公开(公告)号：WO2012087060A3

公开(公告)日：2012-11-01

申请号：PCT/KR2011010026

申请日：2011-12-23

申请人： LG INNOTEK CO LTD ,  LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

发明人： LEE SANG MYUNG ,  YOON SUNG WOON ,  LEE HYUK SOO ,  LEE SUNG WON ,  CHUN KI DO

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括芯绝缘层，至少一个通过芯绝缘层形成的通孔，埋在芯绝缘层中的内电路层，以及在芯绝缘层的顶表面或底表面上的外电路层 其中所述通孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 同时形成内部电路层和通孔，从而减少工艺步骤。 由于设置了奇数电路层，所以印刷电路板具有轻薄的结构。

公开(公告)号：WO2012087060A2

公开(公告)日：2012-06-28

申请号：PCT/KR2011/010026

申请日：2011-12-23

申请人： LG INNOTEK CO., LTD. ,  LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述过孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：WO2012011701A9

公开(公告)日：2012-03-22

申请号：PCT/KR2011005218

申请日：2011-07-15

申请人： LG INNOTEK CO LTD ,  AN YUN HO ,  KIM EUN JIN ,  LEE HYUK SOO ,  PARK JAE MAN ,  CHO IN HEE ,  PARK HYUN GYU ,  KIM HAE YEON

发明人： AN YUN HO ,  KIM EUN JIN ,  LEE HYUK SOO ,  PARK JAE MAN ,  CHO IN HEE ,  PARK HYUN GYU ,  KIM HAE YEON

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

摘要翻译： 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，该金属板包括金属突起，该金属突起具有焊料，发光装置附着到该金属突起上，金属突起上的接合层， 金属板以暴露金属突起，以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，将从发热装置发出的热量直接传递到金属板，从而提高散热效率。 散热突起的表面镀有包含铜的合金，从而提高相对于焊料的粘合性，从而降低了故障率。

公开(公告)号：WO2011014029A2

公开(公告)日：2011-02-03

申请号：PCT/KR2010/005004

申请日：2010-07-29

申请人： LG ELECTRONICS INC. ,  KIM, Young Jong ,  LEE, Hyuk Soo

发明人： KIM, Young Jong ,  LEE, Hyuk Soo

IPC分类号： D06F37/24 ,  D06F37/12 ,  F16F15/10

CPC分类号： D06F37/24 ,  D06F37/20 ,  D06F37/206

摘要： A fabric treating machine according a present invention comprises a first vibration mitigation part which is disposed between a stator and a bearing unit. Therefore, it can reduce the transfer of the vibration from the driving unit to the bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced. Thus, a reliability of product can be improved. Also, a fabric treating machine according a present invention comprises a vibration mitigation part which is disposed between an upper bearing unit and a lower bearing unit. Therefore, it can reduce the vibration transfer from the lower bearing unit to the upper bearing unit, and the vibration of an inner tub and an outer tub can be reduced, and a noise can be reduced.

摘要翻译： 根据本发明的织物处理机包括设置在定子和轴承单元之间的第一减振部件。 因此，能够减少振动从驱动单元向轴承单元的传递，能够减轻内筒和外桶的振动，能够降低噪音。 因此，可以提高产品的可靠性。 而且，根据本发明的织物处理机包括设置在上轴承单元和下轴承单元之间的减振部件。 因此，能够减少从下轴承单元向上轴承单元的振动传递，能够减少内筒和外筒的振动，能够降低噪音。

公开(公告)号：WO2010036051A3

公开(公告)日：2010-04-01

申请号：PCT/KR2009/005481

申请日：2009-09-25

申请人： LG INNOTEK CO., LTD. ,  KIM, Ji Yun ,  SHIN, Hyun Sub ,  LEE, Sung Won ,  LEE, Hyung Eui ,  SEO, Yeong Uk ,  RYU, Sung Wuk ,  LEE, Hyuk Soo

发明人： KIM, Ji Yun ,  SHIN, Hyun Sub ,  LEE, Sung Won ,  LEE, Hyung Eui ,  SEO, Yeong Uk ,  RYU, Sung Wuk ,  LEE, Hyuk Soo

IPC分类号： H01L23/495 ,  H01L21/60

摘要： The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching.

公开(公告)号：WO2007094618A3

公开(公告)日：2009-06-04

申请号：PCT/KR2007000796

申请日：2007-02-15

申请人： LG ELECTRONICS INC ,  LEE HYUK SOO ,  KO YOUNG HWAN ,  KIM BYUNG SOON

发明人： LEE HYUK SOO ,  KO YOUNG HWAN ,  KIM BYUNG SOON

IPC分类号： F24F11/00

CPC分类号： F25B49/02 ,  F24F11/83 ,  F25B1/10 ,  F25B13/00 ,  F25B2313/02741 ,  F25B2341/0662 ,  F25B2400/13 ,  F25B2400/23 ,  F25B2500/19 ,  F25B2600/0253 ,  F25B2600/2509 ,  F25B2600/2513 ,  F25B2700/19 ,  F25B2700/2104 ,  F25B2700/2106 ,  F25B2700/2109 ,  Y02B30/741

摘要： An air-conditioning system and a controlling method for the same that is capable of improving the operational efficiency of the air-conditioning system are disclosed. The air-conditioning system includes a phase separator (500) for separating a flowing refrigerant into a gas-phase refrigerant and a liquid-phase refrigerant, an evaporator (600) for evaporating the liquid-phase refrigerant separated by the phase separator (500), a compressor (100) having a first compression part into which the refrigerant having passed through the evaporator (600) is introduced and a second compression part into which both the gas-phase refrigerant separated by the phase separator (500) and the refrigerant having passed through the first compression part are introduced, and a control unit for simultaneously or selectively controlling the amount of the refrigerant introduced into the phase separator (500) and the amount of the refrigerant discharged from the phase separator (500).

