公开(公告)号：WO1993009882A1

公开(公告)日：1993-05-27

申请号：PCT/US1992009825

申请日：1992-11-10

Applicant: ELECTROMER CORPORATION

Inventor： ELECTROMER CORPORATION ,  SHRIER, Karen, P. ,  CHILDERS, Richard, K. ,  BUNCH, John, H.

IPC: B05D05/12

CPC classification number: C09D5/24 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24

Abstract: A nonlinear transient overvoltage protection coating material and process for coating are disclosed herein. The viscous paintable material (11) is for overvoltage protection and/or for use in detecting pressure externally applied to the material. A binder substance is combined with the conductive particles and a solvent.

公开(公告)号：WO1993006943A1

公开(公告)日：1993-04-15

申请号：PCT/US1992008333

申请日：1992-10-01

Applicant: TORANAGA TECHNOLOGIES, INC.

Inventor： TORANAGA TECHNOLOGIES, INC. ,  CAPOTE, Miguel, Albert ,  TODD, Michael, George ,  MANESIS, Nicholas, John ,  CRAIG, Hugh, P.

IPC: B05D05/12

CPC classification number: B22F3/1035 ,  B23K35/0222 ,  B23K35/36 ,  H01B1/22 ,  H01L23/49827 ,  H01L23/49883 ,  H01L23/5384 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K1/095 ,  H05K1/181 ,  H05K3/1216 ,  H05K3/321 ,  H05K3/3489 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4664 ,  H05K2201/0272 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1105

Abstract: Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Depending upon the intended end use, the compositions comprise three or more of the following: a relatively high melting metal powder; solder powder; the active cross-linking agent which also serves as a fluxing agent; a resin; and a reactive monomer or polymer. The compositions are useful as improved conductive adhesives, such as for attaching electrical components to electrical circuits; the compositions comprising metal powder are ideally suited for creating the conductive paths on printed circuits. The compositions for forming conductive paths may first be applied to a substrate in the desired pattern of an electrical circuit, and then heated to cure it. During heating, the action of the cross-linking agent and optional reactive monomer or polymer within the mixture fluxes the metals, enabling sintering to occur between the metal powder and the solder powder.

Abstract translation: 导电粘合剂组合物及其制备和使用方法，其中焊剂粉末，具有助熔性能的化学保护的交联剂和反应性单体或聚合物是主要组分。 根据预期的最终用途，组合物包含以下三种或更多种：相对较高的熔融金属粉末; 焊粉; 也用作助熔剂的活性交联剂; 树脂; 和反应性单体或聚合物。 组合物可用作改进的导电粘合剂，例如用于将电组件附着到电路上; 包含金属粉末的组合物理想地适用于在印刷电路上形成导电路径。 用于形成导电路径的组合物可以首先以电路的所需图案施加到基底，然后加热以使其固化。 在加热过程中，交联剂和任选的反应性单体或聚合物在混合物内的作用使金属熔化，使金属粉末和焊料粉末之间发生烧结。

公开(公告)号：WO1993003861A1

公开(公告)日：1993-03-04

申请号：PCT/US1992006758

申请日：1992-08-08

Applicant: ENSCI, INC. ,  CLOUGH, Thomas, J. ,  GROVESNOR, Victor, L. ,  PINSKY, Naum

Inventor： ENSCI, INC.

IPC: B05D05/12

CPC classification number: B05D5/12 ,  C04B41/5027 ,  C04B41/5072 ,  C04B2111/94 ,  D01F11/123 ,  G11B5/133 ,  G11B5/8404 ,  G11B5/858 ,  H01B1/08 ,  H01F1/36 ,  C04B41/4523 ,  C04B41/4545 ,  C04B41/455 ,  C04B41/51

Abstract: Processes for coating three dimensional inorganic substrates, with shielded surfaces, with transition metal oxide-containing coatings are disclosed. Such processes comprise contacting a substrate with a transition metal oxide precursor, preferably maintaining the precursor coated substrate at conditions to equilibrate the coating, and then oxidizing the precursor to form a substrate containing transition metal oxide on at least a portion of the three dimensions and shielded surfaces of the substrate. Also disclosed are substrates coated with transition metal oxide-containing coatings for use in various applications including catalysis, shielding, heating and electro rheological applications using elements such as inorganic, fluid, porous and polymer matrix elements.

