公开(公告)号：WO2008136895A1

公开(公告)日：2008-11-13

申请号：PCT/US2008/004488

申请日：2008-04-04

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DELARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fritz, C.

Inventor： FREER, Erik, M. ,  DELARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fritz, C.

IPC: H01L21/465

CPC classification number: H01L21/02057 ,  H01L21/02052 ,  H01L21/67034 ,  H01L21/67057 ,  H01L21/67751

Abstract: A method and system for cleaning opposed surfaces of a semiconductor wafer having particulate matter thereon. The method includes generating relative movement between a fluid and the substrate. The relative movement is in a direction that is transverse to a normal to one of the opposed surfaces and creates two spaced-apart flows. Each of the flows is adjacent to one of the opposed surfaces that is different from the opposed surface that is adjacent to the remaining flow of the plurality of flows. The fluid has coupling elements entrained therein, and the relative movement is established to impart sufficient drag upon a subset of the coupling elements to create movement of the coupling elements of the subset within the fluid. In this manner, a quantity of the drag is imparted upon the particulate matter to cause the particulate matter to move with respect to the substrate.

Abstract translation: 一种用于清洁其上具有颗粒物质的半导体晶片的相对表面的方法和系统。 该方法包括产生流体和衬底之间的相对运动。 相对运动在与相对表面之一的法线横向的方向上，并且产生两个间隔开的流动。 每个流体与相对于与多个流动的剩余流动相邻的相对表面不同的一个相对表面相邻。 流体具有夹带在其中的耦合元件，并且建立相对运动以在联接元件的子集上施加足够的阻力以产生该流体内该子集的耦合元件的运动。 以这种方式，将一定量的阻力赋予颗粒物质以使颗粒物质相对于基底移动。

公开(公告)号：WO2008123945A1

公开(公告)日：2008-10-16

申请号：PCT/US2008/004033

申请日：2008-03-27

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DE LARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fritz, C.

Inventor： FREER, Erik, M. ,  DE LARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fritz, C.

IPC: H01L21/304

CPC classification number: B08B3/12 ,  H01L21/67051 ,  H01L21/67057

Abstract: Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.

Abstract translation: 提供了清洁附着在晶片表面上的颗粒污染物的系统和方法。 包括悬浮在清洁介质内的分散的耦合元件的清洁介质被施加在晶片表面上。 外部能量被施加到清洁介质以在介质内产生周期性剪切应力。 周期性剪切应力赋予耦合元件上的动量和/或阻力，导致耦合元件与颗粒污染物相互作用以从晶片表面去除颗粒污染物。

公开(公告)号：WO2011072268A1

公开(公告)日：2011-06-16

申请号：PCT/US2010/059966

申请日：2010-12-10

Applicant: LAM RESEARCH CORPORATION ,  WANG, Yaxin ,  LI, Shijian ,  REDEKER, Fritz ,  PARKS, John ,  KOLICS, Artur ,  YOON, Hyungsuk, Alexander ,  DE FILIPE, Tarek, Suwwan ,  KOROLIK, Mikhail

Inventor： WANG, Yaxin ,  LI, Shijian ,  REDEKER, Fritz ,  PARKS, John ,  KOLICS, Artur ,  YOON, Hyungsuk, Alexander ,  DE FILIPE, Tarek, Suwwan ,  KOROLIK, Mikhail

IPC: H01L21/00

CPC classification number: H01L21/288 ,  C23C18/1642 ,  C23C18/1689 ,  C23C18/1872 ,  H01L21/76849

Abstract: Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate.

