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    ELECTRIPLAST MOLDABLE COMPOSITE CAPSULE
    1.
    发明申请
    ELECTRIPLAST MOLDABLE COMPOSITE CAPSULE 审中-公开
    电石可塑复合胶囊

    公开(公告)号：WO2005004169A3

    公开(公告)日：2005-09-01

    申请号：PCT/US2004021410

    申请日：2004-07-02

    Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

    Inventor： AISENBREY THOMAS

    IPC: D02G3/00 ,  H01B20060101

    CPC classification number: B29B9/14 ,  B29K2105/0023 ,  B29K2105/0026

    Abstract: Moldable capsules (10) of a conductive loaded resin-based material are created. The moldable capsules comprise a conductive element core (18) radially surrounded by a resin-based material (14). The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive element core comprises between about 20% and about 50% of the total weight of the moldable capsule in one embodiment, between about 20% and about 40% in another embodiment, between about 25% and about 35% in another embodiment, and about 30% in another embodiment. The micron conductive powders are formed from non-metals, that may also be metallic plated, or from metals, that may also be metallic plated, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 产生导电负载树脂基材料的可成形胶囊（10）。 可成型胶囊包括由树脂基材料（14）径向包围的导电元件芯（18）。 导电负载树脂基材料包括微米导电粉末，导电纤维或基础树脂主体中的导电粉末和导电纤维的组合。 在另一个实施方案中，导电元件芯包括可塑胶囊的总重量的约20％至约50％，在另一个实施方案中为约20％至约40％，在另一实施方案中为约25％至约35％，以及 约30％。 微米导电粉末由非金属形成，其也可以是金属镀层，也可以是金属，也可以是金属镀，或由非金属，电镀或与金属粉末组合的组合形成。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    RESISTIVE HEATING USING POLYANILINE FIBER
    2.
    发明申请
    RESISTIVE HEATING USING POLYANILINE FIBER 审中-公开
    使用聚氨酯纤维的电阻加热

    公开(公告)号：WO2004051672A3

    公开(公告)日：2004-10-28

    申请号：PCT/US0338407

    申请日：2003-12-02

    Applicant: SANTA FE SCIENCE AND TECHNOLOG

    Inventor： QI BAOHUA ,  MATTES BENJAMIN R

    IPC: D01F6/76 ,  D01F11/08 ,  H01B20060101 ,  H01B1/12 ,  H05B3/14 ,  H05B3/34

    CPC classification number: H01B1/128 ,  D01F6/76 ,  D01F11/08 ,  H05B3/146 ,  H05B3/342 ,  H05B2203/013 ,  H05B2203/014 ,  H05B2203/017 ,  H05B2203/036 ,  Y10T428/31786

    Abstract: The use of conductive polyaniline fibers for resistive heating applications is described. Unlike metal wires and conductive-polymer coated fibers, under certain conditions, electric voltages or currents used to generate heat in the fibers were found to produce irreversible changes to the polymer backbone that destroy its electrical conductivity but not its structural integrity. The temperature that these changes occur varies with dopant and fiber diameter, and can be tailored to specific applications. Since these changes occur at lower temperatures than the temperature at which dopant molecules within the conductive polymer are lost or decomposed, both of which lower the conductivity of the material, polyaniline fibers can be used for resistive heating applications where the heating element is in the vicinity of the skin of the wearer thereof.

    Abstract translation: 描述了使用导电聚苯胺纤维进行电阻加热应用。 不同于金属丝和导电聚合物涂覆的纤维，在某些条件下，发现用于在纤维中产生热量的电压或电流对聚合物主链产生不可逆的变化，破坏其导电性而不是其结构完整性。 这些变化的温度随掺杂剂和纤维直径而变化，并且可以针对特定应用而定制。 由于这些变化发生在比导电聚合物中的掺杂剂分子丢失或分解的温度低的温度下，这两者都降低了材料的导电性，所以聚苯胺纤维可用于加热元件附近的电阻加热应用 的穿着者的皮肤。

    TWISTING WIRE ACTUATOR
    3.
    发明申请
    TWISTING WIRE ACTUATOR 审中-公开
    电动执行机构

    公开(公告)号：WO2005041211A3

    公开(公告)日：2006-04-20

    申请号：PCT/IL2004000967

    申请日：2004-10-24

    Applicant: TECHNION RES & DEV FOUNDATION ,  SHOHAM MOSHE

    Inventor： SHOHAM MOSHE

    IPC: H01B20060101 ,  G05B19/40

    CPC classification number: G05B19/19 ,  B25J9/104 ,  B25J9/126 ,  F16H19/0654 ,  G05B2219/41251

