公开(公告)号：WO2009108030A2

公开(公告)日：2009-09-03

申请号：PCT/KR2009/001010

申请日：2009-03-02

Applicant: LG MICRON LTD. ,  YOON, Hye Sun ,  CHOI, Jae Bong ,  LEE, Eun Jung ,  HWANG, Jung Ho ,  HAN, Joon Wook

Inventor： YOON, Hye Sun ,  CHOI, Jae Bong ,  LEE, Eun Jung ,  HWANG, Jung Ho ,  HAN, Joon Wook

IPC: H05K3/22 ,  H05K1/02

CPC classification number: H05K3/0097 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/107 ,  H05K3/244 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/1536

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract translation: 提供一种制造印刷电路板的方法，该方法包括：在分离构件的两侧上设置第一和第二绝缘构件以及第一和第二导电膜，以在第一和第二构件上执行热压接合处理 绝缘构件以及分隔构件的两侧上的第一和第二导电膜，从而通过其间的分隔构件将第一构件附接到第二构件，并将第一绝缘构件附接到第一导电膜并附接第二绝缘体 选择性地去除第一和第二导电膜以形成第一和第二电路图案，并且切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案分离 从分离成员。

公开(公告)号：WO2009108030A3

公开(公告)日：2009-11-26

申请号：PCT/KR2009001010

申请日：2009-03-02

Applicant: LG MICRON LTD ,  YOON HYE SUN ,  CHOI JAE BONG ,  LEE EUN JUNG ,  HWANG JUNG HO ,  HAN JOON WOOK

Inventor： YOON HYE SUN ,  CHOI JAE BONG ,  LEE EUN JUNG ,  HWANG JUNG HO ,  HAN JOON WOOK

IPC: H05K3/22 ,  H05K1/02

CPC classification number: H05K3/0097 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/107 ,  H05K3/244 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/1536

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract translation: 提供一种制造印刷电路板的方法，包括：在分离部件的两侧设置第一绝缘部件和第二绝缘部件以及第一导电膜和第二导电膜，对第一绝缘部件和第二绝缘部件进行热压接， 在所述分离构件的两侧上形成膜，以将所述第一构件与所述分隔构件连接在所述第二构件上，并将所述第一绝缘构件附接到所述第一导电膜，并且将所述第二绝缘构件附接到所述第二导电膜， 去除第一和第二导电膜以形成第一和第二电路图案，以及切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案与分离构件分离。