中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

14 records (took 0.009 seconds)

    METHOD OF MANUFACTURE OF WIRE EMBEDDED INLAY
    1.
    发明申请
    METHOD OF MANUFACTURE OF WIRE EMBEDDED INLAY 审中-公开
    电线嵌入式制造方法

    公开(公告)号：WO2009063454A2

    公开(公告)日：2009-05-22

    申请号：PCT/IL2008/001484

    申请日：2008-11-12

    Applicant: ON TRACK INNOVATIONS LTD. ,  SHAFRAN, Guy ,  BASHAN, Oded

    Inventor： SHAFRAN, Guy ,  BASHAN, Oded

    IPC: B32B37/00 ,  B32B7/12

    CPC classification number: G06K19/07749 ,  B29C70/82 ,  B29C70/885 ,  B32B2037/243 ,  Y10T156/10 ,  Y10T428/2804

    Abstract: A method of manufacture of wire-embedded inlays, the method including providing a substrate, applying a coating to the substrate, which coating melts at an elevated temperature characteristic of wire-embedding, thereby producing an inlay substrate and when the coating is solid, employing wire embedding techniques for embedding a wire into the inlay substrate.

    Abstract translation: 一种线嵌嵌入体的制造方法，该方法包括提供基板，向基板施加涂层，该涂层在线包埋的高温特性下熔融，从而制造嵌体基板，当涂层为固体时，采用 用于将线嵌入到嵌入式衬底中的线嵌入技术。

    CONTACTLESS SMART SIM
    2.
    发明申请
    CONTACTLESS SMART SIM 审中-公开
    无缝智能卡

    公开(公告)号：WO2009001352A2

    公开(公告)日：2008-12-31

    申请号：PCT/IL2008/000866

    申请日：2008-06-25

    Applicant: ON TRACK INNOVATIONS LTD. ,  BASHAN, Oded ,  GILBOA, Ronnie ,  SHAFRAN, Guy ,  ITAY, Nehemya

    Inventor： BASHAN, Oded ,  GILBOA, Ronnie ,  SHAFRAN, Guy ,  ITAY, Nehemya

    IPC: H04B1/38

    CPC classification number: H04M1/0262 ,  G06K7/10178 ,  G06K19/07771 ,  H04M1/7253 ,  H04M2250/14

    Abstract: A mobile communicator including a housing including a main portion and a removable portion, cellular telephone circuitry located within the main portion of the housing, a SIM card mounted in the main portion of the housing, a battery mounted between the removable portion of the housing and the SIM card and a contactless functionality antenna mounted intermediate the removable portion and the battery and communicating with the SIM card.

    Abstract translation: 一种移动通信装置，包括：壳体，包括主体部分和可移动部分;位于壳体主体部分内的蜂窝电话线路;安装在壳体主体部分的SIM卡;安装在壳体的可移除部分和 SIM卡和非接触式功能天线安装在可拆卸部分和电池的中间并与SIM卡通信。

    AUTHENTICATION SEAL
    3.
    发明申请
    AUTHENTICATION SEAL 审中-公开
    认证密封

    公开(公告)号：WO2010044084A1

    公开(公告)日：2010-04-22

    申请号：PCT/IL2009/000935

    申请日：2009-09-30

    Applicant: ON TRACK INNOVATIONS ,  BASHAN, Oded ,  SHAFRAN, Guy

    Inventor： BASHAN, Oded ,  SHAFRAN, Guy

    IPC: G06K19/10 ,  G06K19/08 ,  G06K19/077

    CPC classification number: G06K19/10 ,  G06K19/07749 ,  G06K19/07758 ,  G06K19/07798 ,  G06K19/08 ,  G06K19/083 ,  Y10T156/10

    Abstract: An authentication seal suitable for affixing to physical objects sought to be notarized, legalized or otherwise authenticated, the authentication seal including an object interface layer including an adhesive surface for fixed engagement with a surface of an object sought to be authenticated, an inlay layer, fixed to the object interface layer, the inlay layer including a substrate having embedded thereon a wireless communication antenna coupled to an electronic chip device containing authentication information which is wirelessly readable via the wireless communication antenna and an outer layer, fixed to the inlay layer and having visually sensible authentication indicia thereon.