    Abstract: A twisted wire actuator, whereby the shortening of the length of a wire or a bundle of wires (20,21,22), as it is twisted, is used to control the motion of an actuated element, achieving sub-micron motion resolution. The control can be performed robotically. The high resolution can be achieved without the use of gears, sliders, or high precision lead screws, thus enabling a simplified actuation system and eliminating sources of friction. The use of wires (20,21,22) operating in opposing directions and having oppositely directed rotations significantly reduces the non-linearity effect inherent in twisted wire actuation, resulting in a system having a good level of motion linearity as a function of control input impulse. The use of multiple twisted wires (20,21,22) attached to the actuated element at different angles, enables the implementation of robotic systems with multiple degrees of freedom. Several experimental actuators verify these results.

    Abstract translation: 扭绞线致动器由此被扭曲的线或线束（20,21,22）的长度的缩短用于控制致动元件的运动，实现亚微米的运动分辨率。 控制可以机器人执行。 可以在不使用齿轮，滑块或高精度导螺杆的情况下实现高分辨率，从而实现简化的致动系统并消除摩擦源。 使用在相反方向上操作并且具有相反方向旋转的电线（20,21,22）显着地减少了扭绞线致动中固有的非线性效应，导致系统具有作为控制输入的函数的良好的运动线性度 冲动。 使用以不同角度附接到致动元件的多根绞合线（20,21,22），能够实现具有多个自由度的机器人系统。 几个实验执行器验证这些结果。

    VERY LOW RESISTANCE ELECTRICAL INTERFACES TO CONDUCTIVE LOADED RESIN-BASED MATERIALS
    7.
    发明申请
    VERY LOW RESISTANCE ELECTRICAL INTERFACES TO CONDUCTIVE LOADED RESIN-BASED MATERIALS 审中-公开
    对导电负载树脂材料的极低电阻接触

    公开(公告)号：WO2005022556A3

    公开(公告)日：2006-01-26

    申请号：PCT/US2004028370

    申请日：2004-08-31

    Applicant: INTEGRAL TECHNOLOGIES INC ,  AISENBREY THOMAS

    Inventor： AISENBREY THOMAS

    IPC: C09K5/14 ,  H01B20060101 ,  H01Q1/40 ,  H01R13/03 ,  H01R43/24

    CPC classification number: H01R13/03 ,  C09K5/14 ,  H01R43/24 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49171 ,  Y10T29/49174

    Abstract: Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

    Abstract translation: 电接口形成为导电负载的树脂基材料。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。

    APPARATUS FOR CONSECUTIVE DEPOSITION OF HIGH-TEMPERATURE SUPERCONDUCTING (HTS) BUFFER LAYERS
    8.
    发明申请
    APPARATUS FOR CONSECUTIVE DEPOSITION OF HIGH-TEMPERATURE SUPERCONDUCTING (HTS) BUFFER LAYERS 审中-公开
    用于连续沉积高温超导（HTS）缓冲层的装置

    公开(公告)号：WO2005006350A3

    公开(公告)日：2005-04-07

    申请号：PCT/US2004016632

    申请日：2004-05-25

    Applicant: SUPERPOWER INC

    Inventor： SELVAMANICKAM VENKAT ,  SATHIRAJU SRINIVAS

    IPC: B05D5/12 ,  C23C14/00 ,  C23C14/32 ,  C23C14/34 ,  C23C14/56 ,  C23C16/00 ,  C25B9/00 ,  C25B11/00 ,  C25B13/00 ,  H01B20060101 ,  H01L39/24

    CPC classification number: H01L39/2461 ,  C23C14/562

    Abstract: The present invention is a deposition system for the production of coated substrates that provides a first deposition process that subsequently feeds a second deposition process and where the two deposition processes are occurring concurrently. The consecutive deposition system includes two dynamically isolated deposition chambers. The substrate is helically wrapped about a cooling block within the first deposition chamber such that the tape is exposed to a deposition zone a number of times sufficient to correspond to the desired film thickness. A shielding element may be included in the second deposition chamber to limit the size of the second chamber deposition zone and thus the film thickness of the second coating layer.

