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    MEMS TRANSDUCERS
    1.
    发明申请
    MEMS TRANSDUCERS 审中-公开
    MEMS传感器

    公开(公告)号：WO2009136196A3

    公开(公告)日：2010-06-24

    申请号：PCT/GB2009050473

    申请日：2009-05-07

    Applicant: WOLFSON MICROELECTRONICS PLC ,  MCMULLEN ROBERT ERROL ,  LAMING RICHARD IAN ,  TRAYNOR ANTHONY BERNARD ,  HOEKSTRA TSJERK HANS

    Inventor： MCMULLEN ROBERT ERROL ,  LAMING RICHARD IAN ,  TRAYNOR ANTHONY BERNARD ,  HOEKSTRA TSJERK HANS

    IPC: B06B1/02

    CPC classification number: B06B1/0292

    Abstract: A MEMS device comprises a substrate having at least a first transducer optimized for transmitting pressure waves, and at least a second transducer optimized for detecting pressure waves. The transducers can be optimised for transmitting or receiving by varying the diameter, thickness or mass of the membrane and/or electrode of each respective transducer. Various embodiments are described showing arrays of transducers, with different configurations of transmitting and receiving transducers. Embodiments are also disclosed having an array of transmitting transducers and an array of receiving transducers, wherein elements in the array of transmitting and /or receiving transducers are arranged to have different resonant frequencies. At least one of said first and second transducers may comprise an internal cavity that is sealed from the outside of the transducer.

    Abstract translation: MEMS器件包括具有至少第一传感器的衬底，该第一传感器优化用于传送压力波，以及至少第二传感器，其优化用于检测压力波。 可以通过改变每个相应换能器的膜和/或电极的直径，厚度或质量来优化传感器的传播或接收。 描述了各种实施例，其示出了具有不同配置的发射和接收换能器的换能器阵列。 还公开了具有发射换能器阵列和接收换能器阵列的实施例，其中发射和/或接收换能器阵列中的元件布置成具有不同的谐振频率。 所述第一和第二换能器中的至少一个可以包括从换能器的外部密封的内部空腔。

    METHOD FOR FABRICATING A MEMS MICROPHONE
    2.
    发明申请
    METHOD FOR FABRICATING A MEMS MICROPHONE 审中-公开
    制造MEMS麦克风的方法

    公开(公告)号：WO2007107736A3

    公开(公告)日：2009-09-11

    申请号：PCT/GB2007000972

    申请日：2007-03-20

    Applicant: WOLFSON MICROELECTRONICS PLC ,  LAMING RICHARD IAN ,  BEGBIE MARK ,  TRAYNOR ANTHONY

    Inventor： LAMING RICHARD IAN ,  BEGBIE MARK ,  TRAYNOR ANTHONY

    IPC: B81C1/00

    CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

    Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane (11) that is free to move in response to pressure differences generated by sound waves. A first electrode (13) is mechanically coupled to the flexible membrane (11), and together form a first capacitive plate of the capacitive microphone device. A second electrode (23) is mechanically coupled to a generally rigid structural layer or back-plate (14), which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate (1), for example a silicon wafer. A back- volume (33) is provided below the membrane (11), and is formed using a 'back-etch' through the substrate (1). A first cavity (9) is located directly below the membrane (11), and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes (13 and 23) is a second cavity (17), which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes (15) connect the first cavity (9) and the second cavity (17). Acoustic holes (31) are arranged in the back-plate (14) so as to allow free movement of air molecules, such that the sound waves can enter the second cavity (17). The first and second cavities (9 and 17) in association with the back-volume (33) allow the membrane (11) to move in response to the sound waves entering via the acoustic holes (31) in the back-plate (14). The provision of first and second sacrifjciaj layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes (15) aid with the removal of the first and second sacrificial layers. The bleed holes (15) also contribute to the operating characteristics of the microphone.

