公开(公告)号：WO2010027196A3

公开(公告)日：2010-06-17

申请号：PCT/KR2009004975

申请日：2009-09-03

Applicant: IND ACADEMIC COOP ,  HWANG JUNG HO ,  PARK KYU TAE ,  PARK DONG HO

Inventor： HWANG JUNG HO ,  PARK KYU TAE ,  PARK DONG HO

IPC: G01N15/02

CPC classification number: G01N15/0266

Abstract: The present invention relates to a multichannel-type diffusion charger for the real-time measurement of the size distribution of submicron particles, and to a method for the real-time measurement of the size distribution of submicron particles using same. The multichannel-type diffusion charger for the real-time measurement of the size distribution of submicron particles according to the present invention includes: a particle charger (10) for charging particles contained in aerosol air; a plurality of channels (20) for providing a passage for the air in the particle charger (10) such that the air is divided and flows through the passage; and a current measuring device electrically connected to outlet ends of each of the channels to detect a plurality of current values corresponding to the amount of discharge of particles passed through each of the channels. The multichannel-type diffusion charger of the present invention can be manufactured into a small size with a low cost while minimizing the loss or stagnancy of the amount of charged particles. The multichannel-type diffusion charger for the real-time measurement of the size distribution of submicron particles, and the method for the real-time measurement of the size distribution of submicron particles using same, according to the present invention, establish a plurality of simultaneous equations corresponding to the number of variables, and thus calculate and derive variable values in an accurate manner without the need for setting arbitrary values to a portion of the variables, in deriving a plurality of variable values by applying current value data to the algorithm consisting of variables for providing information on the particle size distribution, such as the total particle number concentration, the geometric mean diameter, and the geometric standard deviation.

Abstract translation: 本发明涉及一种用于实时测量亚微米颗粒尺寸分布的多通道型扩散充电器，以及一种使用其进行亚微米颗粒尺寸分布实时测量的方法。 根据本发明的用于实时测量亚微米颗粒的尺寸分布的多通道型扩散充电器包括：用于装载在气溶胶空气中的颗粒的颗粒充电器（10） 多个通道（20），用于为颗粒充电器（10）中的空气提供通道，使得空气被分流并流过通道; 以及电流测量装置，其电连接到每个通道的出口端，以检测对应于通过每个通道的颗粒的排出量的多个电流值。 本发明的多通道型扩散充电器可以以低成本制造成小尺寸，同时最小化带电粒子量的损失或停滞。 用于实时测量亚微米颗粒的尺寸分布的多通道型扩散充电器以及根据本发明的使用其的亚微米颗粒的尺寸分布的实时测量方法建立多个同时 对应于变量数量的方程，从而以精确的方式计算和导出变量值，而不需要为变量的一部分设置任意值，通过将当前值数据应用于由 用于提供关于粒度分布的信息的变量，例如总粒子数浓度，几何平均直径和几何标准偏差。

公开(公告)号：WO2010120128A3

公开(公告)日：2011-03-31

申请号：PCT/KR2010002339

申请日：2010-04-15

Applicant: IS TECHNO CO LTD ,  HWANG JUNG HO

Inventor： HWANG JUNG HO

IPC: B24B37/32 ,  B24D7/06 ,  H01L21/304

CPC classification number: B24B37/32 ,  B24D7/06

Abstract: The present invention relates to a method for manufacturing a polishing retainer ring and a retainer ring manufactured thereby to omit the work of forming slits by attaching a polishing element divided into individual sections, thereby simplifying the work process. The method for manufacturing a polishing retainer ring for polishing a semiconductor element according to the present invention comprises: a first step of smoothly machining a top surface of a ring-shaped parent material; a second step of preparing a plurality of polishing element units by machining a polishing element to be identical with the top shape of the parent material; and a third step of adhering the prepared polishing element unit onto the top surface of the parent material, wherein the respective polishing element units are adhered to be apart from each other at a uniform interval. A retainer ring for polishing a semiconductor element may be manufactured by the method for manufacturing a polishing retainer ring as above, wherein the polishing retainer ring is formed of a polishing element adhered to the top of the parent material and the polishing element is characterized in that a plurality of polishing element units are adhered at a uniform interval to form grooves.

Abstract translation: 本发明涉及一种用于制造抛光保持环和保持环的方法，由此通过附加分割成各个部分的抛光元件来省略形成狭缝的工作，从而简化了加工过程。 根据本发明的用于制造用于抛光半导体元件的抛光保持环的方法包括：平滑地加工环形母材的顶表面的第一步骤; 第二步骤，通过机加工与母材顶部形状相同的抛光元件来制备多个抛光元件单元; 以及将准备的抛光单元单元粘附到母材的顶表面上的第三步骤，其中相应的抛光单元单元以均匀的间隔彼此分开。 用于抛光半导体元件的保持环可以通过如上制造抛光保持环的方法制造，其中抛光保持环由附着到母材顶部的抛光元件形成，抛光元件的特征在于 以均匀的间隔粘接多个研磨元件单元以形成凹槽。

公开(公告)号：WO2009108030A2

公开(公告)日：2009-09-03

申请号：PCT/KR2009/001010

申请日：2009-03-02

Applicant: LG MICRON LTD. ,  YOON, Hye Sun ,  CHOI, Jae Bong ,  LEE, Eun Jung ,  HWANG, Jung Ho ,  HAN, Joon Wook

Inventor： YOON, Hye Sun ,  CHOI, Jae Bong ,  LEE, Eun Jung ,  HWANG, Jung Ho ,  HAN, Joon Wook

IPC: H05K3/22 ,  H05K1/02

CPC classification number: H05K3/0097 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/107 ,  H05K3/244 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/1536

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract translation: 提供一种制造印刷电路板的方法，该方法包括：在分离构件的两侧上设置第一和第二绝缘构件以及第一和第二导电膜，以在第一和第二构件上执行热压接合处理 绝缘构件以及分隔构件的两侧上的第一和第二导电膜，从而通过其间的分隔构件将第一构件附接到第二构件，并将第一绝缘构件附接到第一导电膜并附接第二绝缘体 选择性地去除第一和第二导电膜以形成第一和第二电路图案，并且切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案分离 从分离成员。

公开(公告)号：WO2009108030A3

公开(公告)日：2009-11-26

申请号：PCT/KR2009001010

申请日：2009-03-02

Applicant: LG MICRON LTD ,  YOON HYE SUN ,  CHOI JAE BONG ,  LEE EUN JUNG ,  HWANG JUNG HO ,  HAN JOON WOOK

Inventor： YOON HYE SUN ,  CHOI JAE BONG ,  LEE EUN JUNG ,  HWANG JUNG HO ,  HAN JOON WOOK

IPC: H05K3/22 ,  H05K1/02

CPC classification number: H05K3/0097 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/0052 ,  H05K3/06 ,  H05K3/107 ,  H05K3/244 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/1536

Abstract: Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.

Abstract translation: 提供一种制造印刷电路板的方法，包括：在分离部件的两侧设置第一绝缘部件和第二绝缘部件以及第一导电膜和第二导电膜，对第一绝缘部件和第二绝缘部件进行热压接， 在所述分离构件的两侧上形成膜，以将所述第一构件与所述分隔构件连接在所述第二构件上，并将所述第一绝缘构件附接到所述第一导电膜，并且将所述第二绝缘构件附接到所述第二导电膜， 去除第一和第二导电膜以形成第一和第二电路图案，以及切割分离构件和第一和第二绝缘构件，以使第一和第二绝缘构件与第一和第二电路图案与分离构件分离。