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    DIRECT RESISTANCE HEATING METHOD
    52.
    发明申请
    DIRECT RESISTANCE HEATING METHOD 审中-公开
    直接加热方法

    公开(公告)号：WO2014025054A1

    公开(公告)日：2014-02-13

    申请号：PCT/JP2013/071749

    申请日：2013-08-06

    Applicant: NETUREN CO., LTD.

    Inventor： OOYAMA, Hironori ,  KOBAYASHI, Kunihiro

    IPC: C21D9/00 ,  C21D9/50 ,  C21D1/40 ,  H05B3/00 ,  H05B3/02

    CPC classification number: H05B3/0004 ,  C21D1/40 ,  C21D1/673 ,  C21D9/0012 ,  C21D9/0068 ,  C21D9/46 ,  C21D9/50 ,  H05B3/0023 ,  H05B3/023 ,  H05B3/03

    Abstract: A direct resistance heating method includes placing a first electrode and a second electrode such that a space is provided between the first electrode and the second electrode and such that each of the first electrode and the second electrode extends across a heating target region of a workpiece, moving at least one of the first electrode and the second electrode with an electric current being applied between the first electrode and the second electrode, and adjusting a time during which the electric current is applied for each segment region of the heating target region, the segment regions being defined by dividing the heating target region and are arranged side by side along a direction in which the at least one of the first electrode and the second electrode is moved.

    Abstract translation: 直接电阻加热方法包括放置第一电极和第二电极，使得在第一电极和第二电极之间设置空间，并且使得第一电极和第二电极中的每一个延伸穿过工件的加热目标区域， 以施加在第一电极和第二电极之间的电流移动第一电极和第二电极中的至少一个，并且调节对加热目标区域的每个区段施加电流的时间，段 区域通过分割加热目标区域而限定，并且沿着第一电极和第二电极中的至少一个移动的方向并排布置。

    DIRECT RESISTANCE HEATING METHOD
    54.
    发明申请
    DIRECT RESISTANCE HEATING METHOD 审中-公开
    直接加热方法

    公开(公告)号：WO2014010712A1

    公开(公告)日：2014-01-16

    申请号：PCT/JP2013/069076

    申请日：2013-07-05

    Applicant: NETUREN CO., LTD.

    Inventor： OOYAMA, Hironori ,  KOBAYASHI, Kunihiro

    IPC: C21D9/00 ,  C21D1/40 ,  H05B3/00 ,  F27D11/04

    CPC classification number: H05B3/023 ,  C21D1/40 ,  C21D9/0068 ,  H05B3/0095 ,  H05B3/03

    Abstract: A direct resistance heating method includes placing a first electrode and a second electrode on a plate-shaped workpiece such that the first electrodes and the second electrode extend across the workpiece in a direction substantially perpendicular to a center line of a heating target region of the workpiece, the center line connecting a middle portion of one side of the heating target region and a middle portion of the other side of the heating target region; and moving at least one of the first electrode and the second electrode along the center line while applying electric current between the first electrode and the second electrode.

    Abstract translation: 直接电阻加热方法包括将第一电极和第二电极放置在板状工件上，使得第一电极和第二电极沿着大致垂直于工件的加热目标区域的中心线的方向跨过工件延伸 连接加热对象区域的一侧的中间部分和加热对象区域的另一侧的中间部分的中心线; 以及沿所述中心线移动所述第一电极和所述第二电极中的至少一个，同时在所述第一电极和所述第二电极之间施加电流。

    CURRENT APPLYING APPARATUS, CURRENT APPLYING METHOD AND DIRECT RESISTANCE HEATING APPARATUS
    55.
    发明申请
    CURRENT APPLYING APPARATUS, CURRENT APPLYING METHOD AND DIRECT RESISTANCE HEATING APPARATUS 审中-公开
    当前应用设备，当前应用方法和直接加热设备

    公开(公告)号：WO2013180313A1

    公开(公告)日：2013-12-05

    申请号：PCT/JP2013/065769

    申请日：2013-05-31

    Applicant: NETUREN CO., LTD.

    Inventor： OOYAMA, Hironori ,  KOBAYASHI, Kunihiro

    IPC: C21D1/40 ,  H05B3/00 ,  H05B3/02 ,  H05B3/03

    CPC classification number: H05B3/03 ,  C21D1/40 ,  C21D9/0012 ,  C21D9/0068 ,  C21D9/46 ,  H05B3/0004 ,  H05B3/023

    Abstract: A current applying apparatus includes a pair of electrodes configured to contact a workpiece to apply an electric current to the workpiece, and a bus bar arranged to extend along the workpiece. At least one of the electrodes includes a moving electrode configured to move relative to the bus bar and the workpiece such that an electric current flows between the bus bar and the workpiece through the moving electrode, the moving electrode being connected to the bus bar so as to be movable relative to the bus bar, and the moving electrode being configured to contact the workpiece so as to be movable relative to the workpiece.

