Abstract:
A transparent armor laminate system includes a plurality of sub-stacks separated by an interlayer. The sub-stacks include a plurality of layers including a glass ceramic front strike-face layer, a backing layer comprising a spall-resistant material, and at least one glass layer laminated between the strike-face and backing layers. The interlayer isolates cracks between sub-stacks, and may include an isolating material such as a polymer, gas, or liquid. The laminate system offers improved performance with reduced weight over conventional all-glass or all-glass-ceramic transparent armors.
Abstract:
The present invention relates to a semiconductor-on-insulator structure including a semiconductor component comprised of substantially single-crystal semiconductor material layer and a single-crystal semiconductor material with an enhanced oxygen content layer; an oxide glass material layer; and a glass-ceramic layer.
Abstract:
The invention is directed to highly crystalline, frit sintered glass ceramic compositions having a coefficient of thermal expansion in the range of 85 115 x 10 -7 °C. The primary crystal phases of the glass ceramics of the invention possess a cyclosilicate structure. The glass ceramic of the invention are useful as metal to metal, metal to ceramic and ceramic to ceramic sealing agents, and also as high performance coating for metals and ceramics. In their broadest composition the glass ceramic contain, in weight percent, 30-55% SiO 2 , 5-40% CaO, 0-50% BaO, 0.1-10% Al 2 O 3 , and 0 40% SrO, wherein the sum of CaO + BaO + SrO is in the range of 35-65 wt. %. Optionally, the glass ceramic compositions may contain at least one from the group of >0 15 wt. % MgO and >0 10 wt. % ZnO. Also optionally, the glass ceramic compositions may contain >0 10 wt. % of at least one transition metal or rare earth metal oxide.
Abstract:
The present invention relates to semiconductor-on-insulator structures having strained semiconductor layers According to one embodiment of the invention, a semiconductor-on- insulator structure has a first layer including a semiconductor material (110), attached to a second layer including a glass or glass-ceramic (120), with the strain point of the glass or glass-ceramic equal to or greater than about 8000C.
Abstract:
The invention relates to glass articles suitable for use as electronic device housing/ enclosure or protective cover which comprise a glass material. Particularly, a housing/enclosure/cover comprising an ion-exchanged glass exhibiting the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa?m ½ ; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm 2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus ranging between about 50 to 100 GPa;; (7) a thermal conductivity of less than 2.0 W/m°C, and (9) and at least one of the following attributes: (i) a compressive surface layer having a depth of layer (DOL) greater and a compressive stress greater than 400 MPa, or, (ii) a central tension of more than 20 MPa.
Abstract:
The invention relates to opaque, colored glass ceramic articles and to the production of opaque, colored glass-ceramic articles which can be readily formed to a desired shape using standard metal-working tools. The glass-ceramic material used to make such articles contains mica crystals as the predominant phase. The desired color is obtained through the addition of a colorant system to the precursor glass. In a particular embodiment the invention is directed to a black glass ceramic article, the black color being obtained by the addition of iron oxides in levels as high as 20 wt%, which can yield a glass ceramic having an iron rice mica phase and/or a glass ceramic having an iron rich mica phase plus an iron oxide phase.
Abstract:
The invention describes a transparent glass armor having a plurality of crack arrestors. The armor may be monolithic, laminated or segmented. The crack arrestors enhance the ability of a transparent armor to absorb multiple projectile impacts without catastrophic failure or loss of optical transparency. The crack arrestors restrict propagation of cracks, and may be at non-orthogonal angles to the strike face.
Abstract:
A transparent armor laminate system is described that utilizes a glass ceramic material as the strike face material, one or a plurality of intermediate layers, and a backing material. This laminate system offers improved performance with reduced weight over conventional all glass or all-glass-ceramic transparent armor systems.
Abstract:
A semiconductor-on-insulator structure including first and second layers which are attached to one another either directly or through one or more intermediate layers. The first layer includes a substantially single crystal germanium semiconductor material while the second layer comprises a glass or a glass-ceramic material having a linear coefficient thermal of expansion (25-300°C) which is within the range of +/- 20x10 -7 /°C of the linear coefficient thermal of expansion of the germanium first layer.
Abstract:
Geopolymer composite materials having low coefficient of thermal expansion are disclosed. The materials are useful in high temperature applications due to their low coefficient of thermal expansion and high strength. Also disclosed is a boron modified water glass geopolymer composition that is compatible with ceramic particulate material such as cordierite and fused silica. The geopolymer composite may be extruded to form structures such as honeycomb monoliths, flow filters or used as a plugging or skinning cement and may be fired at temperatures at or below 1100°C. Both the structures and the cement have high green and fired strength, a low coefficient of thermal expansion, and good acid durability. The cost of manufacturing objects using the material of the present invention is substantially reduced, in comparison with typically production methods of cordierite based bodies, due to the substantially shortened firing times.