公开(公告)号：WO2016167853A1

公开(公告)日：2016-10-20

申请号：PCT/US2016/014223

申请日：2016-01-21

Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P.

Inventor： MEYER, David, J. ,  DOWNEY, Brian, P.

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L27/04

CPC classification number: B81C1/00539 ,  B81C1/00936 ,  B81C2201/0107 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0177

Abstract: A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

Abstract translation: 一种用于制造包括部分地或完全地悬置在衬底上的外延半导体功能层的悬置微机电系统（MEMS）结构的工艺。 牺牲释放层和功能器件层形成在衬底上。 对功能器件层进行蚀刻以在功能器件层中形成窗口，从而界定将从功能器件层形成的悬置MEMS器件的轮廓。 然后用选择性释放蚀刻剂对牺牲释放层进行蚀刻，以去除由窗口限定的区域中的功能层下方的牺牲释放层，以形成悬浮的MEMS结构。

公开(公告)号：WO2016019102A1

公开(公告)日：2016-02-04

申请号：PCT/US2015/042820

申请日：2015-07-30

Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P. ,  KATZER, Douglas, S.

Inventor： MEYER, David, J. ,  DOWNEY, Brian, P. ,  KATZER, Douglas, S.

IPC: H01L21/28 ,  H01L21/20

CPC classification number: H01L29/45 ,  H01L21/02378 ,  H01L21/02458 ,  H01L21/02491 ,  H01L21/02505 ,  H01L21/02529 ,  H01L21/0254 ,  H01L21/0485 ,  H01L21/0495 ,  H01L29/452

Abstract: A method for integrating epitaxial, metallic transition metal nitride (TMN) layers within a compound semiconductor device structure. The TMN layers have a similar crystal structure to relevant semiconductors of interest such as silicon carbide (SiC) and the Group Ill-Nitrides (III-Ns) such as gallium nitride (GaN), aluminum nitride (A1N), indium nitride (InN), and their various alloys. Additionally, the TMN layers have excellent thermal stability and can be deposited in situ with other semiconductor materials, allowing the TMN layers to be buried within the semiconductor device structure to create semiconductor/metal/semiconductor heterostructures and superlattices.

Abstract translation: 一种将外延金属过渡金属氮化物（TMN）层集成在化合物半导体器件结构内的方法。 TMN层具有与诸如碳化硅（SiC）和氮化镓（GaN），氮化铝（AlN），氮化铟（InN）等氮化铟（III-N））的III族氮化物（III-Ns）有关的半导体相似的晶体结构， ，及其各种合金。 另外，TMN层具有优异的热稳定性，并且可以与其他半导体材料原位沉积，允许TMN层被埋在半导体器件结构内以产生半导体/金属/半导体异质结构和超晶格。

公开(公告)号：WO2015009669A1

公开(公告)日：2015-01-22

申请号：PCT/US2014/046609

申请日：2014-07-15

Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P.

Inventor： MEYER, David, J. ,  DOWNEY, Brian, P.

IPC: H01L21/20 ,  H01L29/16

CPC classification number: H01L29/1608 ,  H01L21/32134 ,  H01L21/32135 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/7806 ,  H01L21/7813 ,  H01L29/2003 ,  H01L2221/68368 ,  H01L2924/0002

Abstract: A method to remove epitaxial semiconductor layers from a substrate by growing an epitaxial sacrificial layer on the substrate where the sacrificial layer is a transition metal nitride (TMN) or a TMN ternary compound, growing one or more epitaxial device layers on the sacrificial layer, and separating the device layers from the substrate by etching the sacrificial layer to completely remove the sacrificial layer without damaging or consuming the substrate or any device layer. Also disclosed are the related semiconductor materials made by this method.

Abstract translation: 一种通过在衬底上生长外延牺牲层（其中牺牲层是过渡金属氮化物（TMN））或TMN三元化合物，在牺牲层上生长一个或多个外延器件层的步骤，从衬底去除外延半导体层的方法，以及 通过蚀刻牺牲层将器件层与衬底分离，以完全去除牺牲层，而不损坏或消耗衬底或任何器件层。 还公开了通过该方法制造的相关半导体材料。

公开(公告)号：WO2012040701A3

公开(公告)日：2012-06-07

申请号：PCT/US2011053247

申请日：2011-09-26

Applicant: WABTEC HOLDING CORP ,  SICH GARY M ,  SKWERES JEFFREY B ,  PLECHEY MICHAEL S ,  MEYER DAVID J

Inventor： SICH GARY M ,  SKWERES JEFFREY B ,  PLECHEY MICHAEL S ,  MEYER DAVID J

IPC: F16K31/00

CPC classification number: B60T15/021 ,  Y10T137/86485

Abstract: A service portion of a rail control valve includes a body defining a piston passageway, an inshot valve passageway, and a service accelerated release valve passageway. An inshot valve is received by the inshot valve passageway of the body and a service accelerated release valve is received by the service accelerated release valve passageway.