    Abstract translation: 电流施加装置包括配置成接触工件以对工件施加电流的一对电极和布置成沿着工件延伸的母线。 所述电极中的至少一个包括被配置为相对于母线和工件移动的移动电极，使得电流通过移动电极在母线和工件之间流动，移动电极连接到母线，以便 能够相对于母线移动，并且所述移动电极构造成与所述工件接触以相对于所述工件移动。

    PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    56.
    发明申请
    PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE 审中-公开
    图案形成方法，抗紫外线敏感性或辐射敏感性树脂组合物，电阻膜，制造电子器件的方法和电子器件

    公开(公告)号：WO2013122264A1

    公开(公告)日：2013-08-22

    申请号：PCT/JP2013/054424

    申请日：2013-02-15

    Applicant: FUJIFILM CORPORATION

    Inventor： YAMAMOTO, Kei ,  TAKAHASHI, Hidenori ,  YAMAGUCHI, Shuhei ,  ITO, Junichi

    IPC: G03F7/038 ,  G03F7/004 ,  G03F7/32 ,  H01L21/027

    CPC classification number: G03F7/0388 ,  G03F7/0048 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/325 ,  G03F7/40

    Abstract: There is provided a pattern forming method, including: (a) forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin capable of increasing polarity by an action of an acid to decrease solubility in an organic solvent-containing developer, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin, which contains substantially no fluorine atom and silicon atom and is other than the resin (A), (b) exposing the film; and (c) performing development using the organic solvent-containing developer to form a negative type pattern, wherein a receding contact angle of water on the film formed by (a) is 70C or more.

    Abstract translation: 提供了一种图案形成方法，其包括：（a）通过光化射线敏感或辐射敏感性树脂组合物形成膜，所述树脂组合物包含：（A）能够通过酸的作用增加极性的树脂，以降低溶解度 含有有机溶剂的显影剂，（B）能够以光化射线或辐射照射后能够产生酸的化合物，（C）溶剂，（D）基本上不含氟原子和硅原子的树脂， 比树脂（A），（b）曝光该膜; 和（c）使用含有机溶剂的显影剂进行显影以形成负型图案，其中由（a）形成的膜上的水的后退接触角为70℃以上。

    ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
    57.
    发明申请
    ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE 审中-公开
    丙烯酸类敏感性或辐射敏感性树脂组合物，使用其的耐腐蚀膜，图案形成方法，电子器件和电子器件的制造方法

    公开(公告)号：WO2013115345A1

    公开(公告)日：2013-08-08

    申请号：PCT/JP2013/052296

    申请日：2013-01-25

    Applicant: FUJIFILM CORPORATION

    Inventor： YAMAGUCHI, Shuhei ,  TAKAHASHI, Hidenori ,  ITO, Junichi ,  YAMAMOTO, Kei

    IPC: G03F7/039 ,  C08F220/10 ,  G03F7/004 ,  G03F7/038 ,  G03F7/32 ,  H01L21/027

    CPC classification number: G03F7/0388 ,  C08F220/18 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2041 ,  G03F7/325

    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive resin composition, having: (A) a resin having a repeating unit represented by formula (I); (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a resin having at least one repeating unit (x) out of a repeating unit represented by formula (II) and a repeating unit represented by formula (III) and containing substantially neither fluorine atom nor silicon atom, wherein the content of the repeating unit (x) is 90% or more by mole based on all repeating units in the resin (C): wherein Xa represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, each of R 1a , R 1b and R 1c independently represents an alkyl group or a cycloalkyl group, two members of R 1a , R 1b and R 1c may combine to form a ring structure, X b1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, R 2 represents an organic group having one or more CH 3 partial structures and being stable to acid, X b2 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, R 3 represents an organic group having one or more CH 3 partial structures and being stable to acid, and n represents an integer of 1 to 5.

    Abstract translation: 提供了一种光化射线敏感或辐射敏感性树脂组合物，其具有：（A）具有由式（I）表示的重复单元的树脂; （B）能够在用光化射线或辐射照射时能产生酸的化合物; 和（C）具有由式（II）表示的重复单元中的至少一个重复单元（x）和基本上不包含氟原子或硅原子的式（III）表示的重复单元的树脂，其中， 重复单元（x）基于树脂（C）中的所有重复单元为90％或更多摩尔：其中Xa表示氢原子，烷基，氰基或卤素原子，R1a，R1b和 R1c独立地表示烷基或环烷基，R1a，R1b和R1c的两个成员可以结合形成环结构，Xb1表示氢原子，烷基，氰基或卤素原子，R2表示有机基团 具有一个或多个CH3部分结构并且对酸稳定，Xb2表示氢原子，烷基，氰基或卤素原子，R3表示具有一个或多个CH3部分结构并且对酸稳定的有机基团，以及 n表示1〜5的整数。

