公开(公告)号：WO2006073888A2

公开(公告)日：2006-07-13

申请号：PCT/US2005/046762

申请日：2005-12-28

Applicant: GSI LUMONICS CORPORATION ,  CORDINGLEY, James, J.

Inventor： CORDINGLEY, James, J.

IPC: G01F23/00

CPC classification number: B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/0626

Abstract: A laser-based material processing method, system and subsystem for use therein for precision energy control are provided, wherein a bulk attenuator is switched across an RF driver output to greatly lower the overall RF output and resulting laser energy per pulse. The value of the attenuator determines the range of energies achievable, pj or fractions of pj's. More than one attenuator and switch can be used to achieve multiple energy ranges. After the bulk attenuator is switched in, the laser energy is greatly reduced and the RF driver can then be run again near full RF power where the SNR is much better. The input voltage from a DAC is also much higher so it is also not at the low end of its range where it is also noisy due to poor SNR. The method and system provides increased dynamic range, greater extinction (lower possible energies), better accuracy and stability due to higher SNR of the DAC input voltage and higher SNR in the RF driver.

Abstract translation: 提供了一种用于精密能量控制的基于激光的材料处理方法，用于其中的系统和子系统，其中体衰减器跨越RF驱动器输出切换，以大大降低总体RF输出并产生每脉冲的激光能量。 衰减器的值确定可实现的能量范围，pj或pj的分数。 可以使用多个衰减器和开关来实现多个能量范围。 在大容量衰减器被切换之后，激光能量大大降低，然后RF驱动器可以再次运行在完全RF功率附近，其中SNR更好。 来自DAC的输入电压也高得多，所以它也不在其范围的低端，由于差的SNR，它的噪声也很低。 该方法和系统由于DAC输入电压的较高SNR和RF驱动器中的较高SNR而提供增加的动态范围，更大的消光（更低的可能能量），更好的精度和稳定性。

公开(公告)号：WO2006053288A2

公开(公告)日：2006-05-18

申请号：PCT/US2005/041144

申请日：2005-11-11

Applicant: GSI LUMONICS CORPORATION ,  GU, Bo ,  EHRMANN, Jonathan. S.

Inventor： GU, Bo ,  EHRMANN, Jonathan. S.

IPC: B23K26/36

CPC classification number: H01L21/67282 ,  B23K26/0622 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and systems for laser soft marking, especially for semiconductor wafers and devices, are provided. A laser-marking system for marking a semiconductor wafer to form a softmark on the wafer is provided. The system includes a laser subsystem for generating one or more laser pulses and a controller operatively connected to the laser subsystem. The controller sets a laser pulse width of the one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths that affect the depth of a softmark that is to be formed. The mark depth is substantially dependent on the one or more set pulse widths. The controller further sets a pulse energy of the one or more output pulses to selectively provide the one or more output pulses having a set total output energy that is within an acceptable process energy window for producing the softmark. The system further includes a beam delivery system that includes an optical subsystem for delivering the one or more output pulses having the one or more set pulse widths and the set total output energy into a region of the wafer such that energy density within the region, as determined by the one or more set pulse widths and the set total pulse energy, modifies wafer material and thereby produces the softmark having the mark depth within a predetermined range.

Abstract translation: 提供了用于激光软标记的方法和系统，特别是用于半导体晶片和器件。 提供了一种用于标记半导体晶片以在晶片上形成软标记的激光标记系统。 该系统包括用于产生一个或多个激光脉冲的激光子系统和可操作地连接到激光子系统的控制器。 所述控制器设置所述一个或多个激光脉冲的激光脉冲宽度以选择性地提供一个或多个激光输出脉冲，所述一个或多个激光输出脉冲具有影响待形成的软标记的深度的一个或多个设定的脉冲宽度。 标记深度基本上取决于一个或多个设定的脉冲宽度。 所述控制器还设置所述一个或多个输出脉冲的脉冲能量以选择性地提供所述一个或多个输出脉冲，所述输出脉冲具有在用于产生所述软标记的可接受的过程能量窗口内的设定的总输出能量。 该系统还包括光束传送系统，其包括用于将具有一个或多个设定脉冲宽度的一个或多个输出脉冲和设定的总输出能量输送到晶片的区域中的光学子系统，使得该区域内的能量密度为 由一个或多个设定的脉冲宽度和设定的总脉冲能量确定，修改晶片材料，从而产生具有标记深度在预定范围内的软标记。

公开(公告)号：WO2006053287A1

公开(公告)日：2006-05-18

申请号：PCT/US2005/041143

申请日：2005-11-11

Applicant: GSI LUMONICS CORPORATION ,  GU, Bo

Inventor： GU, Bo

IPC: B23K26/02 ,  B41J2/47

CPC classification number: H01L21/67282 ,  B23K26/0622 ,  B23K26/361 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  Y02E60/36 ,  H01L2924/00

Abstract: A method and system for laser hard marking is provided. The laser­marking system produces a hard mark on a semiconductor wafer. The system includes a pulsed laser subsystem that produces a pulsed laser output for marking at a location on the wafer. The pulsed laser subsystem is controlled so that output pulse width remains substantially constant with a variation in at least one of pulse repetition rate and output energy over a range. A beam delivery system delivers the pulsed laser output to the location on the wafer.

