Abstract:
A pull-down MOSFET (110) is coupled between a drain and gate of a MOSFET main switch transistor (102) in a switching type DC-to-DC power converter. A gate of the pull-down MOSFET (110) is coupled to the drain of the main switch transistor (102) by a capacitor 118 and is connected to a source of the main switch transistor (102) by a resistor (120). The pull-down MOSFET (110) is operated by capacitive coupling to the voltage drop across the main switch transistor (102) and can be used to hold the gate of the main switch transistor (102) at or near its source potential to avoid or reduce unintentional turn-on of the main switch transistor (102) by the Miller effect.
Abstract:
In an emitter-switched thyristor with a main thyristor (TH) composed of a p+ anode emitter (1), a drift zone (3') of opposite conductivity type, a zone (4) which has in the switched-off state a blocking zone with respect to zone (3) and an emitter zone (5) at the cathode side, again with an opposite conductivity type, so that a p+n-pn+ zone sequence results, a transistor structure (T) composed of the first three zones of alternating conductivity is provided in parallel thereto with an emitter (1), a base (3) and a collector (8). This structure contains a NMOSFET (M1) for directly driving the cathode emitters (5) through the cathode connection (KA). The source of this transistor is contacted by the cathode, as well as the collector zone (8) which forms the channel zone of the MOSFET at the surface of the semiconductor. The corresponding drain zone is connected to the n+ cathode emitter (5) of the main thyristor (TH) by an electric conductor (6). A switching-in DMOSFET (M2) is further provided whose gate (G2) is connected to the gate (G1) of the NMOSFET (M1), a source (S2) contacted by the cathode (K) and embedded in a p-base. A conductive connection is established with the cathode contact of the switching-in NMOSFET (M1), and the common connection extends up to a cathode connection (KA). A drain zone (D2) is embedded in the drift zone (3) and the substrate zones of M1 and M2 are in contact with the cathode. The structure contains a PMOSFET (M3) whose gate is connected to the cathode, whose drain (D3) forms a part of the collector zone (8) of the transistor (T) for the secondary current, whose source zone is connected to the base zone (4) of the main thyristor (TH) next to the cathode and whose substrate zone is formed by a part of the n-doped zone (3) adjacent to the surface of the component.
Abstract:
The invention relates to a power field effect transistor with a drain contact on a substrate, a drift region, a gate and a source contact, in which the electrode arrangement of the field effect transistor is predominantly vertical with a buried gate, where the channel region (5) runs substantially laterally along the buried gate region (7) and the upper gate (20) and is connected to the drift region (4) via a connecting region (18) and a conductive region (14).
Abstract:
In order to combine the good transmission characteristics and good control characteristics of a MOS-controlled thyristor (MCT) wiht the resistance to shorting of an insulated-gate transistor (IGT), at the same time broadening the safe operating area (SOA), the invention calls for one or more auxiliary emitter zones (7), which have no external electrical contacts but are controlled by non-dissipative field-effect techniques, to be integrated with each other. The cathode-contacted emitter (6) extends over the whole cathode contact (10) and forms, together with the second base region (4, 5), a diode structure. When a control signal is sent to the integrated MOS-FET, the auxiliary emitter (7) and the integrated diode (4, 6) ensure that flooding of the component with charge carriers is intensified. The second base region can include a voltage pick-up zone (3). In this case, the first base region (2) is more highly doped than the voltage pick-up zone (3).
Abstract:
A power MOSFET (202) is formed in a semiconductor device (200) with a parallel combination of a shunt resistor (208) and a diode-connected MOSFET (210) between a gate input node (204) of the semiconductor device and a gate (206) of the power MOSFET. A gate (212) of the diode-connected MOSFET is connected to the gate (206) of the power MOSFET. Source and drain nodes (216, 214) of the diode-connected MOSFET are connected to a source node (218) of the power MOSFET through diodes (220). The drain node of the diode-connected MOSFET is connected to the gate input node (204) of the semiconductor device. The source node(216) of the diode-connected MOSFET is connected to the gate (206) of the power MOSFET. The power MOSFET and the diode-connected MOSFET are integrated into the substrate of the semiconductor device so that the diode- connected MOSFET source and drain nodes (216, 214) are electrically isolated from the power MOSFET source node (218) through a pn junction.
