公开(公告)号：WO2006091410A1

公开(公告)日：2006-08-31

申请号：PCT/US2006/004946

申请日：2006-02-13

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  MORRIS, James, M.

Inventor： MORRIS, James, M.

IPC: B23K1/08 ,  B23K3/06 ,  B23K1/00 ,  H05K3/34 ,  B23K101/42

CPC classification number: B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2201/42 ,  H05K3/3468

Abstract: A wave solder nozzle (42) is capable of delivering solder material to perform a wave soldering operation on a printed circuit board (18) in an inert atmosphere. The wave solder nozzle (42) includes a front plate (48) and a back plate (50) coupled to the front plate (48). The front plate (48) and the back plate (50) define a channel (52) through which solder material (54) flows. The nozzle (42) further includes an exit trough (58) extending from the back plate (52). The exit trough (58) has a weir (60) provided at one end of the exit trough (58). The exit trough (58) is constructed and arranged to control the flow of solder material (54) from the wave solder nozzle (42). A surface of the exit trough (60) is wettable to improve the flow of solder material (54) out of the wave solder nozzle (42). A method of improving the flow of solder material (52) through the nozzle (42) is also disclosed.

Abstract translation: 波浪焊嘴（42）能够输送焊料材料，以在惰性气氛中对印刷电路板（18）进行波峰焊接操作。 波峰喷嘴（42）包括前板（48）和耦合到前板（48）的后板（50）。 前板（48）和后板（50）限定了焊料（54）流过的通道（52）。 喷嘴（42）还包括从背板（52）延伸的出口槽（58）。 出口槽（58）具有设置在出口槽（58）一端的堰（60）。 出口槽（58）被构造和布置成控制来自波峰焊嘴（42）的焊料材料（54）的流动。 出口槽（60）的表面是可湿润的，以改善焊料材料（54）从波浪焊嘴（42）流出的流动。 还公开了通过喷嘴（42）改善焊料材料（52）的流动的方法。

公开(公告)号：WO2005107355A2

公开(公告)日：2005-11-10

申请号：PCT/US2005/013763

申请日：2005-04-22

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  PRENTICE, Thomas, C. ,  PRINCE, David, P.

Inventor： PRENTICE, Thomas, C. ,  PRINCE, David, P.

IPC: H05K13/08

CPC classification number: H05K13/0469 ,  H05K13/08

Abstract: Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.

Abstract translation: 本发明的方面涉及用于将材料分配到基底上的系统和方法。 在一个方面，分配系统包括分配器，分配器可定位在衬底的顶表面上，分配器具有基本上垂直的分配轴线，分配器从其分配材料，以及耦合到分配器的视觉系统， 所述视觉系统可定位成沿着光轴获得所述基底的顶表面的图像，其中所述视觉系统被构造和布置成使得所述光轴与所述分配轴相交。

公开(公告)号：WO2004022351A2

公开(公告)日：2004-03-18

申请号：PCT/US2003/027149

申请日：2003-08-27

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  VAN-DIEP, Gerald, Pham ,  ANDRES, Frank

Inventor： VAN-DIEP, Gerald, Pham ,  ANDRES, Frank

IPC: B41M

CPC classification number: H05K3/1233 ,  B41L13/02 ,  H05K2203/0285 ,  H05K2203/0292

Abstract: An apparatus and method for depositing material on a surface of an electronic substrate includes a frame, a substrate support coupled to the frame to support the electronic substrate, a stencil coupled to the frame having at least one aperture to receive a material to be deposited through the aperture onto the surface of the electronic substrate, a controller that controls dispensing of material on the substrates, and a vibration system, coupled to one of the stencil, the frame and the substrate support, and coupled to the controller, that introduces a vibration to the stencil, wherein the vibration has a frequency controlled by the controller based on characteristics of at least one of the material, the stencil and the electronic substrate. Release of material from the apertures is accomplished while the vibration is applied to the stencil.

Abstract translation: 用于在电子基板的表面上沉积材料的设备和方法包括框架，耦合到框架以支撑电子基板的基板支撑件，耦合到框架的模板具有至少一个孔 通过孔将沉积材料接收到电子基板的表面上;控制器，控制基板上材料的分配;以及振动系统，与模板，框架和基板支撑件中的一个耦合， 传送给控制器，该控制器向模板引入振动，其中振动具有由控制器基于材料，模板和电子基板中的至少一个的特性控制的频率。 当振动施加到模板上时，从孔中释放材料。

公开(公告)号：WO2004015597A1

公开(公告)日：2004-02-19

申请号：PCT/US2003/024709

申请日：2003-08-08

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  MURPHY, Michael ,  SCHMIDT, Eric ,  DIAZ, Aly