    Abstract translation: MEMS器件，例如电容式麦克风，包括响应于由声波产生的压力差而自由移动的柔性膜（11）。 第一电极（13）机械耦合到柔性膜（11），并且一起形成电容式麦克风装置的第一电容板。 第二电极（23）机械地联接到大致刚性的结构层或背板（14），它们一起形成电容式麦克风装置的第二电容板。 电容式麦克风形成在基板（1）上，例如硅晶片上。 背部容积（33）设置在膜（11）下方，并且通过基板（1）的“背蚀刻”形成。 第一腔（9）位于膜（11）的正下方，并且在制造过程中使用第一牺牲层形成。 介于第一和第二电极（13和23）之间的是在制造过程中使用第二牺牲层形成的第二腔体（17）。 多个排放孔（15）连接第一腔（9）和第二腔（17）。 声孔（31）布置在背板（14）中以便允许空气分子的自由移动，使得声波可以进入第二腔（17）。 与背容积（33）相关联的第一和第二空腔（9和17）允许膜（11）响应于通过背板（14）中的声孔（31）进入的声波而移动， 。 提供第一和第二牺牲层具有在制造期间保护膜的优点，以及使背蚀刻工艺与膜的定义分离。 排放孔（15）有助于去除第一和第二牺牲层。 排放孔（15）也有助于麦克风的操作特性。

    MEMS PROCESS AND DEVICE
    3.
    发明申请
    MEMS PROCESS AND DEVICE 审中-公开
    MEMS工艺和器件

    公开(公告)号：WO2009024762A2

    公开(公告)日：2009-02-26

    申请号：PCT/GB2008/002772

    申请日：2008-08-15

    Applicant: WOLFSON MICROELECTRONICS PLC ,  TRAYNOR, Anthony, Bernard ,  LAMING, Richard, Ian ,  HOEKSTRA, Tsjerk, Hans

    Inventor： TRAYNOR, Anthony, Bernard ,  LAMING, Richard, Ian ,  HOEKSTRA, Tsjerk, Hans

    IPC: B81B3/00

    CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B3/0072 ,  B81B3/0094 ,  B81B2201/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L27/00 ,  H04R19/00 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2499/11

    Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane (5) on a substrate (3), and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion (7a) and a second back-volume portion (7b), the first back-volume portion (7a) being separated from the second back-volume portion (7b) by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion (7b) can be made greater than the cross-sectional area of the membrane (5), thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane (5). The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.

    Abstract translation: 制造微机电系统（MEMS）换能器的方法包括以下步骤：在衬底（3）上形成膜（5），并在衬底中形成后体积。 在衬底中形成背部体积的步骤包括形成第一后部容积部分（7a）和第二后部体积部分（7b）的步骤，第一后部体积部分（7a）与第二后部体积部分 后体积部分（7b）通过后体积的侧壁中的台阶。 第二后部容积部分（7b）的横截面面积可以大于膜（5）的横截面面积，从而能够增加后部体积而不受横截面积的约束 的膜（5）。 背部容积可以包括第三后部体积部分。 第三后部体积部分能够更准确地形成膜的有效直径。

    OPTICAL POWER MONITOR
    4.
    发明申请
    OPTICAL POWER MONITOR 审中-公开
    光功率监视器

    公开(公告)号：WO0245299A3

    公开(公告)日：2002-08-01

    申请号：PCT/GB0105309

    申请日：2001-11-30

    Applicant: ALCATEL OPTRONICS UK LTD ,  KYMATA NETHERLANDS B V ,  LAMING RICHARD IAN ,  VAN WEERDEN HARM

    Inventor： LAMING RICHARD IAN ,  VAN WEERDEN HARM

    IPC: G01J3/28 ,  G01K17/00 ,  G02B6/12 ,  G02B6/122 ,  G02B6/34 ,  H04B10/08

    CPC classification number: G02B6/12016 ,  G01J3/28 ,  G01K17/003 ,  G02B6/12004 ,  G02B6/12019 ,  G02B6/1228 ,  G02B2006/12195

    Abstract: An optical power monitor comprises: an array waveguide grating comprising first and second optical interaction regions between which an input optical signal propagates from a first position on a first side of the first optical interaction region to a second position on a second side of the second optical interaction region, a correspondence between said first and second positions depending upon a wavelength of the optical signal, there being a plurality of array waveguides coupled between a second side of the first optical interaction region and a first side of the second optical interaction region, and a plurality of output waveguides coupled at one end to the second side of the second optical interaction region for outputting different wavelength channel outputs from the second optical interaction region; and detectors for detecting said different wavelength channel outputs at the other ends of the output waveguides; wherein the plurality of output waveguides include at least two output waveguides for at least one of the wavelength channels.

