Abstract:
Disclosed herein is a lead frame. The lead frame comprises: a plurality of leads electrically connected to a semiconductor chip; a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads, and an adhesive layer disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads; and at least one line electrically connecting the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
Abstract:
Disclosed is a rear plate of a plasma display panel. In the rear plate, a dielectric layer or a barrier wall layer is formed by forming slurry in a tape of a green tape and then attaching the green tape to upper surfaces of electrodes and a glass substrate. Therefore, a PDP employing a rear plate according to the present invention has superior electric and optical characteristics.
Abstract:
A method for forming a fine pattern using isotropic etching, includes the steps of forming an etching layer on a semiconductor substrate, and coating a photoresist layer on the etching layer, performing a lithography process with respect to the etching layer coated with the photoresist layer, and performing a first isotropic etching process with respect to the etching layer including a photoresist pattern formed through the lithography process, depositing a passivation layer on the etching layer including the photoresist pattern, and performing a second isotropic etching process with respect to the passivation layer. The second isotropic etching process is directly performed without removing the predetermined portion of the passivation layer.
Abstract:
Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.
Abstract:
Disclosed herein is an X-ray detector using a gas type detecting method without the provision of a thin film transistor or partitions of a plasma display panel (PDP), whereby the convenience in manufacturing the X-ray detector is improved, the manufacturing costs of the X-ray detector are reduced, and, at the same time, the sensitivity of the X-ray detector is greatly improved. Also, there is provided an X-ray detecting method capable of accomplishing easy manufacture of micro pixels through the use of a plurality of electrode lines and epochally improving the convenience in information detection therethrough, thereby efficiently collecting image in¬ formation with respect to even a large-sized substrate. According to the present invention, isolation films are formed to partition pixels without the interference between the upper and lower pixels and between the right and left pixels, whereby a high-quality image is acquired. Also, the X-ray detector is capable of reading out a detection signal through three separate electrodes, without using a thin film transistor, based on the gas type detecting method, thereby reducing the manufacturing costs of the X-ray detector, improving the convenience in use of the X-ray detector, and providing a digital radioactive ray image with a high degree of efficiency.
Abstract:
Disclosed are a half tone mask having a multi semi-transmission part and a manufacturing method thereof that can pattern a plurality of layers using one mask, by having at least two or more semi-transmission parts with light transmission that are different from each other. The half tone mask having a multi semi-transmission part comprises a transparent substrate, a light transmission part formed the transparent substrate to transmit irradiation light of a predetermined wavelength band, a light shielding part formed the transparent substrate to shield the irradiation light of the predetermined wavelength band, and at least two or more semi-transmission parts formed by depositing semi-transmission material on the transparent substrate to pass through the irradiation light of the predetermined wavelength band with each different light transmission.
Abstract:
This invention relates to a plating type optical filter and a method of manufacturing the same, and in particular, to a plating type optical filter, manufactured using a plating process to thus be thin and highly light-transmissive, and to a method of manufacturing the same. The plating type optical filter includes a transparent substrate, a metal seed layer formed on the transparent substrate, and an electroplating layer formed on the metal seed layer. In this invention, because no adhesive is used, conventional problems caused by the use of an adhesive, including low transparency and poor light transmission of an optical filter, are solved. The plating process is applied to thus prevent the unnecessary waste of material, which is usual in a lamination process, therefore improving product performance and realizing cost reduction, resulting in increased product competitiveness.
Abstract:
Disclosed herein is a lead frame. The lead frame comprises: a plurality of leads electrically connected to a semiconductor chip; a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads, and an adhesive layer disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads; and at least one line electrically connecting the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability.
Abstract:
Disclosed is a rear plate of a plasma display panel. In the rear plate, barrier ribs are formed by etching a baked barrier rib layer, so that the completed barrier ribs have no deformation and the electrodes can be exactly located at central portions between the barrier ribs. In a PDP having a front plate to a rear plate attached to each other, the PDP shows improvements in both optical characteristics, such as average brightness, color temperature, and contrast, and electric characteristics, such as voltage margin, power consumption, and efficiency.
Abstract:
Provided is a method of manufacturing a printed circuit board including, disposing first and second insulating members and first and second conductive films on both sides of a separating member to perform a thermocompression bonding process on the first and second insulating members and the first and second conductive films on the both sides of the separating member, so as to attach the first member to the second member with the separating member therebetween and attach the first insulating member to the first conductive film and attach the second insulating member to the second conductive film, selectively removing the first and second conductive films to form first and second circuit patterns, and cutting the separating member and the first and second insulating members to separate the first and second insulating members with the first and second circuit patterns from the separating member.