中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

9 records (took 0.013 seconds)

    LASER PROCESSING OF CONDUCTIVE LINKS
    1.
    发明申请
    LASER PROCESSING OF CONDUCTIVE LINKS 审中-公开
    导电链接的激光加工

    公开(公告)号：WO2008144443A1

    公开(公告)日：2008-11-27

    申请号：PCT/US2008/063789

    申请日：2008-05-15

    Applicant: GSI LUMONICS CORPORATION ,  GRIFFITHS, Joseph, J. ,  LEE, Joohan ,  GU, Bo

    Inventor： GRIFFITHS, Joseph, J. ,  LEE, Joohan ,  GU, Bo

    IPC: B23K26/36 ,  H01L23/525

    CPC classification number: B23K26/073 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/36 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/12 ,  B23K2203/50 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of laser-based material processing comprising: generating a laser beam having a narrow emission spectrum characterized by a full width at half maximum intensity of less than about 1 nanometer during a first time interval; controllably modifying a characteristic of the laser beam during the time interval to produce one or more pulses without substantially broadening the emission spectrum; and delivering and focusing at least one of the one or more pulses onto at least one target structure during motion of the at least one structure relative to the at least one pulse.

    Abstract translation: 一种基于激光的材料处理方法，包括：在第一时间间隔期间产生具有特征在于具有小于约1纳米的半高强度全宽度的窄发射光谱的激光束; 在时间间隔内可控地修改激光束的特性以产生一个或多个脉冲而基本上不扩展发射光谱; 以及在所述至少一个结构相对于所述至少一个脉冲的运动期间，将所述一个或多个脉冲中的至少一个传递和聚焦到至少一个目标结构上。

    LASER-BASED METHOD AND SYSTEM FOR PROCESSING A MULTI-MATERIAL DEVICE HAVING CONDUCTIVE LINKS STRUCTURES
    3.
    发明申请
    LASER-BASED METHOD AND SYSTEM FOR PROCESSING A MULTI-MATERIAL DEVICE HAVING CONDUCTIVE LINKS STRUCTURES 审中-公开
    用于处理具有导电链接结构的多材料装置的基于激光的方法和系统

    公开(公告)号：WO2007092716A2

    公开(公告)日：2007-08-16

    申请号：PCT/US2007/061365

    申请日：2007-01-31

    Applicant: GSI GROUP CORPORATION ,  LEE, Joohan ,  CORDINGLEY, James, J. ,  GU, Bo ,  EHRMANN, Jonathan, S. ,  GRIFFITHS, Joseph, J.

    Inventor： LEE, Joohan ,  CORDINGLEY, James, J. ,  GU, Bo ,  EHRMANN, Jonathan, S. ,  GRIFFITHS, Joseph, J.

    CPC classification number: H01L23/5258 ,  B23K26/40 ,  B23K2203/50 ,  H01L27/1052 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A laser-based method and system for selectively processing a multi-material device having a target link structure formed on a substrate while avoiding undesirable change to an adjacent link structure also formed on the substrate are disclosed. The method includes applying at least one focused laser pulse having a wavelength into a spot. The at least one focused laser pulse has an energy density over the spot sufficient to completely process the target link structure while avoiding undesirable change to the adjacent link structure, the substrate and any layers between the substrate and the link structures. The target link structure and the adjacent structure may have a pitch of about 2.0 microns or less.

    Abstract translation: 公开了一种基于激光的方法和系统，用于选择性地处理具有形成在基板上的目标连接结构的多材料装置，同时避免对基板上也形成的相邻连接结构的不期望的改变。 该方法包括将至少一个具有波长的聚焦激光脉冲施加到点中。 所述至少一个聚焦激光脉冲具有足以完全处理目标连杆结构的点的能量密度，同时避免对相邻连接结构，基板和基板与连接结构之间的任何层的不期望的改变。 目标连杆结构和相邻结构可以具有约2.0微米或更小的间距。

    LASER-BASED METHOD AND SYSTEM FOR PROCESSING A MULTI-MATERIAL DEVICE HAVING CONDUCTIVE LINKS STRUCTURES
    7.
    发明申请
    LASER-BASED METHOD AND SYSTEM FOR PROCESSING A MULTI-MATERIAL DEVICE HAVING CONDUCTIVE LINKS STRUCTURES 审中-公开
    用于处理具有导电链路结构的多材料装置的基于激光的方法和系统

