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    FRACTURE RESISTANT METALLIZATION PATTERN FOR SEMICONDUCTOR LASERS
    1.
    发明申请
    FRACTURE RESISTANT METALLIZATION PATTERN FOR SEMICONDUCTOR LASERS 审中-公开
    用于半导体激光器的耐断裂金属化模式

    公开(公告)号：WO2010123807A1

    公开(公告)日：2010-10-28

    申请号：PCT/US2010/031573

    申请日：2010-04-19

    Applicant: CORNING INCORPORATED ,  CHAPARALA, Satish, C ,  HU, Martin, H ,  HUGHES, Lawrence, C., Jr. ,  ZAH, Chung-En

    Inventor： CHAPARALA, Satish, C ,  HU, Martin, H ,  HUGHES, Lawrence, C., Jr. ,  ZAH, Chung-En

    IPC: H01S5/022 ,  H01L21/50

    CPC classification number: H01S5/0425 ,  H01S5/0092 ,  H01S5/06256

    Abstract: Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.

    Abstract translation: 提供金属化模式以减少半导体激光器中芯片断裂的可能性。 根据本文公开的一个实施例，金属化图案的焊盘边缘延伸穿过激光基板中的多个结晶平面。 以这种方式，在任何给定的应力集中开始的裂纹将需要传播到衬底中的许多结晶平面以达到显着的尺寸。 本公开的另外的实施例涉及相邻的接触垫对的各自的几何形状和取向。 公开和要求保护的另外的实施例。

    SEMICONDUCTOR LASER PACKAGES
    2.
    发明申请
    SEMICONDUCTOR LASER PACKAGES 审中-公开
    半导体激光器包

    公开(公告)号：WO2009151558A1

    公开(公告)日：2009-12-17

    申请号：PCT/US2009/003415

    申请日：2009-06-05

    Applicant: CORNING INCORPORATED ,  CHAPARALA, Satish, C. ,  HUGHES, Lawrence, C., Jr.

    Inventor： CHAPARALA, Satish, C. ,  HUGHES, Lawrence, C., Jr.

    IPC: H01L29/167

    CPC classification number: H01S5/02216 ,  H01S5/005 ,  H01S5/0092 ,  H01S5/02469 ,  H01S5/02492

    Abstract: A laser package may include a metallic platform, a laser diode mounting insert, a liquid crystal polymer header, an electrical interconnect, a laser diode, an optical crystal, and coupling optics. The laser diode mounting insert, coupling optics and optical crystal are coupled to the metallic platform. The electrical interconnect may have conductive pads positioned on an internal portion of the electrical interconnect and conductive traces originating from the conductive pads and running across an external portion of the electrical interconnect. The internal portion may be coupled to the metallic platform. The laser diode may be mounted to the laser diode mounting insert. The coupling optics may be configured to redirect the output beam toward the optical crystal. The liquid crystal polymer at least partially encloses the metallic platform. The liquid crystal polymer may be coupled to the metallic platform and electrical interconnect via an adhesive promoter.

    Abstract translation: 激光器封装可以包括金属平台，激光二极管安装插件，液晶聚合物集管，电互连，激光二极管，光学晶​​体和耦合光学器件。 激光二极管安装插件，耦合光学器件和光学晶体耦合到金属平台。 电互连可以具有定位在电互连的内部部分上的导电焊盘和源自导电焊盘并穿过电互连的外部部分的导电迹线。 内部部分可以联接到金属平台。 激光二极管可以安装到激光二极管安装插件。 耦合光学器件可以被配置为将输出光束重定向到光学晶体。 液晶聚合物至少部分地包围金属平台。 液晶聚合物可以通过粘合促进剂偶联到金属平台和电互连。

    EDGE BONDED OPTICAL PACKAGES
    3.
    发明申请
    EDGE BONDED OPTICAL PACKAGES 审中-公开
    边缘粘合光学包装

