公开(公告)号：WO2009073358A1

公开(公告)日：2009-06-11

申请号：PCT/US2008/083918

申请日：2008-11-18

Applicant: VIASAT, INC. ,  BUER, Kenneth V. ,  MENON, Gaurav ,  DARAPU, Ramanamurthy V. ,  MUELLENBERG, Dean

Inventor： BUER, Kenneth V. ,  MENON, Gaurav ,  DARAPU, Ramanamurthy V. ,  MUELLENBERG, Dean

IPC: H03D7/02

CPC classification number: H03D7/02

Abstract: Systems, devices and methods are disclosed for suppressing the 2LO frequency spur, output from a mixer. In various exemplary embodiments, a DC bias circuit is electrically connected to provide DC bias to one or more non-linear elements of the mixer. The biasing voltage is used to cause the current-voltage characteristics and/or junction capacitances between non-linear elements to be more symmetric and/or to suppress 2LO leakage currents that form 2LO frequency spurs at the output of the mixer. The non-linear elements may comprise one of: BJT's, diodes, and FET's. The mixer may be one of: a subharmonic mixer; a fundamental resistive mixer; a fundamental subharmonic transconductance mixer; and a fundamental transconductance mixer comprising an anti-parallel diode pair. The system may further be configured to automatically determine an appropriate DC bias voltage level that will improve one of the LO - IF isolation and the LO - RF isolation.

Abstract translation: 公开了用于抑制从混频器输出的2LO频率支线的系统，装置和方法。 在各种示例性实施例中，DC偏置电路电连接以向混频器的一个或多个非线性元件提供DC偏置。 偏置电压用于使非线性元件之间的电流 - 电压特性和/或结电容更为对称和/或抑制在混频器输出端形成2LO频率杂散的2LO漏电流。 非线性元件可以包括以下之一：BJT，二极管和FET。 混合器可以是以下之一：次谐波混合器; 基本电阻混频器; 一种基本的次谐波跨导混频器; 以及包括反并联二极管对的基本跨导混频器。 该系统还可以被配置为自动确定将改善LO-IF隔离和LO-RF隔离之一的适当DC偏置电压电平。

公开(公告)号：WO2009099912A3

公开(公告)日：2013-03-28

申请号：PCT/US2009032531

申请日：2009-01-30

Applicant: VIASAT INC ,  MENON GAURAV

Inventor： MENON GAURAV

IPC: H01L23/49 ,  H01L23/66

CPC classification number: H03H7/38 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6638 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over- mold of the millimeter wave package.

Abstract translation: 在无线通信设备中，毫米波封装中的内部匹配阻抗可在15 GHz及以上的高频下实现更好的信号保持。 通过使用差分接线信号传输，如果电容被定制，则毫米波封装的固有电感可以通过封装引线接合的电容来匹配。 可以通过计算引线键合之间的合适距离并调整外模材料的介电常数来调整电容。 差分组合引线的作用就像差分传输线，其特性阻抗可以通过配置毫米波封装的覆盖模的介电常数进行调节。

公开(公告)号：WO2010120758A3

公开(公告)日：2011-01-20

申请号：PCT/US2010030866

申请日：2010-04-13

Applicant: VIASAT INC ,  MENON GAURAV ,  JAIN NITIN ,  CORMAN DAVID W

Inventor： MENON GAURAV ,  JAIN NITIN ,  CORMAN DAVID W

IPC: H03H11/36

CPC classification number: H01Q3/34 ,  G06G7/12 ,  H01Q3/26 ,  H01Q3/36 ,  H01Q15/242

Abstract: A circuit topology in accordance with a system, method and device for an active power splitter with an input and at least two outputs which allows the use of negative feedback and thus improving stability and linearity without substantially increasing the noise figure of the system is provided.

Abstract translation: 提供了一种根据用于具有输入和至少两个输出的有源功率分配器的系统，方法和装置的电路拓扑，其允许使用负反馈并因此提高稳定性和线性度而基本上不增加系统的噪声系数。

公开(公告)号：WO2010120758A2

公开(公告)日：2010-10-21

申请号：PCT/US2010/030866

申请日：2010-04-13

Applicant: VIASAT, INC. ,  MENON, Gaurav ,  JAIN, Nitin ,  CORMAN, David W.

Inventor： MENON, Gaurav ,  JAIN, Nitin ,  CORMAN, David W.

IPC: H03H11/36

CPC classification number: H01Q3/34 ,  G06G7/12 ,  H01Q3/26 ,  H01Q3/36 ,  H01Q15/242

Abstract: A circuit topology in accordance with a system, method and device for an active power splitter with an input and at least two outputs which allows the use of negative feedback and thus improving stability and linearity without substantially increasing the noise figure of the system is provided.

Abstract translation: 提供了一种根据用于具有输入和至少两个输出的有源功率分配器的系统，方法和装置的电路拓扑，其允许使用负反馈并因此提高稳定性和线性度而基本上不增加系统的噪声系数。

公开(公告)号：WO2009099912A2

公开(公告)日：2009-08-13

申请号：PCT/US2009/032531

申请日：2009-01-30

Applicant: VIASAT, INC. ,  MENON, Gaurav

Inventor： MENON, Gaurav

IPC: H01L23/49 ,  H03H7/38

CPC classification number: H03H7/38 ,  H01L23/3121 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6638 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19051 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over- mold of the millimeter wave package.

Abstract translation: 在无线通信设备中，毫米波封装中的内部匹配阻抗可在15 GHz及以上的高频下实现更好的信号保持。 通过使用差分接线信号传输，如果电容被定制，则毫米波封装的固有电感可以通过封装引线接合的电容来匹配。 可以通过计算引线键合之间的合适距离并调整外模材料的介电常数来调整电容。 差分组合引线的作用就像差分传输线，其特性阻抗可以通过配置毫米波封装的覆盖模的介电常数进行调节。