    公开(公告)号：WO2007092716A3

    公开(公告)日：2009-09-11

    申请号：PCT/US2007061365

    申请日：2007-01-31

    Applicant: GSI GROUP CORP ,  LEE JOOHAN ,  CORDINGLEY JAMES J ,  GU BO ,  EHRMANN JONATHAN S ,  GRIFFITHS JOSEPH J

    Inventor： LEE JOOHAN ,  CORDINGLEY JAMES J ,  GU BO ,  EHRMANN JONATHAN S ,  GRIFFITHS JOSEPH J

    IPC: H01L21/00

    CPC classification number: H01L23/5258 ,  B23K26/40 ,  B23K2203/50 ,  H01L27/1052 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A laser-based method and system for selectively processing a multi-material device having a target link structure formed on a substrate while avoiding undesirable change to an adjacent link structure also formed on the substrate are disclosed. The method includes applying at least one focused laser pulse having a wavelength into a spot. The at least one focused laser pulse has an energy density over the spot sufficient to completely process the target link structure while avoiding undesirable change to the adjacent link structure, the substrate and any layers between the substrate and the link structures. The target link structure and the adjacent structure may have a pitch of about 2.0 microns or less.

    Abstract translation: 公开了一种基于激光的方法和系统，用于选择性地处理具有形成在基板上的目标连杆结构的多材料装置，同时避免对基板上也形成的相邻连接结构的不期望的改变。 该方法包括将至少一个具有波长的聚焦激光脉冲施加到光斑中。 所述至少一个聚焦激光脉冲具有足以完全处理目标连杆结构的点的能量密度，同时避免对相邻连接结构，基板和基板和连接结构之间的任何层的不期望的改变。 目标连杆结构和相邻结构可以具有约2.0微米或更小的间距。

    METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME
    8.
    发明申请
    METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME 审中-公开
    用于适应性地控制基于激光的材料加工过程的方法和系统及其质量鉴定方法和系统

    公开(公告)号：WO2007143408A3

    公开(公告)日：2009-04-09

    申请号：PCT/US2007069612

    申请日：2007-05-24

    Applicant: GSI GROUP CORP ,  GRIFFITHS JOSEPH J ,  PELSUE KURT

    Inventor： GRIFFITHS JOSEPH J ,  PELSUE KURT

    IPC: B23K26/00

    CPC classification number: G05B11/01 ,  B23K26/032 ,  B23K26/36 ,  G05B15/02 ,  H01L22/24 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S5/06 ,  H01L2924/00

    Abstract: A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.

    Abstract translation: 提供了一种用于自适应地控制基于激光的材料处理过程的方法和系统。 该系统包括用于测量由材料处理系统处理的基于激光的材料处理系统和工件中的至少一个的过程变量或状况的感测设备，并提供对应的测量信号。 控制系统还包括一个信号处理器，用于处理测量信号以获得处理的信号，该处理信号至少半自动地启动与材料处理系统和工件中的至少一个相关联的动作。 还提供了一种用于至少半自动限定激光基材料处理系统的方法和系统，其将激光能量传递到在工件上形成的多个微结构上或邻近其上的位置，以至少部分地处理微结构。

    METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME
    9.
    发明申请
    METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAME 审中-公开
    用于适应性地控制基于激光的材料加工过程的方法和系统及其质量鉴定方法和系统

    公开(公告)号：WO2007143408A2

    公开(公告)日：2007-12-13

    申请号：PCT/US2007/069612

    申请日：2007-05-24

    Applicant: GSI GROUP CORPORATION ,  GRIFFITHS, Joseph, J. ,  PELSUE, Kurt

    Inventor： GRIFFITHS, Joseph, J. ,  PELSUE, Kurt

    IPC: G06F19/00 ,  B23K26/38 ,  B23K26/03

    CPC classification number: G05B11/01 ,  B23K26/032 ,  B23K26/36 ,  G05B15/02 ,  H01L22/24 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S5/06 ,  H01L2924/00

    Abstract: A method and system for adaptively controlling a laser-based material processing process are provided. The system includes sensing equipment to measure a process variable or condition of at least one of a laser-based material processing system and a workpiece processed by the material processing system and to provide a corresponding measurement signal. The control system also includes a signal processor for processing the measurement signal to obtain a processed signal which initiates, at least semi-automatically, an action associated with at least one of the material processing system and the workpiece. A method and system for at least semi-automatically qualifying a laser-based material processing system which delivers laser energy to locations on or adjacent a plurality of microstructures formed on a workpiece to at least partially process the microstructures are also provided.

    Abstract translation: 提供了一种用于自适应地控制基于激光的材料处理过程的方法和系统。 该系统包括用于测量由材料处理系统处理的基于激光的材料处理系统和工件中的至少一个的过程变量或状况的感测设备，并提供对应的测量信号。 控制系统还包括一个信号处理器，用于处理测量信号以获得处理的信号，该处理信号至少半自动地启动与材料处理系统和工件中的至少一个相关联的动作。 还提供了一种用于至少半自动限定激光基材料处理系统的方法和系统，其将激光能量传递到在工件上形成的多个微结构上或邻近其上的位置，以至少部分地处理微结构。

Patent Agency Ranking