    公开(公告)号：WO2010138481A3

    公开(公告)日：2012-03-15

    申请号：PCT/US2010036021

    申请日：2010-05-25

    Applicant: CORNING INC ,  BHAGAVATULA VENKATA A ,  CHAPARALA SATISH C ,  HIMMELREICH JOHN ,  HUGHES LAWRENCE C JR

    Inventor： BHAGAVATULA VENKATA A ,  CHAPARALA SATISH C ,  HIMMELREICH JOHN ,  HUGHES LAWRENCE C JR

    IPC: H01S5/022 ,  G02B6/42

    CPC classification number: G02B6/4245 ,  G02B6/4207 ,  G02B6/4228 ,  G02B6/4244 ,  G02B6/4265 ,  G02F1/37 ,  H01S5/0092 ,  H01S5/02216 ,  H01S5/02252

    Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.

    Abstract translation: 本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源非常接近，以消除对光耦合的需要，减少封装部件的数量并减小封装体积。 根据本公开的一个实施例，提供了一种光学封装，其包括激光源子组件，其包括激光基座和包括转换器基座的波长转换器件子组件。 激光器基座的接合界面被接合到转换器基座的互补接合界面，使得激光输出面可以以预定的界面间距x邻近耦合到转换器输入面。 公开和要求保护附加实施例。

    EDGE BONDED OPTICAL PACKAGES
    4.
    发明申请
    EDGE BONDED OPTICAL PACKAGES 审中-公开
    边缘粘合光学包装

    公开(公告)号：WO2010138481A2

    公开(公告)日：2010-12-02

    申请号：PCT/US2010/036021

    申请日：2010-05-25

    Applicant: CORNING INCORPORATED ,  BHAGAVATULA, Venkata, A. ,  CHAPARALA, Satish, C. ,  HIMMELREICH, John ,  HUGHES, Lawrence, C., Jr.

    Inventor： BHAGAVATULA, Venkata, A. ,  CHAPARALA, Satish, C. ,  HIMMELREICH, John ,  HUGHES, Lawrence, C., Jr.

    IPC: H01S5/022

    CPC classification number: G02B6/4245 ,  G02B6/4207 ,  G02B6/4228 ,  G02B6/4244 ,  G02B6/4265 ,  G02F1/37 ,  H01S5/0092 ,  H01S5/02216 ,  H01S5/02252

    Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.

    Abstract translation: 本公开的特定实施例使得SHG晶体或其它类型的波长转换装置与激光源紧密相邻以消除对光耦合的需要，减少封装部件的数量并减小封装体积。 根据本公开的一个实施例，提供了一种光学封装，其包括激光源子组件，其包括激光基座和包括转换器基座的波长转换器件子组件。 激光器基座的接合界面与转换器基座的互补接合界面结合，使得激光输出面可以以预定的界面间距x接近耦合到转换器输入面。 公开并要求保护附加实施例。

    FOLDED ADJUSTABLE OPTICAL PATH IN A FREQUENCY DOUBLED SEMICONDUCTOR LASER
    5.
    发明申请
    FOLDED ADJUSTABLE OPTICAL PATH IN A FREQUENCY DOUBLED SEMICONDUCTOR LASER 审中-公开
    频率双倍半导体激光器中可折叠的可调光学路径

    公开(公告)号：WO2009151559A1

    公开(公告)日：2009-12-17

    申请号：PCT/US2009/003418

    申请日：2009-06-05

    Applicant: CORNING INCORPORATED ,  ALMORIC, Etienne ,  GOLLIER, Jacques ,  HUGHES, Lawrence, C., Jr. ,  PIECH, Garrett, A.

    Inventor： ALMORIC, Etienne ,  GOLLIER, Jacques ,  HUGHES, Lawrence, C., Jr. ,  PIECH, Garrett, A.

