公开(公告)号：WO2006065539A3

公开(公告)日：2006-06-22

申请号：PCT/US2005/043399

申请日：2005-11-29

Applicant: ADVANCED MICRO DEVICES, INC. ,  KALUZNI, Heiko ,  HUSCHKA, Andreas

Inventor： KALUZNI, Heiko ,  HUSCHKA, Andreas

IPC: H05K1/02

Abstract: A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.

公开(公告)号：WO2006065539A2

公开(公告)日：2006-06-22

申请号：PCT/US2005043399

申请日：2005-11-29

Applicant: ADVANCED MICRO DEVICES INC ,  KALUZNI HEIKO ,  HUSCHKA ANDREAS

Inventor： KALUZNI HEIKO ,  HUSCHKA ANDREAS

IPC: H05K1/02

CPC classification number: H05K1/0251 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/66 ,  H01L24/10 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01021 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/0222 ,  H05K1/0298 ,  H05K1/113 ,  H05K2201/09536 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09809 ,  H05K2201/10674 ,  Y10T29/49126

Abstract: A high frequency multi-layer printed circuit board, according to the present invention, comprises a through connection having an impedance adapting structure surrounding the through connection and enabling an adjustment of the characteristic impedance of the through connection to a desired value. Thus, high frequency signals may be led through the printed circuit board with reduced signal deformation. The high frequency multi-layer printed circuit board is applicable for high frequency signals up to the GHz-range.

Abstract translation: 根据本发明的高频多层印刷电路板包括具有围绕穿通连接的阻抗适配结构的直通连接，并且能够将通孔连接的特性阻抗调整到期望值。 因此，高频信号可以通过印刷电路板引导，信号变形减小。 高频多层印刷电路板适用于高达GHz范围的高频信号。