Abstract translation: 提供了激光硬标记的方法和系统。 激光水印系统在半导体晶片上产生硬标记。 该系统包括脉冲激光子系统，其产生用于在晶片上的位置处标记的脉冲激光输出。 控制脉冲激光子系统，使得输出脉冲宽度保持基本恒定，随着脉冲重复率和输出能量中的至少一个在一个范围内的变化。 光束传输系统将脉冲激光输出传送到晶片上的位置。

公开(公告)号：WO2002078896A1

公开(公告)日：2002-10-10

申请号：PCT/US2002/009665

申请日：2002-03-28

Applicant: GSI LUMONICS CORPORATION

Inventor： EHRMANN, Jonathan, S. ,  CORDINGLEY, James, J. ,  SMART, Donald, V. ,  SVETKOFF, Donald, J. ,  LEE, Joohan ,  JOHNSON, Shepard, Dunn ,  GRIFFITHS, Joseph, J. ,  FILGAS, David, M. ,  DOWD, Roger,

IPC: B23K26/00

CPC classification number: B23K26/0736 ,  B23K26/032 ,  B23K26/04 ,  B23K26/043 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0652 ,  B23K26/0665 ,  B23K26/067 ,  B23K26/082 ,  B23K26/10 ,  B23K26/16 ,  B23K26/361 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/38 ,  B23K2201/40 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/50 ,  H01L21/485 ,  H01L21/76888 ,  H01L21/76894 ,  H01L22/12 ,  H01L23/5258 ,  H01L2924/0002 ,  H05K3/0026 ,  H01L2924/00

Abstract: A method and system for locally processing a predetermined microstructure (10) formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate (13) or other structures formed on the substrate. The method includes providing information based on a model of laser pulse (13) interactions with the predetermined microstructure (10), the substrate (13) and other structures. At least one characteristic of at least one pulse (13) is determined based on the information. A pulsed laser beam (3) is generated including the at least one pulse (3). The method further includes irradiating the at least one pulse (3) having the at least one determined characteristic into a spot on the predetermined microstructure (10). The at least one determined characteristic and other characteristics of the at least one pulse (3) are sufficient to locally process the predetermined microstructure (10) without causing the undesirable changes.

Abstract translation: 一种用于局部处理形成在衬底上的预定微结构（10）的方法和系统，而不引起衬底（13）或形成在衬底上的其它结构的电或物理特性的不期望的变化。 该方法包括基于与预定微结构（10），衬底（13）和其它结构的激光脉冲（13）相互作用的模型来提供信息。 基于该信息来确定至少一个脉冲（13）的至少一个特性。 产生包括至少一个脉冲（3）的脉冲激光束（3）。 该方法还包括将具有至少一个确定特性的至少一个脉冲（3）照射到预定微结构（10）上的点中。 所述至少一个脉冲（3）的所述至少一个确定的特性和其它特性足以在不引起不期望的变化的情况下局部地处理所述预定微结构（10）。

公开(公告)号：WO2006042231A3

公开(公告)日：2006-04-20

申请号：PCT/US2005/036421

申请日：2005-10-07

Applicant: GSI LUMONICS CORPORATION ,  GU, Bo ,  LENTO, Joseph, V. ,  EHRMANN, Jonathan, S. ,  COUCH, Bruce, L. ,  CHU, Yun, Fee ,  JOHNSON, Shepard, D.

Inventor： GU, Bo ,  LENTO, Joseph, V. ,  EHRMANN, Jonathan, S. ,  COUCH, Bruce, L. ,  CHU, Yun, Fee ,  JOHNSON, Shepard, D.

IPC: H01L21/00 ,  A61N5/00

Abstract: A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non-uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause the one or more laser pulses to selectively remove material from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance and high absorption, but not so short so as to cause microcracking.

公开(公告)号：WO2005052925A2

公开(公告)日：2005-06-09

申请号：PCT/US2004/039429

申请日：2004-11-23

Applicant: GSI LUMONICS CORPORATION

Inventor： PRUYN, Kristopher

IPC: G11B

CPC classification number: G02B7/1821 ,  G02B26/105

Abstract: A mirror mounting unit is disclosed for use in a limited rotation motor system. The mirror mounting unit includes a mirror, and a tapered base for coupling the mirror mounting unit to an output shaft of a limited rotation motor. In various embodiments, the tapered base may be male or female, the mirror may be formed integral with the tapered base, and the taper may be linear or non-linear.

