Abstract:
This invention relates to methods for the production of micro-structured substrates and their application in natural sciences and technology, in particular in semiconductor, microfluidic and analysis devices. It concerns a method of introducing a structure, such as a hole or cavity or channel or well or recess or a structural change by providing a controlled electrical discharge.
Abstract:
The present invention relates to a method of generating a hole or well in an electrically insulating or semiconducting substrate, and to a hole or well in a substrate generated by this method. The invention also relates to an array of holes or wells in a substrate generated by the method.
Abstract:
A sample handling device (100) for handling a sample, the sample handling device (100) comprising a drive shaft (101) being drivable by a drive unit (102), a base plate (103) mounted to follow a motion of the drive shaft (101) when being driven by the drive unit (102), wherein the base plate (103) is configured to receive a sample carrier block (104) mountable to follow a motion of the base plate (103), and a compensation weight (105, 106) mounted asymmetrically on the drive shaft (101) in a manner to at least partially compensate an unbalanced mass of the sample handling device (100) during the motion.
Abstract:
The present invention relates to a method of producing an electrically- conducting via in a substrate and to a substrate produced thereby. The method comprises the steps : a) providing a substrate made of at least one electrically insulating material (1), b) placing said substrate between two electrodes (3, 3' ), said two electrodes being connected to a user-controlled voltage source (4), c) appling a voltage to said substrate, d) causing a dielectric breakdown and energy dissipation between said two electrodes through said substrate by locally or globally increasing the electrical conductivity of said substrate, wherein, in step d), a modification of said at least one electrically insulating material into an electrically conducting material occurs, thereby generating an electrically conducting via (6). In particular, in one embodiment, the present invention relates to a substrate, such as a printed circuit board having one or several metal-free electrically conducting vias.
Abstract:
This invention relates to methods and devices for the production of surface modified micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems. The method of manufacturing a substrate (1) having a stucture (3), preferably a hole or cavity or channel, in said substrate (1) comprises the steps: modifying said surface of said substrate so as to alter the surface properties (2) of said substrate; introducing a structure (3) in a region of said substrate (1) by a method which alters the surface properties of said substrate within said region (4) but not outside of said region.
Abstract:
This invention relates to methods and devices for the production of optical microstructures or domains in dielectric substrates based on electrothermal focussing. More specifically, the invention relates to a method of introducing a change of dielectric and/or optical properties in a region of an electrically insulating or electrically semiconducting substrate, and to substrates produced by such method.
Abstract:
A sample handling device (100) for handling a sample, the sample handling device (100) comprising a drive shaft (101) being drivable by a drive unit (102), a base plate (103) mounted to follow a motion of the drive shaft (101) when being driven by the drive unit (102), wherein the base plate (103) is configured to receive a sample carrier block (104) mountable to follow a motion of the base plate (103), and a compensation weight (105, 106) mounted asymmetrically on the drive shaft (101) in a manner to at least partially compensate an unbalanced mass of the sample handling device (100) during the motion.
Abstract:
The present invention relates to a method of generating a hole or recess or well or array thereof in an electrically insulating or semiconducting substrate. The invention also relates to an array of holes or wells or recesses in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.
Abstract:
The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.