    HYDROPHILIC MEMBER AND FORMING METHOD OF THE SAME
    58.
    发明申请
    HYDROPHILIC MEMBER AND FORMING METHOD OF THE SAME 审中-公开
    亲水成员及其形成方法

    公开(公告)号：WO2013039252A1

    公开(公告)日：2013-03-21

    申请号：PCT/JP2012/073962

    申请日：2012-09-12

    Applicant: FUJIFILM CORPORATION ,  KASAI, Seishi

    Inventor： KASAI, Seishi

    IPC: B32B27/00 ,  B05D1/26 ,  B05D5/00 ,  B05D7/24 ,  B32B27/40 ,  C08L101/00 ,  C08L101/10 ,  C09D7/12 ,  C09D143/04 ,  C09D175/04 ,  C09D175/14 ,  C09D201/10 ,  C09K3/00

    CPC classification number: C09D11/40 ,  B05D1/26 ,  B05D1/34 ,  B05D5/00 ,  B05D2490/50 ,  C08G18/672 ,  C09D11/101

    Abstract: A hydrophilic member includes a base material; and a layer containing a hydrophilic material (1) and an oligomer or polymer (2), the layer is a composition gradient layer in which a composition of (1) and (2) continuously changes in a thickness direction of the layer in such a manner that a ratio of (1) becomes large, whereas a ratio of (2) becomes small, from the nearest side to the base material toward the farthest side to the base material, the hydrophilic material (1) is a hydrophilic material containing a hydrolyzable silyl group-containing hydrophilic polymer, the polymer having at least one hydrolyzable silyl group represented by the formula (a) as defined herein at a main chain end or side chain of a molecule thereof and having at least one hydrophilic group in the molecule, and the oligomer or polymer (2) is different from the hydrophilic polymer (1).

    Abstract translation: 亲水构件包括基材; 和含有亲水性材料（1）和低聚物或聚合物（2）的层，该层是组合物梯度层，其中（1）和（2）的组成在层的厚度方向上连续变化 （1）的比例变大，而从最近侧到基材向最远侧到基材的比例（2）变小，亲水性材料（1）是含有 含有水解性甲硅烷基的亲水性聚合物，所述聚合物在分子的主链末端或侧链上具有如本文定义的式（a）表示的至少一个可水解甲硅烷基，并且在分子中具有至少一个亲水基团， 并且低聚物或聚合物（2）不同于亲水性聚合物（1）。

    COLORED COMPOSITION, METHOD OF PRODUCING COLOR FILTER USING THE SAME, COLOR FILTER AND SOLID-STATE IMAGING DEVICE
    59.
    发明申请
    COLORED COMPOSITION, METHOD OF PRODUCING COLOR FILTER USING THE SAME, COLOR FILTER AND SOLID-STATE IMAGING DEVICE 审中-公开
    彩色组合物，使用其的彩色滤光片的制造方法，彩色滤光片和固态成像装置

    公开(公告)号：WO2013032034A1

    公开(公告)日：2013-03-07

    申请号：PCT/JP2012/072827

    申请日：2012-08-31

    Applicant: FUJIFILM Corporation ,  MURO, Naotsugu ,  SUGISHIMA, Yasuo ,  AOYAGI, Kaoru ,  YOSHIBAYASHI, Mitsuji

    Inventor： MURO, Naotsugu ,  SUGISHIMA, Yasuo ,  AOYAGI, Kaoru ,  YOSHIBAYASHI, Mitsuji

    IPC: G02B5/20 ,  H01L27/14

    CPC classification number: G02B5/22 ,  G02B3/0006 ,  G02B5/201 ,  G02B13/0085 ,  H01L27/14621 ,  H01L27/14645 ,  H01L27/14685

    Abstract: The invention is directed to a colored composition for forming a green color filter, containing a color pigment, wherein a content of the color pigment to a total solid content of the colored composition is 60% by weight or more, and a layer having a thickness of 0.6 µm formed from the colored composition has light transmittance of 80% or more at a wavelength of 550 nm and light transmittance of 50% or less at a wavelength of 450 nm, and a method of producing a color filter including (A) forming a first colored layer containing a first colored composition and (B) patterning with dry etching so as to from a through-hole group in the first colored layer, wherein the first colored composition is the colored composition as defined herein.

    Abstract translation: 本发明涉及一种用于形成含有彩色颜料的绿色滤色器的着色组合物，其中着色组合物的总固体含量为彩色颜料的含量为60重量％以上，并且具有厚度 由着色组合物形成的0.6μm的波长在550nm的波长下的透光率为80％以上，波长450nm的透光率为50％以下，以及包括（A）成膜 含有第一着色组合物的第一着色层和（B）通过干法蚀刻从第一着色层中的通孔基团构图，其中第一着色组合物是如本文所定义的着色组合物。

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