ,  H01H50/14 ,  H01H50/16 ,  H01H2050/166 ,  H01H2050/446

    Abstract: The relay and the method for producing said relay are characterized by their simplicity in terms of production. Instead of using different materials for the coil body, the core device and the elements of the load circuit, the ferromagnetic or electrically conductive metals are replaced at least in part by plastic materials to which ferromagnetic or electrically conductive properties are added. In one embodiment, the whole relay consists of plastic parts except for the winding, which have been produced in a multicomponent injection molding process.

    Abstract translation: 中继站和它的制备方法的特征在于其制造Einfachhheit。 这是由铁磁或导电金属来实现至少部分地由塑料材料所取代，而不是使用不同的材料，例如，绕线管，芯部组件和负载电路的元件，它与铁磁或导电性共享相加。 在一个可能的实施例中，整个继电器是高达多组分注射成型制造塑料部件的卷绕。

    METHOD FOR PRODUCING A RELAY
    7.
    发明申请
    METHOD FOR PRODUCING A RELAY 审中-公开
    用于生产继电器

    公开(公告)号：WO99022392A1

    公开(公告)日：1999-05-06

    申请号：PCT/DE1998/002729

    申请日：1998-09-15

    IPC: H01H11/06 ,  H01H49/00 ,  H01H50/04 ,  H01H50/14 ,  H01H50/26 ,  H01H50/36 ,  H01H50/44 ,  H01H50/54

    CPC classification number: H01H49/00 ,  H01H11/06 ,  H01H50/042 ,  H01H50/14 ,  H01H50/26 ,  H01H50/36 ,  H01H50/443 ,  H01H50/54 ,  H01H2011/0087 ,  Y10T29/4902 ,  Y10T29/49073

    Abstract: A coil form (1) is injection moulded to form the base body of the relay. At least one fixed contact carrier (3,4), one contact-spring contact pin (5) and coil contact pins (9,10) embodied as wire sections in the form of drawn semi-finished products are introduced into the mould and extrusion-coated. The core (16) can also be embedded into the material of the coil form (1) if so desired. This dispenses with assembly processes involving the abrasion of plastic particles which can later become deposited on the contacts. All connector pieces can be mounted in a cost-effective manner in the injection mould, requiring as little material as possible by virtue of the fact that there is no wastage when the semi-finished wires are separated.

    Abstract translation: 在继电器中，线圈体（1）被形成为通过注射成型的基体，至少一个固定触点载体（3，4），并在绘制半成品推进到模具线部分的形式的接触弹簧Anchlussstift（5）和线圈连接销（9，10） 与封装。 任选地，所述芯（16）可以被嵌入在线圈主体（1）的材料中。 出现这种情况的不连接过程，刮成塑料粒子，并可能在以后的接触达到。 以这种方式，所有衬套的装配，在注射模具用最少可能使用的材料，即不浪费单独导线的半成品成本步骤中使用。

    ARMATURE/ACTUATOR FOR A RELAY
    8.
    发明申请
    ARMATURE/ACTUATOR FOR A RELAY 审中-公开
    用于继电器的驱动器/执行器

    公开(公告)号：WO1990005989A1

    公开(公告)日：1990-05-31

    申请号：PCT/GB1989001409

    申请日：1989-11-24

    Applicant: P E D LIMITED ,  CONNELL, Richard ,  WEBB, Edwin, Thomas

    Inventor： P E D LIMITED

    IPC: H01H49/00

    CPC classification number: H01H50/18 ,  H01H11/0056 ,  H01H49/00 ,  H01H50/443 ,  H01H51/2209 ,  H01H2050/446 ,  H01H2051/2218

    Abstract: A method of constructing an encapsulated relay is described in which the relay includes an intensely magnetised actuator/armature formed from a chromium/cobalt/iron alloy after fabrication is assembled and encapsulated in a clean environment before being magnetised and heat treated. A relay construction which includes such an actuator/armature is described in which the relay components are accurately located on an insulating base which itself is moulded out of a sheet of conductive material so as to leave protruding lugs which can be bent upwardly and downwardly to form (or provide supports for) some of the component parts of the relay.

