公开(公告)号：WO2013012594A1

公开(公告)日：2013-01-24

申请号：PCT/US2012/046008

申请日：2012-07-10

Applicant: TYCO ELECTRONICS CORPORATION ,  LIU, Zhengwei ,  HILTY, Robert Daniel

Inventor： LIU, Zhengwei ,  HILTY, Robert Daniel

IPC: C25D3/64 ,  C25D5/12 ,  C25D7/00 ,  H01H1/023

CPC classification number: C25D3/64 ,  C25D5/12 ,  C25D7/00 ,  H01H2011/046

Abstract: A method (100) for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil (104) or other contaminants and exposing the electrical contact to at least one of an acid or base (108). The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating (112) the electrical contact in the silver plating bath.

Abstract translation: 提供了一种用于对电接触进行镀银的方法（100）。 该方法包括通过去除油（104）或其它污染物并将电接触暴露于酸或碱（108）中的至少一种来清洁电接触。 该方法还包括制备包含银化合物，过渡金属化合物和支持盐的银镀浴，其中过渡金属是镍或钴中的至少一种。 该方法还包括镀银（112）银镀浴中的电接触。

公开(公告)号：WO2010144126A2

公开(公告)日：2010-12-16

申请号：PCT/US2010/001644

申请日：2010-06-08

Applicant: TYCO ELECTRONICS CORPORATION ,  CHOU, George, Jyh-Shann ,  HILTY, Robert, Daniel

Inventor： CHOU, George, Jyh-Shann ,  HILTY, Robert, Daniel

IPC: B23K31/02 ,  B23K37/04 ,  B23K37/00

CPC classification number: B23K1/0016 ,  B23K1/012 ,  B23K1/015 ,  B23K3/00 ,  B23K2201/42 ,  C23C14/16 ,  C23C14/56 ,  C23C14/5806 ,  H01L21/67721 ,  H01L21/6776

Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.

Abstract translation: 一种用于制造电气部件的系统包括具有入口和出口的回流室。 入口端口将具有导电涂层的相互连接的电气部件的腹板接纳到回流室中。 出口将回流焊管排出。 回流室将互连的电气部件的腹板沿着预定的通路引导通过回流室。 当纸幅沿着通过室的路径通过时，回流室保持加热和饱和的蒸气以加热导电涂层，以围绕电气部件回流导电涂层。

公开(公告)号：WO2012154374A1

公开(公告)日：2012-11-15

申请号：PCT/US2012/033886

申请日：2012-04-17

Applicant: TYCO ELECTRONICS CORPORATION ,  CHOU, George Jyh-Shann ,  HILTY, Robert Daniel

Inventor： CHOU, George Jyh-Shann ,  HILTY, Robert Daniel

IPC: C23C28/02

CPC classification number: H01B1/02 ,  C23C28/02 ,  C23C28/023 ,  C23C28/028 ,  Y10T428/12479 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12889 ,  Y10T428/12944

Abstract: An electrical conductor (100) has a metal substrate (102). A seal plating layer (104) is provided on and exterior of the metal substrate. A nickel plating layer (106) is provided on and exterior of the seal plating layer. A gold plating layer (108) is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interfaces (112, 114) with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract translation: 电导体（100）具有金属基板（102）。 在金属基板的外部设有密封电镀层（104）。 在密封镀层的外部和外部设置镀镍层（106）。 在镀镍层的外部设置镀金层（108）。 密封镀层是非镍基金属。 可选地，密封镀层可以是锡基的。 可选地，密封镀层可以与镍镀层和金属基底形成金属间界面（112,114）。 可选地，电导体可以构成用于与印刷电路板或另一配合触点中的至少一个配合的触点。

公开(公告)号：WO2010144126A3

公开(公告)日：2011-04-07

申请号：PCT/US2010001644

申请日：2010-06-08

Applicant: TYCO ELECTRONICS CORP ,  CHOU GEORGE JYH-SHANN ,  HILTY ROBERT DANIEL

Inventor： CHOU GEORGE JYH-SHANN ,  HILTY ROBERT DANIEL

IPC: C23C14/58 ,  B23K1/00 ,  B23K1/015 ,  C23C16/56

CPC classification number: B23K1/0016 ,  B23K1/012 ,  B23K1/015 ,  B23K3/00 ,  B23K2201/42 ,  C23C14/16 ,  C23C14/56 ,  C23C14/5806 ,  H01L21/67721 ,  H01L21/6776

Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.

Abstract translation: 一种用于制造电气部件的系统包括具有入口和出口的回流室。 入口端口将具有导电涂层的相互连接的电气部件的腹板接纳到回流室中。 出口将回流焊管排出。 回流室将互连的电气部件的腹板沿预定的通路引导通过回流室。 当纸幅沿着通过室的路径通过时，回流室保持加热和饱和的蒸气以加热导电涂层，以围绕电气部件回流导电涂层。