公开(公告)号：WO2007021029A2

公开(公告)日：2007-02-22

申请号：PCT/JP2006/316442

申请日：2006-08-16

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MAKINO, Yoichi ,  KABESHITA, Akira

Inventor： MAKINO, Yoichi ,  KABESHITA, Akira

IPC: H01L21/00

CPC classification number: H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

Abstract: In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract translation: 在芯片安装装置中使用的芯片反转装置中，该芯片安装装置用于保持和垂直反转通过接合喷嘴放置的芯片，芯片被保持在设置在反转构件中的芯片保持单元上并且被竖直反转 通过在反转轴上向下转动换向构件。 在芯片接收单元接收到反转芯片后，该芯片接收单元下降到缩回位置以使反转构件返回到原始位置。 在这种状态下，芯片接收单元被升起以将芯片定位在高度水平L处以进行芯片传送动作。 结果，反转部件不会突出到用于芯片转移的高度水平以上，从而与另一个机构发生干涉，使得芯片安装动作可以变得高效。

公开(公告)号：WO2005024932A2

公开(公告)日：2005-03-17

申请号：PCT/JP2004/013281

申请日：2004-09-07

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KABESHITA, Akira ,  HAMASAKI, Kurayasu ,  MINAMITANI, Shozo ,  MAKINO, Yoichi ,  TANI, Noriyuki

Inventor： KABESHITA, Akira ,  HAMASAKI, Kurayasu ,  MINAMITANI, Shozo ,  MAKINO, Yoichi ,  TANI, Noriyuki

IPC: H01L21/50

CPC classification number: H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract translation: 在与半导体芯片（1）的粘合区域（R1）对应的粘合片（3）的底面侧区域附近被吸住并保持的情况下，将多个突起部（30） 移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。 此外，粘合片被吸入各个突出部分之间，以便通过粘附到点粘合来改变半导体芯片与粘合片的表面粘合，并且还可以沿着半导体芯片的底面移动去除构件 从而通过粘合改变点粘合的位置并降低粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：WO0226011A3

公开(公告)日：2003-02-20

申请号：PCT/JP0108088

申请日：2001-09-18

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  OKAMOTO KENJI ,  KABESHITA AKIRA ,  SAKON HIDEO ,  MAKINO YOICHI ,  TAKANO KEN

Inventor： OKAMOTO KENJI ,  KABESHITA AKIRA ,  SAKON HIDEO ,  MAKINO YOICHI ,  TAKANO KEN

IPC: H05K13/04

CPC classification number: H05K13/0413 ,  H05K13/0452 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: The component suction device includes a suction nozzle (10) for sucking and holding a component (20), a nozzle turning device (25) for holding the suction nozzle and turning the suction nozzle, and a nozzle up-and-down device (26) which is located upward of the nozzle turning device and which is connected to the suction nozzle to serve for moving up and down the suction nozzle along an axial direction of the suction nozzle.

Abstract translation: 所述部件吸引装置具备：吸引保持部件（20）的吸嘴（10）;吸引吸嘴保持并转动吸嘴的喷嘴旋转装置（25）;喷嘴上下装置 ），其位于喷嘴转向装置的上方，并且连接到吸嘴以用于沿着吸嘴的轴向方向上下移动吸嘴。

公开(公告)号：WO2005022607A1

公开(公告)日：2005-03-10

申请号：PCT/JP2004/012600

申请日：2004-08-25

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  KABESHITA, Akira ,  HAMASAKI, Kurayasu ,  TANI, Noriyuki ,  MINAMITANI, Shozo ,  MAKINO, Yoichi

Inventor： KABESHITA, Akira ,  HAMASAKI, Kurayasu ,  TANI, Noriyuki ,  MINAMITANI, Shozo ,  MAKINO, Yoichi

IPC: H01L21/00

CPC classification number: H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

Abstract: A component mounting apparatus (101) is provided with a board holding device (5, 6) for holding a board (8) at a board holding position (A, B, C and D), a first mounting head (4) for holding and taking out a component (2) fed from a first component feeding position (E) and mounting the component on the board held at the board holding position, a second mounting head (34) for holding and taking out the component fed from a second component feeding position (F) and mounting the component on the held board, and a component feeding device (11) having a wafer holding table (12) for holding a wafer (1) on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Abstract translation: 部件安装装置（101）具有用于将板（8）保持在板保持位置（A，B，C和D）的板保持装置（5,6），用于保持 取出从第一部件供给位置（E）进给并将部件安装在保持在板保持位置的板上的部件（2），第二安装头（34），用于保持和取出从第二部件 元件供给位置（F）并将部件安装在保持板上;以及部件供给装置（11），具有用于保持晶片（1）的晶片保持台（12），在该晶片保持台（12）上供给各个部件，使得晶片保持 工作台可以在第一部件供给位置和第二部件供给位置之间往复移动。