    Abstract translation: 认证密封件，适用于附着于物理对象，经过公证，合法化或以其他方式认证，认证密封件包括物体界面层，包括用于与要认证的物体的表面固定接合的粘合剂表面，嵌入层，固定 所述嵌入层包括嵌入其上的衬底，所述衬底具有耦合到电子芯片装置的无线通信天线，所述无线通信天线包含经由所述无线通信天线无线读取的认证信息和外层，固定到所述嵌入层并具有视觉 其上有明智的认证标记。

    METHOD AND SYSTEM FOR MANUFACTURE OF AN ELECTRONIC INTERFACE CARD
    4.
    发明申请
    METHOD AND SYSTEM FOR MANUFACTURE OF AN ELECTRONIC INTERFACE CARD 审中-公开
    电子接口卡的制造方法和系统

    公开(公告)号：WO2008129547A3

    公开(公告)日：2010-02-25

    申请号：PCT/IL2008000538

    申请日：2008-04-17

    Applicant: ON TRACK INNOVATIONS LTD ,  SHAFRAN GUY

    Inventor： SHAFRAN GUY

    IPC: H01Q7/00

    CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07773 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/5317 ,  Y10T29/53178 ,  H01L2924/00

    Abstract: A method for manufacture of an electronic interface card including forming at least one antenna coil, having loose end portions, on a first substrate; placing a second substrate onto the first substrate over the antenna coil, the second substrate having an aperture through which at least parts of the loose end portions of the at least one antenna coil are exposed, extracting at least parts of the loose end portions through the aperture such that free ends of the loose end portions are positioned at a location remote from the substrate, forming an electric connection between a chip module and the loose end portions at the location remote from the substrate; and thereafter mounting the chip module onto the first substrate. A system for carrying out the method and a card produced thereby are also described and claimed.

    Abstract translation: 一种用于制造电子接口卡的方法，包括在第一基板上形成具有松散端部的至少一个天线线圈; 将第二基板放置在天线线圈上的第一基板上，第二基板具有孔，至少一个天线线圈的松散端部的至少一部分暴露在该孔中，通过该孔径至少部分松散端部 使得松散端部的自由端位于远离基板的位置处，在远离基板的位置处形成芯片模块与松动端部之间的电连接; 然后将芯片模块安装到第一基板上。 还描述并要求保护用于执行该方法的系统和由此产生的卡片。

    METHOD AND SYSTEM FOR MANUFACTURE OF AN ELECTRONIC INTERFACE CARD AND A CARD MANUFACTURED USING SAME
    6.
    发明申请
    METHOD AND SYSTEM FOR MANUFACTURE OF AN ELECTRONIC INTERFACE CARD AND A CARD MANUFACTURED USING SAME 审中-公开
    用于制造电子接口卡的方法和系统和使用其制造的卡

    公开(公告)号：WO2008129547A2

    公开(公告)日：2008-10-30

    申请号：PCT/IL2008/000538

    申请日：2008-04-17

    Applicant: ON TRACK INNOVATIONS LTD. ,  SHAFRAN, Guy

    Inventor： SHAFRAN, Guy

    IPC: H01L21/82

    CPC classification number: G06K19/07754 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07773 ,  H01L2924/0002 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/5317 ,  Y10T29/53178 ,  H01L2924/00

    Abstract: A method for manufacture of an electronic interface card including forming at least one antenna coil, having loose end portions, on a first substrate; placing a second substrate onto the first substrate over the antenna coil, the second substrate having an aperture through which at least parts of the loose end portions of the at least one antenna coil are exposed, extracting at least parts of the loose end portions through the aperture such that free ends of the loose end portions are positioned at a location remote from the substrate, forming an electric connection between a chip module and the loose end portions at the location remote from the substrate; and thereafter mounting the chip module onto the first substrate. A system for carrying out the method and a card produced thereby are also described and claimed.

