公开(公告)号：WO2006035321A3

公开(公告)日：2006-07-20

申请号：PCT/IB2005003992

申请日：2005-05-05

Applicant: UNITED TEST & ASSEMBLY CT LTD ,  KOLAN RAVI KANTH ,  TAN HIEN BOON ,  SUN YI-SHENG ANTHONY ,  KUAN LIM BENG ,  SHIVALINGAM KRISHNAMURTHY

Inventor： KOLAN RAVI KANTH ,  TAN HIEN BOON ,  SUN YI-SHENG ANTHONY ,  KUAN LIM BENG ,  SHIVALINGAM KRISHNAMURTHY

IPC: H01L23/31

CPC classification number: H01L21/566 ,  H01L23/3114 ,  H01L23/4334 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/013

Abstract: A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free form encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.

Abstract translation: 芯片级集成电​​路封装包括具有第一面和第二面的集成电路芯片。 在集成电路芯片的第一面上形成多个柱状凸块。 封装材料封装集成电路芯片的侧面和第一面以及柱状凸块。 柱状凸块的上端保持游离形式的密封剂材料，并且由密封剂材料的上表面和柱状凸块的上端形成基本平坦的表面。 多个焊球安装在与柱状凸块的上端对应的位置上的基本平坦的表面上。

公开(公告)号：WO2006035321A2

公开(公告)日：2006-04-06

申请号：PCT/IB2005/003992

申请日：2005-05-05

Applicant: UNITED TEST AND ASSEMBLY CENTER, LTD. ,  KOLAN, Ravi, Kanth ,  TAN, Hien, Boon ,  SUN, Yi-sheng, Anthony ,  KUAN, Lim, Beng ,  SHIVALINGAM, Krishnamurthy

Inventor： KOLAN, Ravi, Kanth ,  TAN, Hien, Boon ,  SUN, Yi-sheng, Anthony ,  KUAN, Lim, Beng ,  SHIVALINGAM, Krishnamurthy

CPC classification number: H01L21/566 ,  H01L23/3114 ,  H01L23/4334 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2224/13099 ,  H01L2924/013 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free form encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.

Abstract translation: 芯片级集成电​​路封装包括具有第一面和第二面的集成电路芯片。 在集成电路芯片的第一面上形成多个柱状凸块。 封装材料封装集成电路芯片的侧面和第一面以及柱状凸块。 柱状凸块的上端保持自由形式的密封剂材料，并且通过密封剂材料的上表面和柱状凸块的上端形成大致平坦的表面。 多个焊球安装在基本平坦的表面上对应于柱形凸块上端的位置上。