公开(公告)号：WO2005024932A3

公开(公告)日：2005-06-02

申请号：PCT/JP2004013281

申请日：2004-09-07

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  KABESHITA AKIRA ,  HAMASAKI KURAYASU ,  MINAMITANI SHOZO ,  MAKINO YOICHI ,  TANI NORIYUKI

Inventor： KABESHITA AKIRA ,  HAMASAKI KURAYASU ,  MINAMITANI SHOZO ,  MAKINO YOICHI ,  TANI NORIYUKI

IPC: H01L21/301 ,  B23D59/00 ,  B23Q11/00 ,  H01L21/00 ,  H01L21/52 ,  H01L21/68 ,  H01L21/78 ,  H05K13/04

CPC classification number: H01L21/67132 ,  Y10T156/1132 ,  Y10T156/1944

Abstract: While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet (3) corresponding to an adhesion region (R1) of a semiconductor chip (1) are sucked and held, a plurality of protruding portions (30) of a removing member (21) are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change a surface bonding of the semiconductor chip to the adhesive sheet by adhesion to a point bonding, and further the removing member is moved along the bottom surface of the semiconductor chip so as to change a position of the point bonding and decrease bonding force to the adhesive sheet by the adhesion. Then, the semiconductor chip is removed from the adhesive sheet.

Abstract translation: 在与半导体芯片（1）的粘合区域（R1）对应的粘合片（3）的底面侧区域附近被吸住并保持的情况下，将多个突起部（30） 移除部件（21）通过该区域的粘合片与半导体芯片的底面接触。 此外，粘合片被吸入各个突出部分之间，以便通过粘附到点粘合来改变半导体芯片与粘合片的表面粘合，并且还可以沿着半导体芯片的底面移动去除构件 从而通过粘合改变点粘合的位置并降低粘合力。 然后，将半导体芯片从粘合片上取出。

公开(公告)号：WO2007021029A3

公开(公告)日：2007-06-28

申请号：PCT/JP2006316442

申请日：2006-08-16

Applicant: MATSUSHITA ELECTRIC IND CO LTD ,  MAKINO YOICHI ,  KABESHITA AKIRA

Inventor： MAKINO YOICHI ,  KABESHITA AKIRA

IPC: H01L21/00

CPC classification number: H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53478 ,  Y10T156/1702

Abstract: In a chip reversing device used in a chip mounting apparatus for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Abstract translation: 在用于保持并垂直反转由接合喷嘴放置的芯片的芯片安装装置中的芯片反转装置中，芯片被保持在设置在反转构件中的芯片保持单元上，并且通过向后转动反向构件而垂直反转 反转轴。 在由芯片接收单元接收到反向芯片之后，该芯片接收单元下降到缩回位置，以将反向构件返回到原始位置。 在这种状态下，芯片接收单元升高以将芯片定位在芯片转移动作的高度L处。 结果，反转构件不突出到用于芯片转移的高度水平以上，从而干扰另一机构，使得可以使芯片安装动作有效。

公开(公告)号：WO1997043890A1

公开(公告)日：1997-11-20

申请号：PCT/JP1997001600

申请日：1997-05-13

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  MOGI, Seiichi ,  HIRAI, Wataru ,  SAKURAI, Kunio ,  YAMAMOTO, Minoru ,  MAKINO, Yoichi ,  IDA, Akiko

Inventor： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

IPC: H05K13/02

CPC classification number: H05K13/0417 ,  H05K13/021 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/19 ,  Y10T156/1983

Abstract: A device for feeding electronic parts, capable of surely feeding electronic parts in a stable posture to an electronic part mounting machine, stabilizing winding of a peeled-off top tape, and enhancing a mounting speed. When a reel (42) winds a top tape (4), a shutter (34) retreats and a slit (51) formed integral with the shutter (34) also retreats. Revolution of the reel (42) in a tape winding direction is effected by a restoring force of a restoring spring (39). When winding movement of the reel (42) is terminated and the shutter (34) retreats, electronic parts (1) are taken out at an electronic part taking-out position. A stationary roller (31) is provided between the slit (51) and the reel (42), and further a moving roller (32) is provided for keeping a length of the top tape (4) between the slit (51) and the stationary roller (31) substantially constant.

Abstract translation: 一种用于馈送电子部件的装置，其能够将电子部件以稳定的姿势可靠地馈送到电子部件安装机，稳定了剥离的顶部带的卷绕，并且提高了安装速度。 当卷轴（42）缠绕顶部带（4）时，挡板（34）退回，与挡板（34）一体形成的狭缝（51）也退回。 卷轴（42）在带卷绕方向上的转动通过复原弹簧（39）的恢复力来实现。 当卷轴（42）的卷绕运动终止并且挡板（34）退回时，电子部件（1）在电子部件取出位置被取出。 在狭缝（51）和卷轴（42）之间设置有固定辊（31），并且还设有移动辊（32），用于将顶部带（4）的长度保持在狭缝（51）和 固定辊（31）基本上恒定。