Abstract:
A computer-implemented system, method, and software are provided for solving linear systems of equations arising in reservoir simulation. A linear system of fluid flow equations, including a plurality of unknown variables, is provided that represents fluid flow properties in a geological formation of a subterranean reservoir. Block diagonal scaling is applied to the linear system of fluid flow equations. Threshold incomplete lower-upper approximate factorization is applied to obtain a preconditioning matrix, which can be used to iteratively solve unknown variables associated with the system of fluid flow equations. Preconditioning can be used directly as part of a preconditioned Krylov subspace method or alternatively as a 2nd stage preconditioner in a CPR algorithm.
Abstract:
A computer-implemented system, method, and software are provided for solving linear systems of equations arising in reservoir simulation. A linear system of fluid flow equations, including a plurality of unknown variables, is provided that represents fluid flow properties in a geological formation of a subterranean reservoir. Block diagonal scaling is applied to the linear system of fluid flow equations. Threshold incomplete lower-upper approximate factorization is applied to obtain a preconditioning matrix, which can be used to iteratively solve unknown variables associated with the system of fluid flow equations. Preconditioning can be used directly as part of a preconditioned Krylov subspace method or alternatively as a 2 nd stage preconditioner in a CPR algorithm.
Abstract:
A MEMS device (100, 300) and method of fabrication including a plurality of structural tie bars (108, 303, 304) for added structural integrity. The MEMS device includes an active layer (202) and a substrate (102) having an insulating material (204) formed therebetween, first and second pluralities of stationary electrodes (103, 105) and a plurality of moveable electrodes (107) in the active layer. A plurality of interconnects (106, 301, 302) are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors (226) fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.
Abstract:
MEMS devices (100) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device (100) comprises a substrate (106) having a surface, an electrode (128) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism (204) disposed on the electrode second portion, the stress-release mechanism (204) including a first slot (208) integrally formed in the electrode. In another exemplary embodiment, the substrate (106) includes an anchor (134, 136) and the stress-release mechanism 222 is formed adjacent the anchor (134, 136).
Abstract:
An isolation mount for supporting and isolating one part from another includes an inner member formed to be connected to one of the parts and an outer member formed to be connected to one of the parts. The inner member has a first and a second inner plates being connected at one end and extending at a first angle with respect to each other; the outer member also has a first and a second outer plates being connected at one end and extending at a second angle with respect to each other. The isolation mount further includes a first and a second individual elastomeric element compressed between respective inner and outer plates.
Abstract:
A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.
Abstract:
A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.
Abstract:
A MEMS device (100, 300) and method of fabrication including a plurality of structural tie bars (108, 303, 304) for added structural integrity. The MEMS device includes an active layer (202) and a substrate (102) having an insulating material (204) formed therebetween, first and second pluralities of stationary electrodes (103, 105) and a plurality of moveable electrodes (107) in the active layer. A plurality of interconnects (106, 301, 302) are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors (226) fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.
Abstract:
An isolation mount for supporting and isolating one part from another includes an inner member formed to be connected to one of the parts and an outer member formed to be connected to one of the parts. The inner member has a first and a second inner plates being connected at one end and extending at a first angle with respect to each other; the outer member also has a first and a second outer plates being connected at one end and extending at a second angle with respect to each other. The isolation mount further includes a first and a second individual elastomeric element compressed between respective inner and outer plates.
Abstract:
A lead frame (201) for a packaged electronic device having split flag structures (205, 207) coupled by support structures (219). The support structures include bend portions (233) for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (301). In one embodiment, the packaged electronic device includes an inertial sensor (515).