Abstract translation: 轨道控制阀的维修部分包括限定活塞通道，压头阀通道和服务加速释放阀通道的主体。 蒸气阀由本体的喷嘴阀通道接收，并且服务加速释放阀由服务加速释放阀通道接收。

公开(公告)号：WO2008045644A3

公开(公告)日：2008-07-10

申请号：PCT/US2007078014

申请日：2007-09-10

Applicant: MOTOROLA INC ,  BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

Inventor： BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了一种用于将印刷电路板中的电池（106）嵌入的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括电隔离（306）第一电池触点（122）并且在第二外垫（110）和第二内垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2016167848A1

公开(公告)日：2016-10-20

申请号：PCT/US2016/012133

申请日：2016-01-05

Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY ,  MEYER, David, J. ,  DOWNEY, Brian, P.

Inventor： MEYER, David, J. ,  DOWNEY, Brian, P.

IPC: B81C1/00 ,  B81B7/00 ,  B81B7/02 ,  H01L27/04

CPC classification number: B81C1/00539 ,  B81C1/00936 ,  B81C2201/0107 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/0159 ,  B81C2201/0177

Abstract: A process for fabricating a suspended microelectromechanical system (MEMS) structure comprising epitaxial semiconductor functional layers that are partially or completely suspended over a substrate. A sacrificial release layer and a functional device layer are formed on a substrate. The functional device layer is etched to form windows in the functional device layer defining an outline of a suspended MEMS device to be formed from the functional device layer. The sacrificial release layer is then etched with a selective release etchant to remove the sacrificial release layer underneath the functional layer in the area defined by the windows to form the suspended MEMS structure.

Abstract translation: 一种用于制造悬浮微机电系统（MEMS）结构的方法，其包括部分或完全悬浮在衬底上的外延半导体功能层。 在基板上形成牺牲剥离层和功能元件层。 功能器件层被蚀刻以在功能器件层中形成窗口，其限定要由功能器件层形成的悬置的MEMS器件的轮廓。 然后用选择性释放蚀刻剂蚀刻牺牲剥离层，以去除由窗口限定的区域中的功能层下方的牺牲剥离层，以形成悬浮的MEMS结构。

公开(公告)号：WO2008045644A2

公开(公告)日：2008-04-17

申请号：PCT/US2007/078014

申请日：2007-09-10

Applicant: MOTOROLA, INC. ,  BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

Inventor： BURHANCE, Gary, R. ,  BARRON, John, C. ,  GARCIA, Jorge, L. ,  MEYER, David, J.

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了用于将电池（106）嵌入印刷电路板中的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）和第二外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括将第一电池触点（122）电隔离（306）并在第二外垫（110）和第二内垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2008045644B1

公开(公告)日：2008-08-28

申请号：PCT/US2007078014

申请日：2007-09-10

Applicant: MOTOROLA INC ,  BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

Inventor： BURHANCE GARY R ,  BARRON JOHN C ,  GARCIA JORGE L ,  MEYER DAVID J

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0949 ,  H05K2201/10037

Abstract: A printed circuit board (100) and a method (302,304,306,308) for imbedding a battery (106) in the printed circuit board are disclosed. The method includes connecting (302) the battery to a first inner pad (116) and a second inner pad (118) on an inner core layer (104) and forming a first battery contact (122) between a first outer pad (108) and the first inner pad (116). The method also includes electrically isolating (306) the first battery contact (122) and forming a second battery contact (124) between a second outer pad (110) and the second inner pad (118).

Abstract translation: 公开了用于将电池（106）嵌入印刷电路板中的印刷电路板（100）和方法（302,304,306,308）。 该方法包括将电池连接（302）到内芯层（104）上的第一内垫（116）和第二内垫（118），并在第一外垫（108）和第二外垫（108）之间形成第一电池触点（122） 和第一内垫（116）。 该方法还包括电隔离（306）第一电池触点（122）并在第二外部衬垫（110）和第二内部衬垫（118）之间形成第二电池触点（124）。

公开(公告)号：WO2012040701A2

公开(公告)日：2012-03-29

申请号：PCT/US2011/053247

申请日：2011-09-26

Applicant: WABTEC HOLDING CORP. ,  SICH, Gary, M. ,  SKWERES, Jeffrey, B. ,  PLECHEY, Michael, S. ,  MEYER, David, J.

Inventor： SICH, Gary, M. ,  SKWERES, Jeffrey, B. ,  PLECHEY, Michael, S. ,  MEYER, David, J.

IPC: B60T8/36

CPC classification number: B60T15/021 ,  Y10T137/86485

Abstract: A service portion of a rail control valve includes a body defining a piston passageway, an inshot valve passageway, and a service accelerated release valve passageway. An inshot valve is received by the inshot valve passageway of the body and a service accelerated release valve is received by the service accelerated release valve passageway.

Abstract translation: 导轨控制阀的服务部分包括限定活塞通道，吸入阀通道和服务加速释放阀通道的主体。 进气阀由主体的进气阀通道接收，并且服务加速释放阀由服务加速释放阀通道接收。