Abstract translation: 公开了用含有过渡金属氧化物的涂层涂覆具有屏蔽表面的三维无机基材的方法。 这样的方法包括使基底与过渡金属氧化物前体接触，优选地将前体涂覆的基底保持在使涂层平衡的条件下，然后氧化前体以在三维的至少一部分上形成含有过渡金属氧化物的基底并屏蔽 基板的表面。 还公开了涂覆有过渡金属氧化物的涂层的基材，其用于各种应用，包括使用诸如无机，流体，多孔和聚合物基质元素的元素的催化，屏蔽，加热和电流变应用。

公开(公告)号：WO1989010209A1

公开(公告)日：1989-11-02

申请号：PCT/US1989001290

申请日：1989-04-03

Applicant: GORDON, Roy, G.

IPC: B05D05/12

CPC classification number: C03C17/22 ,  C03C17/3435 ,  C03C17/3482 ,  C03C2217/282 ,  C03C2218/152 ,  Y10T428/2495 ,  Y10T428/265

Abstract: Transparent glass windows (88) comprising thereon titanium silicide (TiSi2) (82) as the principal solar screening layer for reducing transmission of near infrared and visible radiation. In some embodiments, a protective layer (84) of silicon or metal oxide, about 300 angstroms thick, is placed thereover. The protective layer serves to protect the silicide from oxidation during high-temperature processing procedures and increases the abrasion-resistance of the window product. The particular importance of titanium silicide film (82) is that it allows production of a window that is neutral in color when viewed in transmission as well as in reflection. Thus, one is able to provide a durable, pyrolytic, high-performance, color-neutral, solar-shielding window product.

公开(公告)号：WO1989004219A1

公开(公告)日：1989-05-18

申请号：PCT/US1988003867

申请日：1988-10-28

Applicant: REGENTS OF THE UNIVERSITY OF MINNESOTA

Inventor： REGENTS OF THE UNIVERSITY OF MINNESOTA ,  FRANCIOSI, Alfonso ,  PETERMAN, Douglas, J.

IPC: B05D05/12

CPC classification number: H01L29/45 ,  H01L21/443 ,  H01L31/0224 ,  H01L31/02966

Abstract: A method of stabilizing metal contacts on a body of a mercury-cadmium-telluride alloy comprising depositing a layer of a rare earth element such as samarium or ytterbium on the surface of the alloy prior to depositing an overlayer of a contact metal such as aluminum on the layer of the rare earth element.

公开(公告)号：WO1988009701A1

公开(公告)日：1988-12-15

申请号：PCT/US1988002023

申请日：1988-06-08

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： E.I. DU PONT DE NEMOURS AND COMPANY ,  BOLT, John, Davis ,  SUBRAMANIAN, Munirpallam, Appadorai

IPC: B05D05/12

CPC classification number: C01G3/006 ,  C01P2002/72 ,  C04B35/4508 ,  C04B35/6365 ,  H01L39/2419 ,  Y10S264/25 ,  Y10S264/36

Abstract: There is disclosed an improved process for preparing a superconducting composition having the formula MBa2Cu3Ox wherein M is selected from the group consisting of Y, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb and Lu; x is from about 6.5 to about 7.0; said composition having a superconducting transition temperature of about 90 K; said process consisting essentially of preparing a precursor solution, drying the solution to obtain a solid material, and heating and cooling the solid material under specified conditions to obtain the desired product. In another embodiment, a shaped superconducting MBa2Cu3Ox article is prepared by impregnating an article of cellulose material with the precursor solution, drying the impregnated article, and heating and cooling the impregnated article under prescribed conditions to obtain the desired product.