Abstract translation: 公开了用于有限旋转电机系统的镜安装单元。 反射镜安装单元包括反射镜和用于将反射镜安装单元连接到有限旋转马达的输出轴的锥形基座。 在各种实施例中，锥形底座可以是凸形或阴形，镜可以与锥形基座形成一体，并且锥形可以是线性的或非线性的。

公开(公告)号：WO2002099499A1

公开(公告)日：2002-12-12

申请号：PCT/US2001/018328

申请日：2001-06-06

Applicant: GSI LUMONICS CORPORATION

Inventor： BROWN, David

IPC: G02B07/02

CPC classification number: G02B7/00

Abstract: An expandable sealed chamber and method for contact bonding optical components, suitable for electronic and optical applications such as a closed core tunable etalon. There is a spring bellows tube core (12) with open end collars where the collar spacing is controlled by external piezo elements (11). Opposing tophat components (3) are contact bonded to the collars so as to define an airgap within the chamber. The collars are fabricated of material having a coefficient of thermal expansion closely matched to that of the tophat components, and the collar end planes are prepared with a sputtered deposition layer of the same material as the tophats and then milled to an optically smooth finish for contact bonding.

Abstract translation: 一种用于接触粘合光学部件的可扩展密封腔室和方法，适用于电子和光学应用，例如闭式芯可调标准具。 有一个带有开口端环的弹簧波纹管芯（12），其中轴环间距由外部压电元件（11）控制。 相对的呼吸部件（3）接触接合到轴环以便在腔室内限定气隙。 套圈由具有与膨胀部件的热膨胀系数相当匹配的热膨胀系数的材料制成，并且套环的端面用与焊盘相同材料的溅射沉积层制备，然后研磨成光学平滑的表面以进行接触 结合。

公开(公告)号：WO2005073783A1

公开(公告)日：2005-08-11

申请号：PCT/US2005/002009

申请日：2005-01-21

Applicant: GSI LUMONICS CORPORATION

Inventor： HUANG, Yuhong

IPC: G02B26/10

CPC classification number: B23K26/04 ,  B23K26/043 ,  B41M5/26 ,  G01R31/343 ,  G02B26/0816 ,  G02B26/101 ,  G05B11/42 ,  G05B13/042 ,  Y02P70/181 ,  Y02P70/20 ,  Y02T10/82

Abstract: An optimization system is disclosed for optimizing the performance of a laser processing system that employs a limited rotation motor. The optimization system includes an input unit for receiving input parameters including stroke speed, stroke delay, jump speed and jump delay, and includes an evaluation unit for identifying one of an optimal stroke speed or stroke quality for achieving a desired processing performance.

Abstract translation: 公开了一种用于优化使用有限旋转电动机的激光加工系统的性能的优化系统。 优化系统包括用于接收包括行程速度，行程延迟，跳转速度和跳跃延迟的输入参数的输入单元，并且包括用于识别用于实现期望的处理性能的最佳行程速度或行程质量之一的评估单元。

公开(公告)号：WO2003093873A3

公开(公告)日：2003-11-13

申请号：PCT/US2002/030405

申请日：2002-09-25

Applicant: GSI LUMONICS CORPORATION

Inventor： KAPLAN, Alvaro ,  NUSSBAUM, Michael, B.

IPC: G02B5/08

Abstract: An optical element is disclosed for use in a scanning system. The optical element comprises a carbon-based substrate having a first specific stiffness, and a titanium carbide coating having a second specific stiffness. The carbon-based substrate and the titanium carbide coating form a composite having a desired shape. The composite has a third specific stiffness that is greater than the first specific stiffness and greater than the second specific stiffness.

公开(公告)号：WO2003093873A2

公开(公告)日：2003-11-13

申请号：PCT/US2002/030405

申请日：2002-09-25

Applicant: GSI LUMONICS CORPORATION

Inventor： KAPLAN, Alvaro ,  NUSSBAUM, Michael, B.

IPC: G02B

CPC classification number: G02B5/08 ,  G02B26/105

Abstract: An optical element is disclosed for use in a scanning system. The optical element comprises a carbon-based substrate having a first specific stiffness, and a titanium carbide coating having a second specific stiffness. The carbon-based substrate and the titanium carbide coating form a composite having a desired shape. The composite has a third specific stiffness that is greater than the first specific stiffness and greater than the second specific stiffness.

Abstract translation: 公开了用于扫描系统的光学元件。 光学元件包括具有第一比刚度的碳基基底和具有第二比刚度的碳化钛涂层。 碳基基材和碳化钛涂层形成具有所需形状的复合材料。 复合材料具有大于第一比刚度并且大于第二比刚度的第三比刚度。