Abstract:
In an emitter-switched thyristor with a main thyristor (TH) composed of a p+ anode emitter (1), a drift zone (3') of opposite conductivity type, a zone (4) which has in the switched-off state a blocking zone with respect to zone (3) and an emitter zone (5) at the cathode side, again with an opposite conductivity type, so that a p+n-pn+ zone sequence results, a transistor structure (T) composed of the first three zones of alternating conductivity is provided in parallel thereto with an emitter (1), a base (3) and a collector (8). This structure contains a NMOSFET (M1) for directly driving the cathode emitters (5) through the cathode connection (KA). The source of this transistor is contacted by the cathode, as well as the collector zone (8) which forms the channel zone of the MOSFET at the surface of the semiconductor. The corresponding drain zone is connected to the n+ cathode emitter (5) of the main thyristor (TH) by an electric conductor (6). A switching-in DMOSFET (M2) is further provided whose gate (G2) is connected to the gate (G1) of the NMOSFET (M1), a source (S2) contacted by the cathode (K) and embedded in a p-base. A conductive connection is established with the cathode contact of the switching-in NMOSFET (M1), and the common connection extends up to a cathode connection (KA). A drain zone (D2) is embedded in the drift zone (3) and the substrate zones of M1 and M2 are in contact with the cathode. The structure contains a PMOSFET (M3) whose gate is connected to the cathode, whose drain (D3) forms a part of the collector zone (8) of the transistor (T) for the secondary current, whose source zone is connected to the base zone (4) of the main thyristor (TH) next to the cathode and whose substrate zone is formed by a part of the n-doped zone (3) adjacent to the surface of the component.
Abstract:
The invention concerns a field-effect-controlled semiconductor component with at least four zones of alternating opposite conduction types, an emitter region at the anode end, a first and a second base region adjacent to the emitter region, an emitter region at the cathode end and an additional adjacent emitter region, plus an anode contact, a contact with the emitter region at the cathode end and a MOS field-effect transistor control-electrode contact. The cathode-end emitter region and the adjacent emitter region form the source and drain of a MOS field-effect transistor. The part (34, 36) of the cathode-end base region which is adjacent to the emitter region (44) of a main thyristor, or a separate highly p-doped region (38) adjacent to the cathode-end base region, is connected to the cathode contact (72) by an integrated component (D) with a non-linear current/voltage characteristic.
Abstract:
A power MOSFET (202) is formed in a semiconductor device (200) with a parallel combination of a shunt resistor (208) and a diode-connected MOSFET (210) between a gate input node (204) of the semiconductor device and a gate (206) of the power MOSFET. A gate (212) of the diode-connected MOSFET is connected to the gate (206) of the power MOSFET. Source and drain nodes (216, 214) of the diode-connected MOSFET are connected to a source node (218) of the power MOSFET through diodes (220). The drain node of the diode-connected MOSFET is connected to the gate input node (204) of the semiconductor device. The source node(216) of the diode-connected MOSFET is connected to the gate (206) of the power MOSFET. The power MOSFET and the diode-connected MOSFET are integrated into the substrate of the semiconductor device so that the diode- connected MOSFET source and drain nodes (216, 214) are electrically isolated from the power MOSFET source node (218) through a pn junction.
Abstract:
A pull-down MOSFET (110) is coupled between a drain and gate of a MOSFET main switch transistor (102) in a switching type DC-to-DC power converter. A gate of the pull-down MOSFET (110) is coupled to the drain of the main switch transistor (102) by a capacitor 118 and is connected to a source of the main switch transistor (102) by a resistor (120). The pull-down MOSFET (110) is operated by capacitive coupling to the voltage drop across the main switch transistor (102) and can be used to hold the gate of the main switch transistor (102) at or near its source potential to avoid or reduce unintentional turn-on of the main switch transistor (102) by the Miller effect.
Abstract:
The invention concerns a semiconductor component which can be controlled on the anode side and whose semiconductor body comprises a plurality of adjacent, parallel-connected unit cells having a thyristor structure. A lightly doped n-base region (3) is adjoined on both sides by highly doped p-regions constituting p-base region (2) and p-emitter region (4). The p-base region (2) is followed by a highly doped n-emitter region (1) which contacts a cathode electrode (7). Integrated in the p-emitter region (4) is a first n-channel MOSFET (M1) which is connected in series with the thyristor structure by means of a floating electrode (FE). The drain electrode (5b) of the first MOSFET (M1) is provided with an outer anode (8) which has no contact with the p-emitter region (4). A second n-channel MOSFET (M2) is integrated between the n-base region (3) and the drain region (5b) of the first MOSFET (M1).