    Abstract translation: 本发明是一种用于生产涂覆基底的沉积系统，其提供第一沉积过程，该第一沉积过程随后供给第二沉积过程并且其中两个沉积过程同时发生。 连续沉积系统包括两个动态隔离的沉积室。 衬底围绕第一沉积室内的冷却块螺旋缠绕，使得带暴露于沉积区多次，足以对应于期望的膜厚度。 屏蔽元件可以被包括在第二沉积室中以限制第二室沉积区的尺寸并因此限制第二涂层的膜厚度。

    CONTACT ELEMENT
    9.
    发明申请
    CONTACT ELEMENT 审中-公开
    接触元

    公开(公告)号：WO0011679A3

    公开(公告)日：2000-08-10

    申请号：PCT/DE9902187

    申请日：1999-07-13

    Applicant: ATOTECH DEUTSCHLAND GMBH ,  LANGHEINRICH PETER

    Inventor： LANGHEINRICH PETER

    IPC: C25D7/00 ,  C25D17/00 ,  C25D17/06 ,  C25D17/08 ,  C25D17/12 ,  H01B20060101 ,  H05K3/18 ,  H05K3/24

    CPC classification number: C25D7/00 ,  C25D7/0614 ,  C25D17/00 ,  C25D17/06 ,  C25D17/08 ,  C25D17/12 ,  H01B1/00 ,  H05K3/18 ,  H05K3/24

    Abstract: It is difficult to transmit large processing current on the surfaces of printed circuit boards (L) using clamp-type contact organs ( 6, 7). In order to solve said problem, contact elements (15, 16) having one or more contact surfaces (26) are disposed on the contact organs (6, 7). The shape of the contact surfaces (26) are configured in such a way that no damages occur in the areas of the conductive surfaces adjacent to the contact surfaces (26) when large currents are transmitted from the contact elements (15, 16) printed on the electrically conductive surface of printed board material (L) on the contact surfaces to the conductive surface.

    Abstract translation: 用钳状Kontaktierungsorganen（6,7）是一个大的治疗用电流，以印刷电路板（L）的困难表面的传输。 为了解决这个问题是Kontaktierungsorganen（6,7），其布置（15,16）所述的接触元件，其具有一个或几个的接触表面（26）。 的接触表面的形状（26）在接触面设计成使得在高电流的传输中由上键合焊盘的印刷电路板材料（L）的接触元件（15，16）的导电表面上表达（导电表面上 26）在导电表面的相邻区域不被损坏。

    EPITAXIAL THIN FILMS
    10.
    发明申请
    EPITAXIAL THIN FILMS 审中-公开
    外来薄膜

    公开(公告)号：WO00042621A3

    公开(公告)日：2001-08-02

    申请号：PCT/US2000/000824

    申请日：2000-01-12

    IPC: C30B29/22 ,  B01D71/02 ,  H01B20060101 ,  H01B1/00 ,  H01G4/06 ,  H01G4/33 ,  H01L21/20 ,  H01L39/24 ,  H01L49/02 ,  H01M8/02

    CPC classification number: H01L39/2461

    Abstract: Epitaxial thin films for use as buffer layers for high temperature superconductors, electrolytes in solid oxide fuel cells (SOFC), gas separation membranes or dielectric material in electronic devices, are disclosed. By using CCVD, CACVD or any other suitable deposition process, epitaxial films having pore-free, ideal grain boundaries, and dense structure can be formed. Several different types of materials are disclosed for use as buffer layers in high temperature superconductors. In addition, the use of epitaxial thin films for electrolytes and electrode formation in SOFCs results in densification for pore-free and ideal grain boundary/interface microstructure. Gas separation membranes for the production of oxygen and hydrogen are also disclosed. These semipermeable membranes are formed by high-quality, dense, gas-tight, pinhole free sub-micro scale layers of mixed-conducting oxides on porous ceramic substrates. Epitaxial thin films as dielectric material in capacitors are also taught herein. Capacitors are utilized according to their capacitance values which are dependent on their physical structure and dielectric permittivity. The epitaxial thin films of the current invention form low-loss dielectric layers with extremely high permittivity. This high permittivity allows for the formation of capacitors that can have their capacitance adjusted by applying a DC bias between their electrodes.

    Abstract translation: 公开了用作高温超导体的缓冲层的外延薄膜，固体氧化物燃料电池（SOFC）中的电解质，电子装置中的气体分离膜或介电材料。 通过使用CCVD，CACVD或任何其它合适的沉积工艺，可以形成具有无孔，理想晶界和致密结构的外延膜。 公开了几种不同类型的材料用作高温超导体中的缓冲层。 此外，在SOFC中使用电解质外延薄膜和电极形成导致无孔和理想的晶界/界面微观结构的致密化。 还公开了用于生产氧气和氢气的气体分离膜。 这些半透膜由多孔陶瓷基板上的高质量，致密，气密，无针孔的微小尺度的混合导电氧化物层形成。 本文还介绍了作为电容器中的介电材料的外延薄膜。 根据电容值的物理结构和介电常数可以使用电容器。 本发明的外延薄膜形成具有极高介电常数的低损耗介电层。 这种高介电常数允许形成可以通过在它们的电极之间施加直流偏压来调整其电容的电容器。

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