Abstract translation: 用于通过包括集成无电沉积工艺的工艺处理衬底的方法和系统包括在无电沉积模块中处理衬底的表面以使用沉积流体在衬底的导电特征上沉积层。 然后用清洗液在无电沉积模块中冲洗基材的表面。 控制冲洗以防止表面的脱湿，使得从冲洗流体限定的转印膜保持涂覆在基材的表面上。 将基底从无电沉积模块移除，同时将转印膜保持在衬底的表面上。 衬底表面上的转印膜防止了衬底表面的干燥，使得去除被弄湿。 一旦从无电镀沉积模块中取出的衬底被移动到后沉积模块中，同时将转印膜保持在衬底的表面上。

公开(公告)号：WO2007078955A3

公开(公告)日：2008-02-07

申请号：PCT/US2006048548

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  MIKHAYLICHENKO KATRINA ,  REDEKER FRED C

IPC: C11D7/32

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

Abstract translation: 提供了制备用于制备基底表面的溶液的方法。 该方法包括提供将聚合物材料添加到连续介质的连续介质。 将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到 通过施加的搅拌超过聚合物材料的屈服应力。 施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

公开(公告)号：WO2007078956A3

公开(公告)日：2008-01-03

申请号：PCT/US2006048552

申请日：2006-12-18

Applicant: LAM RES CORP ,  FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

Inventor： FREER ERIK M ,  DELARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRITZ C

IPC: B08B3/00

CPC classification number: B08B3/024 ,  B08B3/003 ,  B08B3/08 ,  B08B6/00 ,  H01L21/67051

Abstract: A method and system for cleaning a surface, having particulate matter thereon, of a substrate features impinging upon the surface a jet of a liquid having coupling elements entrained therein. A sufficient drag force is imparted upon the coupling elements to have the same move with respect to the liquid and cause the particulate matter to move with respect to the substrate.

Abstract translation: 一种用于清洁其上具有颗粒物质的表面的表面的方法和系统，其特征在于其表面上具有夹带在其中的具有耦合元件的液体的射流。 赋予耦合元件足够的阻力以相对于液体具有相同的移动并使颗粒物质相对于基底移动。

公开(公告)号：WO2007078955A2

公开(公告)日：2007-07-12

申请号：PCT/US2006/048548

申请日：2006-12-18

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DE LARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  MIKHAYLICHENKO, Katrina ,  REDEKER, Fred, C.

Inventor： FREER, Erik, M. ,  DE LARIOS, John, M. ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  MIKHAYLICHENKO, Katrina ,  REDEKER, Fred, C.

IPC: C23G1/00 ,  B08B7/00 ,  B08B7/04 ,  B08B3/00 ,  B08B3/12

CPC classification number: H01L21/6715 ,  B05D3/10 ,  C11D3/14 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C23G1/00 ,  G03F7/42 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/02096 ,  H01L21/67051

Abstract: A method for making a solution for use in preparing a surface of a substrate is provided. The method includes providing a continuous medium that adds a polymer material to the continuous medium. A fatty acid is adding to the continuous medium having the polymer material, and the polymer material defines a physical network that exerts forces in the solution that overcome buoyancy forces experienced by the fatty acid, thus preventing the fatty acids from moving within the solution until a yield stress of the polymer material is exceeded by an applied agitation. The applied agitation is from transporting the solution from a container to a preparation station that applies the solution to the surface of the substrate.

Abstract translation: 提供了制备用于制备基底表面的溶液的方法。 该方法包括提供将聚合物材料添加到连续介质的连续介质。 将脂肪酸加入到具有聚合物材料的连续介质中，并且聚合物材料限定了在溶液中施加力的物理网络，其克服了脂肪酸所经受的浮力，从而防止脂肪酸在溶液中移动直到 通过施加的搅拌超过聚合物材料的屈服应力。 施加的搅拌是将溶液从容器运输到将溶液施加到基材表面的制备工位上。

公开(公告)号：WO2007005230A3

公开(公告)日：2007-04-26

申请号：PCT/US2006023354

申请日：2006-06-15

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  RAVKIN MICHAEL ,  DELARIOS JOHN ,  REDEKER FRITZ C ,  BOYD JOHN M

Inventor： KOROLIK MIKHAIL ,  RAVKIN MICHAEL ,  DELARIOS JOHN ,  REDEKER FRITZ C ,  BOYD JOHN M

IPC: H01L21/00 ,  C03B33/00 ,  H01L21/02 ,  H01L21/64 ,  H01L21/70

CPC classification number: H01L21/67051 ,  G03F7/422 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/6704 ,  Y10S134/902

Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non- Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes theresulting non-Newtonian fluid to remove the material from the semiconductor wafer.

