Abstract:
A large-sized foam-molded item of an olefinic synthetic resin, characterized in that the said item is formed in a mold, has a thickness of 150 mm or thereabove, a fusion rate of 50 % or thereabove and a density distribution of 10 % or therebelow. The foam-molded item according to the present invention can be obtained in such a manner that prefoamed particles are filled in a mold, and thereafter, a specific preheating process and a process of settling the particles by their heat are introduced. According to the present invention, the large-sized foam-molded item of olefin resin having a thickness of 500 mm or thereabove can be obtained.
Abstract:
A process for producing (-)-substituted styrene oxide efficiently, which comprises reducing 2-bromo-1-(3'-chlorophenyl)ethanone asymmetrically into (-)-2-bromo-1-(3'-chlorophenyl)ethanol in the presence of a microorganism belonging to any of the 11 genera including Ashbya and Brettanomyces, and cyclizing the isolated and purified product under an alkaline condition into (-)-substituted styrene oxide.
Abstract:
A one-liquid type coating composition excellent in shelf stability and workability in coating, which comprises: a hydroxylated acrylic resin; an acrylic copolymer containing an alkoxysilyl group of general formula (I), wherein R1 represents C¿1? to C10 alkyl, R?2¿ represents hydrogen or a monovalent hydrocarbon group selected from among C¿1? to C10 alkyl, aryl and aralkyl, and a is 0.1 or 2; a curing catalyst; and at least one member selected from a dehydrating agent and an alkyl alcohol.
Abstract:
A fabrication method for the semiconductor device of the present invention is characterized by including the step in which patterning of an amorphous silicon type semiconductor layer and/or a back electrode brings a wire mask into substantially close contact with a film formation surface to form an amorphous silicon type semiconductor layer and/or the back electrode and the step in which the thin film extending to a wire portion is removed, whenever necessary. A film formation apparatus of the present invention comprises a main body for housing the substrate, a means for fixing the substrate to the main body and locating the substrate and a plurality of thin wires disposed on the film formation surface side of the substrate and to be brought into substantially close contact with the film formation surface of the substrate. In accordance with the fabrication method for the semiconductor device and the film formation apparatus for said method of the present invention, complete patterning can be made even when an extremely thin film is formed around the wire portion and the production yield can be improved. It is not necessary to make strict adjustment of the wires and complicated steps in ordinary etching processes such as application of a resist, curing of the resist, removal of the resist, and the like, become unnecessary.
Abstract:
A preexpanded polyolefin resin particle which comprises a base resin prepared by incorporating 0.1 to 10 parts by weight of a polymer having carboxyl groups in 100 parts by weight of a polyolefin resin and which has a cell diameter of 200 to 500 mum. Moldings formed by the expansion molding of the preexpanded particles in a mold show a lower shrinkage rate and a smaller deformation, thus showing a good and attractive appearance and being producible in an enhanced yield.
Abstract:
A semiconductor color sensor comprising a semiconductor layer including a lamination of a plurality of pn or pin junctions, the semiconductor layer having an electrically conductive layer on both surfaces thereof. The color sensor is so constituted that the generation of photo-carriers should increase with the increasing distance from the junction of the input side in the whole wavelength range to be measured, and current is detected by changing the voltage between said two electrically conductive layers. The color sensor of the invention features its simplified structure, and it may easily be formed into an integrated circuit and formed with an increased effective area. In addition, the manufacturing process is simplified and the yield is increased, thus decreasing costs.
Abstract:
the invention is related to hydroxystyrene derivatives and salts thereof represented by general formula (I) (wherein R3 and R4 are bound to each other to form -CONH-CS-S-, (II), (III) or (IV) (wherein R6 is (V) (wherein X1 is H, halogen, methyl, ethyl, R7O- (wherein R7 is methyl or ethyl), nitro, aminosulfonyl, or amino and m1 is 1 or 2), pyridyl, furyl or thienyl and n1 is an integer of 0 to 3) when R1 and R2 each represents phenyl, benzyl or phenethyl or when R1 represents R5O- (wherein R5 is H, C1-C5 alkyl or benzyl) and R2 represents benzyl or PhSCH2; R3 represents cyano and R4 represents carbamoyl or they may be bound to each other to form -CO-Y-CH2CH2- (wherein Y is O or -NH) or (VI) when R1 and R2 each represents phenyl, benzyl or phenethyl or R1 represents R5O- (wherein R5 is as defined above) and R2 represents benzyl; or R3 and R4 are bound to each other to form (IV) (wherein n1 and R6 are as defined above) when R1 amd R2 each represents C1-C3 alkyl). They are useful as effective ingredients of anti-allergic agents, 5-lipoxygenase inhibitors, antibacterial agents, tyrosine kinase inhibitors, UV absorbers, and reverse transcriptase inhibitors, and are also useful as intermediates for many organic compounds.
Abstract:
A polyethylene terephthalate resin composition comprising (A) 100 pts. by wt. of a polyethylene terephthalate resin prepared by polymerization using a germanium catalyst and containing at least 80 % of ethylene terephthalate repeating units and (B) 0.05 to 30 pts. by wt. of at least one compound selected from the group consisting of epoxy compounds each having at least two epoxy groups in the molecule and not containing any ester linkage therein and carbodiimide compounds; and another resin composition obtained by adding (C) a fibrous reinforcement, (D) a block copolymer and/or (E) an inorganic nucleating agent to the above resin composition. These resin compositions are excellent in the resistance to moist heat, flow properties, and mechanical strengths. In particular, the addition of the components (D) and (E) enables high-cycle molding even at low mold temperature and makes it possible to provide molded articles having excellent surface properties.
Abstract:
A process for producing 3-(2-thienylthio)butyric acid comprising converting a compound represented by general formula (III), whereby the formation of by-product 3-(3-thienylthio)butyric acid as a positional isomer of the target compound can be reduced to 0.1 % by mole or below, wherein R represents a linear or branched C1-C4 alkyl. The obtained 3-(2-thienylthio)butyric acid is useful as an intermediate of medicinal compounds.
Abstract:
An adsorbent which comprises a styrene/divinylbenzene copolymer having sulfonate groups and is used for endotoxins, tumor necrosis factor- alpha (TNF- alpha or interleukins; a method for removing endotoxins, TNF- alpha or interleukins comprising the step of bringing the adsorbent into contact with a liquid containing endotoxins, TNF- alpha or interleukins; and an adsorber for endotoxins, TNF- alpha or interleukins composed of the adsorbent packed in a container having an inlet and an outlet.