Abstract:
Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.
Abstract:
Embodiments of the present invention provide memory systems having a plurality of memory devices sharing an interface for the transmission of read data. A controller can identify consecutive read requests sent to different memory devices. To avoid data contention on the interface, for example, the controller can be configured to delay the time until read data corresponding to the second read request is placed on the interface.
Abstract:
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die.
Abstract:
Various embodiments include apparatus, systems, and methods having multiple dice arranged in a stack in which a defective cell may be replaced by a spare cell on the same die or a different die.
Abstract:
Embodiments of the present invention provide memory systems having a plurality of memory devices sharing an interface for the transmission of read data. A controller can identify consecutive read requests sent to different memory devices. To avoid data contention on the interface, for example, the controller can be configured to delay the time until read data corresponding to the second read request is placed on the interface.
Abstract:
A memory module includes a memory hub that couples signals to memory devices mounted on opposite first and second surfaces of a memory module substrate. The memory devices are mounted in mirrored configuration with mirrored terminals of memory devices on opposite surfaces being interconnected. A memory hub mounted on each module alters the configuration of address and/or command signals coupled to the memory devices depending upon whether the memory devices on the first surface of the substrate or the memory devices on the second surface of the substrate are being accessed. Alternatively, the configuration of the address and/or command signals coupled to mirrored memory devices may be altered by a register mounted on the substrate that is coupled to the memory devices or by a memory controller coupled directly to memory devices on one or more memory modules.
Abstract:
A memory system and method uses stacked memory device dice coupled to each other and to a logic die. The logic die may include a timing correction system that is operable to control the timing at which the logic die receives signals, such as read data signals, from each of the memory device dice. The timing correction controls the timing of the read data or other signals by adjusting the timing of respective strobe signals, such as read strobe signals, that are applied to each of the memory device dice. The memory device dice may transmit read data to the memory device at a time determined by when it receives the respective strobe signals. The timing of each of the strobe signals is adjusted so that the read data or other signals from all of the memory device dice are received at the same time.
Abstract:
A synchronizer system and method that can be used with a conventional adjustable delay circuit to preserve a pseudo-synchronous phase relationship between clock signals of different clock domains when the time delay of the adjustable delay circuit from which one of the clock signals is output is changed.
Abstract:
Systems and methods disclosed herein substantially concurrently transfer a plurality of streams of commands, addresses, and/or data across a corresponding plurality of serialized communication link interfaces (SCLIs) between one or more originating devices or destination devices such as a processor and a switch. At the switch, one or more commands, addresses, or data corresponding to each stream can be transferred to a corresponding destination memory vault controller (MVC) associated with a corresponding memory vault. The destination MVC can perform write operations, read operations, and/or memory vault housekeeping operations independently from concurrent operations associated with other MVCs coupled to a corresponding plurality of memory vaults.
Abstract:
A memory system and method uses stacked memory device dice coupled to each other and to a logic die. The logic die may include a timing correction system that is operable to control the timing at which the logic die receives signals, such as read data signals, from each of the memory device dice. The timing correction controls the timing of the read data or other signals by adjusting the timing of respective strobe signals, such as read strobe signals, that are applied to each of the memory device dice. The memory device dice may transmit read data to the memory device at a time determined by when it receives the respective strobe signals. The timing of each of the strobe signals is adjusted so that the read data or other signals from all of the memory device dice are received at the same time.