公开(公告)号：WO2014126575A1

公开(公告)日：2014-08-21

申请号：PCT/US2013/026233

申请日：2013-02-14

Applicant: NANOFIBER SEPARATIONS, LLC ,  MENKHAUS, Todd ,  FONG, Hao

Inventor： MENKHAUS, Todd ,  FONG, Hao

IPC: H01L25/065 ,  H01L23/48

CPC classification number: B01D39/1615 ,  B01D15/327 ,  B01D15/361 ,  B01D15/3804 ,  B01D15/3809 ,  B01D39/1623 ,  B01D39/1676 ,  B01D2239/025 ,  B01D2239/0414 ,  B01J20/24 ,  B01J20/28007 ,  B01J20/28038 ,  B01J20/3212 ,  B01J20/3217 ,  B01J20/3248 ,  B01J20/3293 ,  C07K1/22 ,  D01D5/0007 ,  D01D5/003 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An MCM includes a two-dimensional array of facing chips, including island chips (120-1, 120-2) and bridge chips (122) that communicate with each other using overlapping connectors. In order to maintain the relative vertical spacing of these connectors, compressible structures (124) are in cavities (114) in a substrate (110), which house the bridge chips, and provide a compressive force on the back surface of the bridge chips. These compressible structures include a compliant material with shape and volume compression. In this way, the MCM may ensure that facing surfaces of the island chips and the bridge chips, as well as connectors on these surfaces, are approximately coplanar without bending the bridge chips.

Abstract translation: MCM包括面向芯片的二维阵列，其包括使用重叠连接器彼此通信的岛芯片（120-1,120-2）和桥芯片（122）。 为了保持这些连接器的相对垂直间隔，可压缩结构（124）位于衬底（110）中的空腔（114）中，其容纳桥芯片，并且在桥芯片的后表面上提供压缩力。 这些可压缩结构包括具有形状和体积压缩的柔性材料。 以这种方式，MCM可以确保岛芯片和桥芯片的面对表面以及这些表面上的连接器在不弯曲桥接芯片的情况下大致共面。

公开(公告)号：WO2014126575A9

公开(公告)日：2014-08-21

申请号：PCT/US2013/026233

申请日：2013-02-14

Applicant: NANOFIBER SEPARATIONS, LLC ,  MENKHAUS, Todd ,  FONG, Hao

Inventor： MENKHAUS, Todd ,  FONG, Hao

IPC: H05B7/00

Abstract: The present invention relates generally to compositions for use in biological and chemical separations, as well as other applications. More specifically, the present invention relates to hybrid felts fabricated from electrospun nanofibers with high permeance and high capacity. Such hybrid felts utilize derivatized cellulose, and at least one non-cellulose-based polymer that may be removed from the felt by subjecting it to moderately elevated temperatures and/or solvents capable of dissolving the non-cellulose-based polymer to leave behind a porous nanofiber felt having more uniform pore sizes and other enhanced properties when compared to single component nanofiber felts.

Abstract translation: 本发明一般涉及用于生物和化学分离以及其他应用的组合物。 更具体地说，本发明涉及由具有高渗透性和高容量的电纺纳米纤维制造的混合毡。 这种混合毡使用衍生化的纤维素，并且可以通过使其经受适度升高的温度和/或能够溶解非纤维素基聚合物的溶剂留下多孔体而从毡中除去至少一种非纤维素基聚合物 与单组分纳米纤维毡相比，纳米纤维毡具有更均匀的孔径和其他增强的性能。