    Abstract translation: 描述了一种构造封装的继电器的方法，其中继电器包括在制造组装之后由铬/钴/铁合金形成的强磁化的致动器/电枢，并且在被磁化和热处理之前被封装在干净的环境中。 描述了包括这样的致动器/电枢的继电器结构，其中继电器部件被精确地定位在绝缘基底上，绝缘基体本身由导电材料片模制而成，以便留下突出的凸耳，其可以向上和向下弯曲以形成 （或提供支持）继电器的一些组成部分。

    封止接点装置およびその製造方法
    9.
    发明申请
    封止接点装置およびその製造方法 审中-公开
    密封接触装置及其制造方法

    公开(公告)号：WO2015136730A1

    公开(公告)日：2015-09-17

    申请号：PCT/JP2014/071068

    申请日：2014-08-08

    Applicant: オムロン株式会社

    Inventor： 島　宏海 ,  森　正樹 ,  岡本　拓真

    IPC: H01H50/54 ,  H01H49/00

    CPC classification number: H01H50/023 ,  B23K11/14 ,  H01H9/34 ,  H01H9/443 ,  H01H49/00 ,  H01H50/026 ,  H01H50/548 ,  H01H51/065 ,  H01H2223/002 ,  H01H2223/008

    Abstract: 　部品点数が少なく、生産性の高い封止接点装置を提供することにある。このため、板状ヨーク（３７）の上面に、金属製ケース（３２）の下方開口縁部から側方に延在した環状鍔部（３２ａ）を溶接一体化して内部空間内を形成するとともに、前記内部空間内に固定接点（３３ａ）および可動接点（４８ａ）を接離可能に対向させた封止接点装置である。特に、板状ヨーク（３７）の上面に、前記環状鍔部（３２ａ）の下面に沿って設けた環状突起（３２ｃ）を抵抗溶接で一体化した。

    Abstract translation: 本发明的目的是提供一种具有低成分数量并可高生产率制造的密封接触装置。 为此，在这种密封接触装置中，从金属壳体（32）的底部开口的边缘向外延伸的凸缘环（32a）被焊接在轭板（37）的顶表面上，形成单个 具有内部空间的单元，并且在所述内部空间中，固定触点（33a）和可动触头（48a）彼此面对以能够彼此接触并且彼此远离。 特别地，沿着凸缘环（32a）的底面设置的突出环（32c）通过电阻焊接接合到轭板（37）的顶面。

    ESTABLISHING CONTACT WITH AN ELECTRICAL COMPONENT AND METHOD FOR ESTABLISHING THE CONTACT
    10.
    发明申请
    ESTABLISHING CONTACT WITH AN ELECTRICAL COMPONENT AND METHOD FOR ESTABLISHING THE CONTACT 审中-公开
    触电气元件和方法生产同样

    公开(公告)号：WO2014048713A3

    公开(公告)日：2014-06-05

    申请号：PCT/EP2013068633

    申请日：2013-09-09

    Applicant: EPCOS AG

    Inventor： OTTLINGER MARION ,  KRUMPHALS ROBERT ,  STANI ANDREAS

    IPC: H01L41/047 ,  H01L41/293

    CPC classification number: H01H57/00 ,  H01H45/14 ,  H01H49/00 ,  H01L41/0472 ,  H01L41/293

    Abstract: The invention relates to an electrical component (1), in particular a piezoelectric multilayer component, comprising at least one outer contact (7) having a first metallization (8) and a second metallization (9), wherein the metallizations (8, 9) are baked in, and wherein the second metallization only partially covers the first metallization. The metallization can be frame-shaped. The first metallization and the second metallization may have a different degree of wettability with solder material. The invention further relates to a method for establishing an outer contact.

    Abstract translation: 本发明提供一种电气部件（1），特别是压电多层器件，具有至少一个外触头（7），其包括第一金属化（8）和第二金属化（9），其中，所述金属化（8,9）被烧掉，并且其中所述 第二金属化，所述第一金属化仅仅部分地覆盖。 金属化可以是框架形的。 第一金属化和第二金属化可以具有软钎料润湿性不同。 此外，提供了一种用于外部接触的制备方法。

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