摘要翻译： 公开了一种能够提高空调系统的运行效率的空调系统及其控制方法。 空调系统包括用于将流动的制冷剂分离成气相制冷剂和液相制冷剂的相分离器（500），用于蒸发由相分离器（500）分离的液相制冷剂的蒸发器（600） ，具有通过蒸发器（600）的制冷剂被引入到其中的第一压缩部的压缩机（100）和由所述相分离器（500）分离的所述气相制冷剂与所述制冷剂分离的第二压缩部， 引入通过第一压缩部的控制单元，以及用于同时或选择性地控制引入相分离器（500）的制冷剂量和从相分离器（500）排出的制冷剂量的控制单元。

公开(公告)号：WO2012050333A3

公开(公告)日：2012-08-30

申请号：PCT/KR2011007494

申请日：2011-10-10

申请人： LG INNOTEK CO LTD ,  PARK HYUN GYU ,  CHO IN HEE ,  AN YUN HO ,  PARK JAE MAN ,  KIM EUN JIN ,  KIM HAE YEON ,  LEE HYUK SOO

发明人： PARK HYUN GYU ,  CHO IN HEE ,  AN YUN HO ,  PARK JAE MAN ,  KIM EUN JIN ,  KIM HAE YEON ,  LEE HYUK SOO

IPC分类号： H01L23/34 ,  H01L33/64 ,  H05K7/20

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供一种用于安装多个发热装置的辐射热电路板。 辐射热电路板包括金属板，该金属板包括集成的金属突起，多个发热装置附接到该金属突起，暴露一体金属突起的绝缘构件，绝缘构件包括设置在金属板上的多个绝缘层，以及 布置在绝缘构件上的第一和第二电极焊盘，布置的第一和第二电极焊盘彼此电分离。 第一和第二电极焊盘从设置在绝缘层彼此不同的绝缘层上的电路线接收电压。 因此，可以在发热装置之间设置辐射突起以改善热辐射。

公开(公告)号：WO2012087058A2

公开(公告)日：2012-06-28

申请号：PCT/KR2011/010024

申请日：2011-12-23

申请人： LG INNOTEK CO., LTD. ,  LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述通孔包括第一部分，在所述第一部分下方的第二部分，在所述第一部分和所述第二部分之间的第三部分以及包括与所述第一部分至第三部分中的金属不同的金属的至少一个阻挡层。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：WO2012050333A2

公开(公告)日：2012-04-19

申请号：PCT/KR2011/007494

申请日：2011-10-10

申请人： LG INNOTEK CO., LTD. ,  PARK, Hyun Gyu ,  CHO, In Hee ,  AN, Yun Ho ,  PARK, Jae Man ,  KIM, Eun Jin ,  KIM, Hae Yeon ,  LEE, Hyuk Soo

发明人： PARK, Hyun Gyu ,  CHO, In Hee ,  AN, Yun Ho ,  PARK, Jae Man ,  KIM, Eun Jin ,  KIM, Hae Yeon ,  LEE, Hyuk Soo

IPC分类号： H01L23/34 ,  H05K7/20 ,  H01L33/64

CPC分类号： H05K7/205 ,  F21V29/70 ,  G02F1/133615 ,  H01L23/3677 ,  H01L25/0753 ,  H01L33/647 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/056 ,  H05K1/113 ,  H05K3/30 ,  H05K3/4608 ,  H05K13/00 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.

摘要翻译： 提供了一种用于安装多个发热装置的辐射热电路板。 该辐射热电路板包括金属板，该金属板包括集成金属突起，该多个发热器件附接到集成金属突起，暴露该集成金属突起的绝缘构件，该绝缘构件包括设置在该金属板上的多个绝缘层，以及 设置在绝缘构件上的第一和第二电极焊盘，设置的第一和第二电极焊盘彼此电隔离。 第一电极焊盘和第二电极焊盘从设置在绝缘构件的彼此不同的绝缘层上的电路布线接收电压。 因此，辐射投影可以设置在发热设备之间以改善热辐射。

公开(公告)号：WO2012011701A2

公开(公告)日：2012-01-26

申请号：PCT/KR2011/005218

申请日：2011-07-15

申请人： LG INNOTEK CO., LTD. ,  AN, Yun Ho ,  KIM, Eun Jin ,  LEE, Hyuk Soo ,  PARK, Jae Man ,  CHO, In Hee ,  PARK, Hyun Gyu ,  KIM, Hae Yeon

发明人： AN, Yun Ho ,  KIM, Eun Jin ,  LEE, Hyuk Soo ,  PARK, Jae Man ,  CHO, In Hee ,  PARK, Hyun Gyu ,  KIM, Hae Yeon

IPC分类号： H05K7/20 ,  H05K1/02

CPC分类号： H05K1/181 ,  H01L23/3677 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K1/03 ,  H05K1/09 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2203/0369

摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.

摘要翻译： 公开了一种辐射热电路板及其制造方法。 用于在其上安装发热装置的辐射热电路板包括金属板，金属板包括具有焊料的金属突起，发热器件附着到金属突起，金属突起上的接合层，金属突起上的绝缘层 暴露金属突起的金属板以及绝缘层上的电路图案。 通过在安装垫下方设置包括散热突起的金属板，从发热装置发出的热量直接传递到金属板，从而提高散热效率。 散热突起的表面镀有包含铜的合金，从而改善了与焊料的粘附性，从而降低了故障率。