Abstract translation: 改进的制备具有式MBa2Cu3Ox其中M是从由Y，钕，钐，铕，钆，镝，钬，铒，铥，Yb和Lu组成的组中的超导组合物的方法; x在约6.5至约7.0的范围内，所述组合物具有约90L的超导转变温度。该方法基本上由以下步骤组成：制备初步溶液，干燥溶液以获得固体材料， 并在特定条件下加热和冷却固体以获得所需产物。 在另一个实施方案中，制备MBa2Cu3Ox浸渍纤维素材料制品与初步溶液，干燥浸渍物品，通过加热和冷却在规定条件下浸渍的制品形成的超导制品 获得所需的产品。

公开(公告)号：WO1988008338A1

公开(公告)日：1988-11-03

申请号：PCT/US1988000892

申请日：1988-03-21

Applicant: ARCH DEVELOPMENT CORP.

Inventor： ARCH DEVELOPMENT CORP. ,  GRUEN, Dieter, M.

IPC: B05D05/12

CPC classification number: H01L39/248 ,  C04B35/4504 ,  C04B35/65 ,  C23C8/10 ,  C30B19/00 ,  C30B29/22 ,  C30B29/225 ,  H01L39/126 ,  H01L39/2422

Abstract: A method of preparing a selected device geometry (10) of a superconducting compound. A high critical temperature superconducting compound is prepared from a starting metal composition (14) which is formed in a predetermined base geometry (16) and then subjected to an oxidation reaction to generate the superconducting compound (23) in the final selected device geometry.

Abstract translation: 一种制备超导化合物的所选器件几何形状（10）的方法。 由初始金属组合物（14）制备高临界温度超导化合物，所述起始金属组合物（14）以预定的基本几何形状（16）形成，然后进行氧化反应以在最终选定的器件几何形状中产生超导化合物（23）。

公开(公告)号：WO1988003443A1

公开(公告)日：1988-05-19

申请号：PCT/US1987002289

申请日：1987-09-10

Applicant: MACDERMID, INCORPORATED

Inventor： MACDERMID, INCORPORATED ,  RUSZCZYK, Stanley, J. ,  FERRIER, Donald, R. ,  LARSON, Gary, B. ,  GALLEGOS, Daniel ,  CASTALDI, Steven, A.

IPC: B05D05/12

CPC classification number: H05K3/181 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10S428/901

Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

公开(公告)号：WO1987005541A1

公开(公告)日：1987-09-24

申请号：PCT/US1987000561

申请日：1987-03-11

Applicant: POLYMETRICS CORPORATION

Inventor： POLYMETRICS CORPORATION ,  FRISCH, Kurt, C. ,  ASHIDA, Kaneyoshi

IPC: B05D05/12

CPC classification number: C08J9/0085 ,  C08G18/092 ,  C08G18/4009 ,  C08G18/4018 ,  C08G2101/0025 ,  C08G2101/0066 ,  C08J9/0066 ,  C08J2375/04 ,  E04C2/205 ,  Y10T428/24074 ,  Y10T428/249946 ,  Y10T428/249989

Abstract: A polyurethane foam of the rigid type having three different types of polyol components capable of having suspended therein fillers and reinforcing fibers. The foam is made into boards and the like and has continuous fiber glass strands or yarn disposed longitudinally in or adjacent the surface skin of the foam. The strands or yarn are parallel and close together and are flattened out in the foam-forming process so that the surfaces have a continuous fiber glass implant longitudinally and substantially so transversely.

Abstract translation: 具有三种不同类型的能够悬浮在填料和增强纤维中的多元醇组分的刚性型聚氨酯泡沫。 泡沫制成板等，并且具有连续的玻璃纤维束或在纵向上布置在泡沫的表面表面上的纱线。 股线或纱线平行并靠近在一起，并且在泡沫形成过程中被平坦化，使得表面具有纵向和基本如此横向的连续的玻璃纤维植入物。