    Abstract translation: 光功率监视器包括：阵列波导光栅，包括第一和第二光学相互作用区域，输入光信号在第一和第二光学相互作用区域之间从第一光学相互作用区域的第一侧上的第一位置传播到第二光学相互作用区域的第二侧上的第二位置 所述第一和第二位置之间的对应关系取决于所述光信号的波长，存在耦合在所述第一光学相互作用区域的第二侧和所述第二光学相互作用区域的第一侧之间的多个阵列波导，以及 多个输出波导在一端耦合到第二光学相互作用区域的第二侧，用于从第二光学相互作用区域输出不同的波长信道输出; 以及检测器，用于在输出波导的另一端检测所述不同波长信道输出; 其中所述多个输出波导包括用于所述波长通道中的至少一个的至少两个输出波导。

    DISPERSION COMPENSATION IN OPTICAL FIBRE TRANSMISSION
    5.
    发明申请
    DISPERSION COMPENSATION IN OPTICAL FIBRE TRANSMISSION 审中-公开
    光纤传输中的分散补偿

    公开(公告)号：WO1997031435A1

    公开(公告)日：1997-08-28

    申请号：PCT/GB1997000504

    申请日：1997-02-21

    Applicant: PIRELLI CAVI SPA ,  LOH, Wei-Hung ,  LAMING, Richard, Ian ,  ATKINSON, David ,  O'REILLY, John, James

    Inventor： PIRELLI CAVI SPA

    IPC: H04B10/18

    CPC classification number: G02B6/2932 ,  G02B6/29394 ,  H04B10/2519 ,  H04B2210/254

    Abstract: Optical transmission apparatus, for transmission of optical signals at an optical wavelength of about 1550 nanometres, comprises: a single mode optical fibre link formed of optical fibre having substantially zero dispersion at an optical wavelength of about 1300 nanometres and a dispersion of about 17 picoseconds per nanometre-kilometre at an optical wavelength of about 1500 nanometres; and one or more dispersion compensating chirped optical fibre gratings, the aggregate dispersion of the chirped optical fibre gratings substantially compensating for the dispersion of the optical fibre link; in which the one or more gratings are coupled to the optical fibre link at respective positions substantially symmetrically disposed about the longitudinal centre of the optical fibre link.

    Abstract translation: 用于在约1550纳米的光波长下传输光信号的光传输装置包括：由光纤形成的单模光纤链路，其在大约1300纳米的光波长处具有基本为零的色散，并且每个色散约为17皮秒 在约1500纳米的光波长下的纳米公里; 和一个或多个色散补偿啁啾光纤光栅，啁啾光纤光栅的总体色散基本上补偿了光纤链路的色散; 其中一个或多个光栅在围绕光纤链路的纵向中心大致对称设置的各个位置处耦合到光纤链路。

    MEMS TRANSDUCERS
    7.
    发明申请
    MEMS TRANSDUCERS 审中-公开
    MEMS传感器

    公开(公告)号：WO2009136196A2

    公开(公告)日：2009-11-12

    申请号：PCT/GB2009/050473

    申请日：2009-05-07

    Applicant: WOLFSON MICROELECTRONICS PLC ,  McMULLEN, Robert Errol ,  LAMING, Richard Ian ,  TRAYNOR, Anthony Bernard ,  HOEKSTRA, Tsjerk Hans

    Inventor： McMULLEN, Robert Errol ,  LAMING, Richard Ian ,  TRAYNOR, Anthony Bernard ,  HOEKSTRA, Tsjerk Hans

    IPC: B81B7/04

    CPC classification number: B06B1/0292

    Abstract: A MEMS device comprises a substrate having at least a first transducer optimized for transmitting pressure waves, and at least a second transducer optimized for detecting pressure waves. The transducers can be optimised for transmitting or receiving by varying the diameter, thickness or mass of the membrane and/or electrode of each respective transducer. Various embodiments are described showing arrays of transducers, with different configurations of transmitting and receiving transducers. Embodiments are also disclosed having an array of transmitting transducers and an array of receiving transducers, wherein elements in the array of transmitting and /or receiving transducers are arranged to have different resonant frequencies. At least one of said first and second transducers may comprise an internal cavity that is sealed from the outside of the transducer.