    IPC: G02B6/42

    CPC classification number: G02B6/4214 ,  G01B11/272 ,  G02F1/377 ,  G02F2001/3546 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/0092

    Abstract: An optical package includes a semiconductor laser, a wavelength conversion device and a MEMS-actuated mirror oriented on a base module to form a folded optical pathway between an output of the semiconductor laser and an input of the wavelength conversion device. An optical assembly is located in a mechanical positioning device and the mechanical positioning device is disposed on the base module along the optical pathway such that the beam of the semiconductor laser passes through the optical assembly, is reflected by the MEMS-actuated mirror back through the optical assembly and into the waveguide portion of the wavelength conversion device. The MEMS-actuated mirror is operable to scan the beam of the semiconductor laser over the input of the wavelength conversion device. The optical assembly may be adjusted along the optical pathway with the mechanical positioning device to focus the beam into the waveguide portion of the wavelength conversion device.

    Abstract translation: 光学封装包括半导体激光器，波长转换器件和面向基底模块的MEMS致动镜，以在半导体激光器的输出端与波长转换器件的输入端之间形成折叠光路。 光学组件位于机械定位装置中，并且机械定位装置沿着光学路径设置在基座模块上，使得半导体激光器的光束通过光学组件，被MEMS致动的反射镜反射回通过 光学组件并进入波长转换装置的波导部分。 MEMS致动反射镜可操作以通过波长转换装置的输入来扫描半导体激光束的光束。 光学组件可以利用机械定位装置沿光学路径调节，以将光束聚焦到波长转换装置的波导部分中。

    CLADDING-PUMPED QUASI 3-LEVEL FIBER LASER/AMPLIFIER
    8.
    发明申请
    CLADDING-PUMPED QUASI 3-LEVEL FIBER LASER/AMPLIFIER 审中-公开
    CLADDING-PUMPED QUASI 3级光纤激光/放大器

    公开(公告)号：WO2005048418A8

    公开(公告)日：2007-03-15

    申请号：PCT/US2004037447

    申请日：2004-11-08

    Applicant: CORNING INC ,  HUGHES LAWRENCE C JR ,  LIU XINGSHENG ,  WALTON DONNELL T ,  ZAH CHUNG-EN ,  ZENTENO LUIS A

    Inventor： HUGHES LAWRENCE C JR ,  LIU XINGSHENG ,  WALTON DONNELL T ,  ZAH CHUNG-EN ,  ZENTENO LUIS A

    IPC: H01S3/067 ,  H01S3/094 ,  H01S3/0941

    CPC classification number: H01S3/06708 ,  H01S3/067 ,  H01S3/06716 ,  H01S3/094 ,  H01S3/094007 ,  H01S3/09415 ,  H01S5/2036

    Abstract: An optically active fiber (30) is disclosed for making a fiber laser (18) or an amplifier (16) for optically pumping by a broad area laser diode for operation in the 1.5 micron band. This double-clad structured active fiber (30) has a core (34), doped with an optically excitable erbium ion having a quasi-three-level transition. The core (34) has a core refractive index and a core cross-sectional area. An inner cladding (32) surrounds the core (34). The inner cladding (32) has an inner cladding refractive index less than the core refractive index, an inner cladding cross-sectional area between 2 and 25 times greater than that of the core cross-sectional area, and an aspect ratio greater than 1.5:1. An outer cladding (36) surrounds the inner cladding (32) and has an outer cladding refractive index less than the inner cladding refractive index.

