Abstract:
An integrated circuit comprises one or more devices. One or more optical transmitters are coupled to receive electrical signals from at least one of the one or more devices. The one or more optical transmitters transmit radiation based on the received electrical signals. One or more optical receivers transmit electrical signals to at least one of the one or more devices based one received radiation. One or more optical fibers are each coupled to transmit radiation from the one or more optical transmitters and/or to transmit radiation to the one or more optical receivers. The integrated circuit, the one or more optical transmitters, and the one or more optical receivers are packaged to form a chip.
Abstract:
Optical interconnect that connects an integrated circuit to other circuitry is provided. An integrated circuit may be a composite integrated circuit (300) having a Group IV portion and a compound semiconductor portion overlying an accommodating buffer. An optical component (304) formed in the compound semiconductor portion may be configured to optically connect circuitry (302) in the Group IV portion to external circuits. The optical component may be an optical source component or an optical detector component. A plurality of optical components may be formed in an integrated circuit to provide parallel optical interconnect. Two composite integrated circuits may be stacked with their active sides facing and with aligned optical components to allow for the circuits to communicate. Waveguides that are in a circuit board may also be used in connecting circuits that are supported by the circuit board.
Abstract:
An optical communication apparatus using a single optical fiber to effect a two-way communication at the same time. A light emitting element (132) emits its generated light through an optical system (133) to an optical fiber (76). A light having been transmitted through the optical fiber (76) is received by a light receiving element (136) via the optical system (133). The optical system (133) is set such that the value of the light amount M of stray light is given as follows: S - 2QN >/= M > S / 2Q - N where Q is the value of the Q value representing a required communication quality, S is the light amount of a received signal from the other end of communication, and N is the total sum of Gaussian noise.
Abstract:
The invention relates to a device and a method for detecting an object or a person in the passenger compartment of a vehicle. At least one laser light pulse is emitted. The laser light pulse which is reflected on an object or a person is received. The receiving power is permanently detected. The laser light pulse is switched off when a threshold value that matches sufficient receiving power is obtained.
Abstract:
An optical barrier device uses a light beam to scan an area, and issues an alarm indicative of the presence of an object when the reflection of the scanning beam is not received because of interception. A scan mirror (12) reflects a light beam from a beam source (11) to form a scanning beam (BM1) for scanning an area (1). A photodetector element (14) receives the scanning beam (BM1) reflected by a reflector array (23) of a unit, and a signal detector circuit (15) checks for the presence of pulses in the photodetector output. If an object (30) intercepts the scanning beam (BM1), part of the beam from the reflector array (23) is not received, and some pulses lack in the photodetector output. The lack of pulses causes the output (Z1) of the signal detector circuit (15) to turn to logic 0, and an alarm is issued to indicate the presence of an object.
Abstract:
An opto-isolator circuit (100) for providing isolation between a bi-directional, I2C transmission line and a pair of single-direction transmission lines (32, 34). The opto-isolator circuit (100) includes a bi-directional port (102) for receiving data from, and providing data to, the bi-directional transmission line. The circuit further includes an output path that has (i) a first buffer (108) for receiving outgoing data from the bi-directional port (102), (ii) a first opto-isolator (110) for receiving the outgoing data from an output of the first buffer (108), and (iii) a second buffer (112) for receiving the outgoing data from an output of the first opto-isolator (110) and providing the outgoing data to an output port (104). The circuit also includes an input path, that has (i) a third buffer (114) for receiving incoming data from an input port (106), (ii) a second opto-isolator (116) for receiving the incoming data from an output of the third buffer (114), and (iii) a fourth buffer (118) for receiving the incoming data from an output of the second opto-isolator (116). The fourth buffer (118) provides the incoming data to the bi-directional port (102) such that characteristics of the incoming data are compatible with I2C characteristics.
Abstract:
A photo-interrupter having a low-cost construction and capable of mounting a light-emitting element device and a light-receiving element device to a concave case. The photo-interrupter (1) houses a light-emitting element device (6) and a light-receiving element device (7), that are allowed to project forward to form lenses (6a), (7a) respectively, in a concave case (2) of an opaque synthetic resin molding with the two devices facing each other. The side faces of respective lenses (6a), (7a) of the devices (6, 7) are placed on and locked with the end faces (5x), (5y) of openings (5a), (5b) formed in the opposing inside surfaces of the case (2), the right and left outside surfaces (2x), (2y) of the case (2) are bent to form pressing portions (2u), (2v), and the back surfaces of the device (6), (7) are pressed for fixing to the case (2).
Abstract:
To produce a thin-film sensor of the type described in the invention only a very thin semiconductor layer is required, which is applied to a support. The thickness of the semiconductor layer is determined by the thickness of the photodetectors. In addition to the semiconductor layer the support also carries the necessary separating structures. As a result the separating structures are situated only a very short distance from the photodetectors and light source, which permits a significant improvement in imaging quality. It is also possible to integrate other optical elements into the support.
Abstract:
An autobalance control circuit (80) for use in a moisture sensor which senses moisture on the surface of a transparent material. The moisture sensor includes detectors (44, 54) for receiving emitter signals (42) which are influenced by moisture on the transparent material. The moisture sensor further includes a pre-demodulation circuit (60) for attenuating unwanted signal components in the detector output signal while amplifying the useful signal components for further processing by a microcomputer (65). An autobalance circuit (80) is provided for receiving the pre-demodulation circuit signal (64) and providing an autobalance signal (98) to the pre-demodulation circuit input. The autobalance signal at least partially cancels the detector output signal to prevent saturation of the pre-demodulation amplifier when undesirable detector output signal amplitudes are encountered. By preventing saturation of the moisture sensor circuitry, the autobalance circuit allows the sensor to continue to operate in the presence of large drops of moisture while having sufficient gain for detecting small droplets of moisture.
Abstract:
An optoelectronic assembly (10) having an insulating substrate (12) with a planar surface (11) and a metal layer (14) bonded to the planar surface (11) such that selected regions of the substrate (12) are exposed and a step is produced between the substrate (12) and a top surface of the metal layer (14). An active optical device (16) is mounted on the metal layer (14) and a passive optical device (22, 24) is aligned with the active device using the step as a fiduciary for positioning the former. The metal layer (14) provides an electrical path to the active device (16). The thickness (T) of the metal layer (14) is selected such that the heat generated by the active device (16) is dissipated, the substrate (12) does not interfere with the propagation of light along the first optical axis (36), and such that the in-plane coefficient of thermal expansion (CTE) of the metal layer (14) is constrained by the substrate (12). The optoelectronic assembly (10) is also suitable for mounting active devices (16) provided with submounts or without.