    Abstract translation: MEMS器件包括具有至少第一传感器的衬底，该第一传感器优化用于传送压力波，以及至少第二传感器，其优化用于检测压力波。 可以通过改变每个相应换能器的膜和/或电极的直径，厚度或质量来优化传感器的传播或接收。 描述了各种实施例，其示出了具有不同配置的发射和接收换能器的换能器阵列。 还公开了具有发射换能器阵列和接收换能器阵列的实施例，其中发射和/或接收换能器阵列中的元件布置成具有不同的谐振频率。 所述第一和第二换能器中的至少一个可以包括从换能器的外部密封的内部空腔。

    MEMS PROCESS AND DEVICE
    10.
    发明申请
    MEMS PROCESS AND DEVICE 审中-公开
    MEMS工艺和器件

    公开(公告)号：WO2007107736A2

    公开(公告)日：2007-09-27

    申请号：PCT/GB2007/000972

    申请日：2007-03-20

    Applicant: WOLFSON MICROELECTRONICS PLC ,  LAMING, Richard Ian ,  BEGBIE, Mark ,  TRAYNOR, Anthony

    Inventor： LAMING, Richard Ian ,  BEGBIE, Mark ,  TRAYNOR, Anthony

    IPC: B81C1/00

    CPC classification number: B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81C99/004 ,  B81C2201/0109 ,  H04R7/10 ,  H04R7/18 ,  H04R19/005 ,  H04R2307/207 ,  Y10S977/733

    Abstract: A MEMS device, for example a capacitive microphone, comprises a flexible membrane 11 that is free to move in response to pressure differences generated by sound waves. A first electrode 13 is mechanically coupled to the flexible membrane 11 , and together form a first capacitive plate of the capacitive microphone device. A second electrode 23 is mechanically coupled to a generally rigid structural layer or back-plate 14, which together form a second capacitive plate of the capacitive microphone device. The capacitive microphone is formed on a substrate 1 , for example a silicon wafer. A back- volume 33 is provided below the membrane 11 , and is formed using a "back-etch" through the substrate 1. A first cavity 9 is located directly below the membrane 11 , and is formed using a first sacrificial layer during the fabrication process. Interposed between the first and second electrodes 13 and 23 is a second cavity 17, which is formed using a second sacrificial layer during the fabrication process. A plurality of bleed holes 15 connect the first cavity 9 and the second cavity 17. Acoustic holes 31 are arranged in the back-plate 14 so as to allow free movement of air molecules, such that the sound waves can enter the second cavity 17. The first and second cavities 9 and 17 in association with the back-volume 33 allow the membrane 11 to move in response to the sound waves entering via the acoustic holes 31 in the back-plate 14. The provision of first and second sacrifjciaj layers has the advantage of protecting the membrane during manufacture, and disassociating the back etch process from the definition of the membrane. The bleed holes 15 aid with the removal of the first and second sacrificial layers. The bleed holes 15 also contribute to the operating characteristics of the microphone.

    Abstract translation: MEMS器件，例如电容麦克风，包括响应于由声波产生的压力差而自由移动的柔性膜11。 第一电极13机械耦合到柔性膜11，并且一起形成电容式麦克风装置的第一电容板。 第二电极23机械地耦合到大致刚性的结构层或背板14，它们一起形成电容式麦克风装置的第二电容板。 电容麦克风形成在基板1上，例如硅晶片。 背部体积33设置在膜11的下方，并且通过基底1的“背蚀刻”形成。第一腔9位于膜11的正下方，并且在制造期间使用第一牺牲层形成 处理。 介于第一和第二电极13和23之间的是第二腔17，其在制造过程中使用第二牺牲层形成。 多个排放孔15连接第一腔9和第二腔17.声孔31布置在背板14中，以便允许空气分子的自由运动，使得声波可以进入第二腔17。 与背部体积33相关联的第一和第二腔9和17允许膜11响应于通过背板14中的声孔31进入的声波而移动。提供第一和第二牺牲层具有 在制造过程中保护膜的优点，以及使背蚀刻工艺与膜的定义分离。 排出孔15有助于去除第一和第二牺牲层。 排放孔15也有助于麦克风的操作特性。

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