    Abstract translation: 公开了一种用于制造光纤激光器（18）或放大器（16）的光学有源光纤（30），用于通过广域激光二极管光学泵浦以在1.5微米波段内操作。 这种双包层结构的有源光纤（30）具有掺杂有具有准三电平转换的光学可激发的铒离子的芯（34）。 芯（34）具有芯折射率和芯横截面积。 内包层（32）围绕芯部（34）。 内包层（32）具有小于芯折射率的内包层折射率，内包层横截面积比核心横截面积大2至25倍，纵横比大于1.5： 1。 外包层（36）围绕内包层（32）并且具有小于内包层折射率的外包层折射率。

    A BALL COAX INTERCONNECT
    9.
    发明申请
    A BALL COAX INTERCONNECT 审中-公开
    球同轴互连

    公开(公告)号：WO2006110523A2

    公开(公告)日：2006-10-19

    申请号：PCT/US2006/013013

    申请日：2006-04-04

    Applicant: CORNING INCORPORATED ,  HENNING, Larry C ,  HUGHES, Lawrence C Jr. ,  MATTHEWS, Karen I ,  NAIR, Deepukumar M

    Inventor： HENNING, Larry C ,  HUGHES, Lawrence C Jr. ,  MATTHEWS, Karen I ,  NAIR, Deepukumar M

    IPC: H01P5/02 ,  H01P1/00

    CPC classification number: H05K1/025 ,  H01L2223/6622 ,  H01P3/06 ,  H01P5/085 ,  H05K1/0222 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/09809

    Abstract: A pseudo-coaxial vertical transition (10) includes a substrate (16). A bump array is disposed in a substantially concentric bump pattern upon the substrate (16) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump (32) having a predetermined bump diameter, and a plurality of at least five ground bumps (36) substantially equi-distant and circularly disposed about the centrally disposed bump (32). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.

    Abstract translation: 伪同轴垂直转变（10）包括衬底（16）。 在衬底（16）上以基本上同心的凸点图案设置凸点阵列，用于模拟伪同轴垂直电磁波传播。 凸块阵列由具有预定凸块直径的中央设置的凸块（32）以及基本上等间距且围绕中央设置的凸块（32）环形设置的多个至少五个接地凸块（36）形成。 相对于多个接地凸块和空气的介电常数来确定中央设置的凸块的预定凸块直径和凸块间距，以提供特性阻抗。

    A BALL COAX INTERCONNECT
    10.
    发明申请
    A BALL COAX INTERCONNECT 审中-公开
    BALL COAX INTERCONNECT

    公开(公告)号：WO2006110523A3

    公开(公告)日：2006-11-30

    申请号：PCT/US2006013013

    申请日：2006-04-04

    Applicant: CORNING INC ,  HENNING LARRY C ,  HUGHES LAWRENCE C JR ,  MATTHEWS KAREN I ,  NAIR DEEPUKUMAR M

    Inventor： HENNING LARRY C ,  HUGHES LAWRENCE C JR ,  MATTHEWS KAREN I ,  NAIR DEEPUKUMAR M

    IPC: H01P1/04 ,  H01P5/02

    CPC classification number: H05K1/025 ,  H01L2223/6622 ,  H01P3/06 ,  H01P5/085 ,  H05K1/0222 ,  H05K3/3436 ,  H05K2201/09618 ,  H05K2201/09809

    Abstract: A pseudo-coaxial vertical transition (10) includes a substrate (16). A bump array is disposed in a substantially concentric bump pattern upon the substrate (16) for simulating a pseudo-coaxial vertical electromagnetic wave propagation. The bump array is formed from a centrally disposed bump (32) having a predetermined bump diameter, and a plurality of at least five ground bumps (36) substantially equi-distant and circularly disposed about the centrally disposed bump (32). The predetermined bump diameter and a bump spacing of the centrally disposed bump are determined in relation to the plurality of ground bumps and a dielectric constant of air for providing a characteristic impedance.

    Abstract translation: 伪同轴垂直过渡（10）包括衬底（16）。 凸块阵列以基本同心的凸起图案设置在基板（16）上，用于模拟伪同轴垂直电磁波传播。 凸块阵列由具有预定凸块直径的中心设置的凸块（32）形成，并且多个至少五个接地凸块（36）围绕中心设置的凸块（32）基本上相等且圆形地设置。 相对于多个接地凸起和用于提供特性阻抗的空气的介电常数来确定中心设置的凸起的预定凸起直径和凸起间隔。

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