公开(公告)号：WO2008045644A3

公开(公告)日：2008-07-10

申请号：PCT/US2007078014

申请日：2007-09-10

Applicant: MOTOROLA INC ,  BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

Inventor： BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了一种用于将印刷电路板中的电池（106）嵌入的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括电隔离（306）第一电池触点（122）并且在第二外垫（110）和第二内垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2008045644B1

公开(公告)日：2008-08-28

申请号：PCT/US2007078014

申请日：2007-09-10

Applicant: MOTOROLA INC ,  BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

Inventor： BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了用于将电池（106）嵌入印刷电路板中的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）和第二外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括电隔离（306）第一电池触点（122）并在第二外部衬垫（110）和第二内部衬垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2005011343A3

公开(公告)日：2005-06-02

申请号：PCT/US2004023292

申请日：2004-07-20

Applicant: MOTOROLA INC ,  ZOLLO JAMES A ,  ARLEDGE JOHN K ,  BARRON JOHN C ,  BURHANCE GARY R ,  HOLLEY JOHN ,  LIEBMAN HENRY F

Inventor： ZOLLO JAMES A ,  ARLEDGE JOHN K ,  BARRON JOHN C ,  BURHANCE GARY R ,  HOLLEY JOHN ,  LIEBMAN HENRY F

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/46 ,  H05K3/36 ,  H01K3/10 ,  H05K3/30 ,  H05K7/10

CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

Abstract translation: 衬底组件（10）及其制造方法在衬底芯（22）的通孔（24）中具有至少一个嵌入组件（25），并且包括耦合到衬底芯的第一粘合剂层（20）和 第二粘合剂层（26）在衬底芯的顶表面的至少部分上和嵌入部件的部分之上。 衬底组件还可以包括粘附到衬底芯的底表面的第一导电层（18）和第二粘合剂层上的第二导电层（28）。 衬底组件还可以包括在嵌入部件的导电表面与第一导电层和第二导电层中的至少一个之间的互连（36）。 互连可以通过至少暂时暴露嵌入式部件的导电表面（32）的开口（34）形成。

公开(公告)号：WO2005011343A2

公开(公告)日：2005-02-03

申请号：PCT/US2004/023292

申请日：2004-07-20

Applicant: MOTOROLA, INC. ,  ZOLLO, James, A. ,  ARLEDGE, John, K. ,  BARRON, John, C. ,  BURHANCE, Gary, R. ,  HOLLEY, John ,  LIEBMAN, Henry, F.

Inventor： ZOLLO, James, A. ,  ARLEDGE, John, K. ,  BARRON, John, C. ,  BURHANCE, Gary, R. ,  HOLLEY, John ,  LIEBMAN, Henry, F.

IPC: H05K

CPC classification number: H05K1/185 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A substrate assembly (10) and method of making same has at least one embedded component (25) in a via (24) of a substrate core (22) and includes a first adhesive layer (20) coupled to the substrate core, and a second adhesive layer (26) on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer (18) adhered to the bottom surface of the substrate core and a second conductive layer (28) on the second adhesive layer. The substrate assembly can further include an interconnection (36) between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening (34) that at least temporarily exposes at least a conductive surface (32) of the embedded component.

Abstract translation: 衬底组件（10）及其制造方法在衬底芯（22）的通孔（24）中具有至少一个嵌入式部件（25）并且包括第一粘合剂层（20） 耦合到所述衬底核心，以及在所述衬底核心的顶表面的至少部分上以及所述嵌入组件的部分上方的第二粘合剂层（26）。 衬底组件还可以包括粘附到衬底核心的底表面的第一导电层（18）和第二粘附层上的第二导电层（28）。 衬底组件还可以包括在嵌入式部件的导电表面与第一导电层和第二导电层中的至少一个之间的互连（36）。 互连可以通过开口（34）形成，开口（34）至少暂时暴露嵌入式部件的至少一个导电表面（32）。

公开(公告)号：WO2008045644A2

公开(公告)日：2008-04-17

申请号：PCT/US2007/078014

申请日：2007-09-10

Applicant: MOTOROLA, INC. ,  BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

Inventor： BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了用于将电池（106）嵌入印刷电路板中的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）和第二外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括将第一电池触点（122）电隔离（306）并在第二外垫（110）和第二内垫（118）之间形成第二电池触点（124）。