Abstract translation: 压力保持在一定体积内，在该体积内半导体晶片所处的压力足以将前体流体的液态保持为非牛顿流体。 前体流体布置成接近待从半导体晶片移除的材料，同时保持前体流体处于液态。 压力在半导体晶片所处的体积内减小，使得体积内设置在晶片上的前体流体转变成非牛顿流体。 前体流体的膨胀和前体流体相对于晶片在转变成非牛顿流体期间的运动导致所产生的非牛顿流体从半导体晶片上去除材料。

公开(公告)号：WO2007005230A2

公开(公告)日：2007-01-11

申请号：PCT/US2006/023354

申请日：2006-06-15

Applicant: LAM RESEARCH CORPORATION ,  KOROLIK, Mikhail ,  RAVKIN, Michael ,  DELARIOS, John ,  REDEKER, Fritz, C. ,  BOYD, John, M.

Inventor： KOROLIK, Mikhail ,  RAVKIN, Michael ,  DELARIOS, John ,  REDEKER, Fritz, C. ,  BOYD, John, M.

IPC: B08B3/04

CPC classification number: H01L21/67051 ,  G03F7/422 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/6704 ,  Y10S134/902

Abstract: A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non- Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes theresulting non-Newtonian fluid to remove the material from the semiconductor wafer.

Abstract translation: 压力保持在其中半导体晶片所处于的体积内的压力足以将前体流体的液体状态保持为非牛顿流体。 前体流体靠近要从半导体晶片去除的材料设置，同时保持前体流体处于液态。 在半导体晶片所在的体积中的压力降低，使得设置在体积内的晶片上的前体流体转变成非牛顿流体。 在转化成非牛顿流体期间，前体流体的膨胀和前体流体相对于晶片的移动导致了非牛顿流体从半导体晶片去除材料。

公开(公告)号：WO2007079036A3

公开(公告)日：2007-07-12

申请号：PCT/US2006/049109

申请日：2006-12-21

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C.

Inventor： FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C.

IPC: C25F1/00

Abstract: A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.

公开(公告)号：WO2007078642A2

公开(公告)日：2007-07-12

申请号：PCT/US2006/047119

申请日：2006-12-08

Applicant: LAM RESEARCH CORPORATION ,  FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C. ,  THOMAS, Clint ,  PARKS, John

Inventor： FREER, Erik, M. ,  DE LARIOS, John, M. ,  MIKHAYLICHENKO, Katrina ,  RAVKIN, Michael ,  KOROLIK, Mikhail ,  REDEKER, Fred, C. ,  THOMAS, Clint ,  PARKS, John

IPC: C23G1/00 ,  B08B7/00 ,  B08B7/04 ,  B08B3/00 ,  B08B3/12

CPC classification number: H01L21/02057 ,  B05D3/10 ,  B08B7/02 ,  C11D1/04 ,  C11D3/042 ,  C11D3/044 ,  C11D3/18 ,  C11D3/2079 ,  C11D3/222 ,  C11D3/225 ,  C11D3/3765 ,  C11D9/00 ,  C11D9/02 ,  C11D9/267 ,  C11D11/0047 ,  C11D17/0004 ,  C11D17/0013 ,  C11D17/0017 ,  C11D17/003 ,  C11D17/041 ,  C23G1/00 ,  C23G1/18 ,  G03F7/42 ,  G03F7/423 ,  H01L21/02052 ,  H01L21/02096 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/6708 ,  H01L21/67086

Abstract: A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.

Abstract translation: 清洁材料设置在基板上。 清洁材料包括分散在液体介质中的固体组分。 将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。 施加到固体组分的力可以通过液体介质中的不混溶组分施加。 当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。 然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。