    Abstract translation: 一种用于制造电子接口卡的方法，包括在第一基板上形成具有松散端部的至少一个天线线圈; 将第二基板放置在天线线圈上的第一基板上，第二基板具有孔，至少一个天线线圈的松散端部的至少一部分暴露在该孔中，通过该孔径至少部分松散端部 使得松散端部的自由端位于远离基板的位置处，在远离基板的位置处形成芯片模块与松动端部之间的电连接; 然后将芯片模块安装到第一基板上。 还描述并要求保护用于执行该方法的系统和由此产生的卡片。

    CONTACTLESS SMART SIM
    7.
    发明申请
    CONTACTLESS SMART SIM 审中-公开
    无缝智能卡

    公开(公告)号：WO2009001352A3

    公开(公告)日：2010-03-04

    申请号：PCT/IL2008000866

    申请日：2008-06-25

    Applicant: ON TRACK INNOVATIONS LTD ,  BASHAN ODED ,  GILBOA RONNIE ,  SHAFRAN GUY ,  ITAY NEHEMYA

    Inventor： BASHAN ODED ,  GILBOA RONNIE ,  SHAFRAN GUY ,  ITAY NEHEMYA

    IPC: H04M1/00

    CPC classification number: H04M1/0262 ,  G06K7/10178 ,  G06K19/07771 ,  H04M1/7253 ,  H04M2250/14

    Abstract: A mobile communicator including a housing including a main portion and a removable portion, cellular telephone circuitry located within the main portion of the housing, a SIM card mounted in the main portion of the housing, a battery mounted between the removable portion of the housing and the SIM card and a contactless functionality antenna mounted intermediate the removable portion and the battery and communicating with the SIM card.

    Abstract translation: 一种移动通信装置，包括：壳体，包括主体部分和可移动部分;位于壳体主体部分内的蜂窝电话线路;安装在壳体主体部分的SIM卡;安装在壳体的可移除部分和 SIM卡和非接触式功能天线安装在可拆卸部分和电池的中间并与SIM卡通信。

    ELECTRONIC INLAY STRUCTURE AND METHOD OF MANUFACTURE THEROF
    10.
    发明申请
    ELECTRONIC INLAY STRUCTURE AND METHOD OF MANUFACTURE THEROF 审中-公开
    电子内置结构及其制造方法

    公开(公告)号：WO2009063455A3

    公开(公告)日：2010-03-11

    申请号：PCT/IL2008001485

    申请日：2008-11-12

    Applicant: ON TRACK INNOVATIONS LTD ,  SHAFRAN GUY ,  BASHAN ODED

    Inventor： SHAFRAN GUY ,  BASHAN ODED

    IPC: G06K7/10

    CPC classification number: B29C66/43 ,  B29C65/02 ,  B29C65/4815 ,  B29C65/5042 ,  B29C65/7802 ,  B29C65/7808 ,  B29C66/1122 ,  B29C66/1142 ,  B29C66/21 ,  B29C66/433 ,  B29C66/45 ,  B29C66/71 ,  B29C66/72328 ,  B29C66/8322 ,  B29K2027/06 ,  B29K2055/02 ,  B29K2067/00 ,  B29K2067/043 ,  B29K2069/00 ,  B29K2711/123 ,  B29L2017/00 ,  G06K19/025 ,  Y10T428/2457 ,  B29K2067/003

    Abstract: An electronic inlay structure including first and second sheets of an inlay substrate arranged in generally side to side, spaced parallel arrangement, having a gap therebetween, a flexible web material arranged to overlie the gap and edges of the first and second sheets of the inlay structure adjacent the gap, third and fourth sheets arranged in registration with the first and second sheets respectively, over the first and second sheets of the inlay substrate and partially over the flexible web material and bonded thereto, electronic circuitry associated with at least one of the first, second, third and fourth sheets and lamination enclosing the first, second, third and fourth sheets, the electronic circuitry and the web material together to create the inlay structure. 1

    Abstract translation: 一种电子嵌体结构，包括第一和第二片嵌入式基底，其布置成大体上一侧到另一侧，间隔开的平行布置，其间具有间隙;柔性幅材材料布置成覆盖所述第一和第二片状嵌体结构的间隙和边缘 邻近所述间隙，第三和第四片材分别与所述第一和第二片材对准布置在所述第一和第二片的所述嵌入式衬底上，并且部分地覆盖所述柔性幅材材料并且与所述第一片和所述第二片材接合，电子电路与所述第一和第二片材中的至少一个相关联 第二片，第三片和第四片，并将第一片，第二片，第三片和第四片，电子电路和片材材料包围在一起以形成嵌体结构。 1

Patent Agency Ranking