公开(公告)号：WO2005022556A2

公开(公告)日：2005-03-10

申请号：PCT/US2004/028370

申请日：2004-08-31

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01B

CPC classification number: H01R13/03 ,  C09K5/14 ,  H01R43/24 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49171 ,  Y10T29/49174

Abstract: Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电接口形成为导电负载的树脂基材料。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2004114465A3

公开(公告)日：2004-12-29

申请号：PCT/US2004/019259

申请日：2004-06-16

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: H01Q1/24

Abstract: Electromagnetic absorbing devices (13) are formed of a conductive loaded resin-based material (32). The conductive loaded resin-based material (32) comprises micron conductive powder(s), conductive fiber(s) (38), or a combination of conductive powder and conductive fibers (38) in a base resin host (30). The ratio of the weight of the conductive powder(s) (34), conductive fiber(s), or a combination of conductive powder (34) and conductive fibers (38) to the weight of the base resin host (30) is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of nonmetal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

公开(公告)号：WO2004113933A2

公开(公告)日：2004-12-29

申请号：PCT/US2004/019012

申请日：2004-06-16

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: G01R

CPC classification number: G01R1/06788 ,  G01R3/00

Abstract: Electronic probe devices are formed of a conductive loaded resin-based material. The conductive loaded resin­based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

公开(公告)号：WO2005109568A3

公开(公告)日：2011-10-06

申请号：PCT/US2005015504

申请日：2005-05-04

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: B32B33/00 ,  B32B3/02 ,  B32B37/00 ,  H01Q1/36 ,  H01Q9/28

CPC classification number: B29C45/0013 ,  B29C47/0004 ,  B29C47/0011 ,  B29K2995/0005 ,  B29L2031/7652

Abstract: Conductive carpeting is formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 导电地毯由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2005116379A3

公开(公告)日：2009-04-09

申请号：PCT/US2005015509

申请日：2005-05-04

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: F16B35/04 ,  B29C43/00 ,  E05C19/00 ,  F16B1/00

CPC classification number: B29C43/003 ,  B29C2043/024 ,  B29C2043/3615 ,  B29K2303/06 ,  F16B2001/0064

Abstract: Hardware fastener devices are formed of a conductive loaded resin-based material. The conductive loaded resin­based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of, the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 硬件紧固装置由导电负载的树脂基材料形成。 导电负载的树脂基材料包括微米导电粉末，导电纤维或基础树脂主体中的导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：WO2006069140A3

公开(公告)日：2007-06-14

申请号：PCT/US2005046337

申请日：2005-12-21

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01B1/06 ,  H01B1/24

CPC classification number: H01B1/24 ,  H01B1/22

Abstract: A method to form moldable capsules of a conductively doped resin-based material are created. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20 % and about 50 % of the total weight of each moldable capsule.

Abstract translation: 制造形成导电掺杂的树脂基材料的可成型胶囊的方法。 该方法包括通过使束穿过压缩环来压缩一束微米导电纤维束。 将树脂基材料挤出/拉挤到压缩的束上。 将树脂基材料和束分成可模制胶囊。 微米导电纤维占每个可模制胶囊总重量的约20％至约50％。

公开(公告)号：WO2005031912A3

公开(公告)日：2006-07-13

申请号：PCT/US2004025142

申请日：2004-08-03

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: H01Q9/00 ,  H01Q20060101 ,  H01Q9/28 ,  H01Q9/40

CPC classification number: H01Q9/40

Abstract: Omni-directional antenna devices (10) are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20 % and 50 % of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 全向天线装置（10）由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2006017289A1

公开(公告)日：2006-02-16

申请号：PCT/US2005/024691

申请日：2005-07-12

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: B29C45/00 ,  B29C47/00

CPC classification number: B29C47/00 ,  B29C47/0014 ,  B29C47/0019 ,  B29K2995/0005 ,  F02M35/10321 ,  F02M35/10327 ,  F02M35/10334 ,  F02M35/10347

Abstract: Vehicle air intake and exhaust handling devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 车辆进气和排气处理装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：WO2005022556A3

公开(公告)日：2006-01-26

申请号：PCT/US2004028370

申请日：2004-08-31

Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

Inventor： AISENBREY THOMAS

IPC: C09K5/14 ,  H01B20060101 ,  H01Q1/40 ,  H01R13/03 ,  H01R43/24

CPC classification number: H01R13/03 ,  C09K5/14 ,  H01R43/24 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49171 ,  Y10T29/49174

Abstract: Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

Abstract translation: 电接口形成为导电负载的树脂基材料。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

公开(公告)号：WO2005120798A2

公开(公告)日：2005-12-22

申请号：PCT/US2005/020538

申请日：2005-06-08

Applicant: INTEGRAL TECHNOLOGIES, INC. ,  AISENBREY, Thomas

Inventor： AISENBREY, Thomas

IPC: B29C45/00

CPC classification number: H01B1/22 ,  B29C45/0005 ,  B29C45/0013 ,  B29C47/0011 ,  B29C47/54 ,  B29K2995/0005 ,  B29L2031/30 ,  F16H57/032 ,  F16H2057/02043 ,  F16H2057/02091

Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s) or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 汽车外壳由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分比为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。