Inventor： MURPHY, Michael ,  SCHMIDT, Eric ,  DIAZ, Aly

IPC: G06F17/50

CPC classification number: H05K3/1225 ,  G06F17/5068 ,  H05K1/0292 ,  H05K1/111 ,  H05K3/0005 ,  H05K2203/107 ,  Y10T156/1052 ,  Y10T156/1056

Abstract: Customer data relating to the location and character of fiduccials (e.g., conductive pads to which electronic parts are soldered on a printed circuit board) are stored in a digital form (e.g., as "Gerber data"). A library of footprints that characterize the features is created from this data (62, 64). A footprint filter and a modification parameter are then applied to the footprint library to select footprints for modification and to make a desired change to the selected footprints. In a printed circuit board embodiment, apertures (54, 56) in a stencil designed for printing solder on the printed circuit board are then cut in accordance with the footprints. Data representing all the apertures to be cut in the stencil can be moved or scaled to compensate for variations in the printed circuit board manufacturing and stencil manufacturing processes. The above-described method can be carried out via instructions stored as software code on a computer-readable medium.

Abstract translation: 与数字形式（例如，作为“格伯数据”）以数字形式（例如，“格柏数据”）存储有关信号的位置和特征的客户数据（例如，电子部件在印刷电路板上焊接的导电焊盘）。 从这些数据（62,64）创建一个表征特征的脚印库。 然后将足迹过滤器和修改参数应用于占位图库，以选择要修改的脚印，并对所选的占位图进行所需的更改。 在印刷电路板的实施例中，然后根据占地面积切割设计用于在印刷电路板上印刷焊料的模板中的孔（54,56）。 可以移动或缩放表示在模板中要切割的所有孔的数据，以补偿印刷电路板制造和模板制造工艺中的变化。 可以通过在计算机可读介质上作为软件代码存储的指令来执行上述方法。

公开(公告)号：WO2003061892A1

公开(公告)日：2003-07-31

申请号：PCT/US2003/001504

申请日：2003-01-17

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  MILLER, Richard, W. ,  DAUTENHAHN, Jonathan, M. ,  APELL, Marc, C.

Inventor： MILLER, Richard, W. ,  DAUTENHAHN, Jonathan, M. ,  APELL, Marc, C.

IPC: B23K1/008

CPC classification number: B23K1/008

Abstract: Flux management systems and methods are provided for filtering vaporized flux from the gas of a reflow soldering oven. A flux management system includes a cooling chamber having a cooling medium through which the gas passes. The vaporized flux condenses on the surfaces of the cooling chamber and drips into a collection pan, thereby preventing it from dripping onto circuit boards passing through the oven. The flux management system may further include a self-cleaning feature that includes a compressed gas, which is allowed to enter the cooling chamber through a solenoid valve. The compressed gas may then be directed through a heater, which increases the temperature of the cooling chamber, thereby causing a decrease in viscosity of the flux, which allows it to flow freely into a drain tube. The flux may then be transported by gravity into a collection container.

Abstract translation: 提供了焊剂管理系统和方法，用于从回流焊炉的气体中过滤蒸发的焊剂。 助熔剂管理系统包括具有气体通过的冷却介质的冷却室。 蒸发的通量在冷却室的表面冷凝并滴入收集盘，从而防止其滴落在通过烤箱的电路板上。 助熔剂管理系统还可以包括自清洁特征，其包括压缩气体，其被允许通过电磁阀进入冷却室。 压缩气体然后可以被引导通过加热器，这增加了冷却室的温度，从而导致焊剂的粘度降低，这允许其自由地流入排水管。 然后可以通过重力将通量输送到收集容器中。

公开(公告)号：WO2002062515A2

公开(公告)日：2002-08-15

申请号：PCT/US2002/000665

申请日：2002-01-11

Applicant: SPEEDLINE TECHNOLOGIES, INC.

Inventor： MORRIS, James ,  WILLIS, Scott, C. ,  MCDONALD, David

IPC: B23K3/00

CPC classification number: B23K3/08

Abstract: An automatic dross removal apparatus for a reservoir having a cavity for containing solder, the apparatus comprising; a conveyor having an endless belt and a first end extending within the cavity of the reservoir for removing dross on the surface of the liquid solder; or a skimmer having a first end extending within the cavity of the reservoir and being movable within the reservoir for miving dross on the surface of the liquid solder out of the reservoir.

Abstract translation: 一种用于储存器的自动除渣装置，具有用于容纳焊料的空腔，该装置包括： 具有环形带的输送机和在所述储存器的空腔内延伸的第一端，用于去除所述液体焊料的表面上的浮渣; 或撇渣器，其具有在储存器的空腔内延伸的第一端，并且可在贮存器内移动，以将液体焊料的表面上的浮渣排出储存器。

公开(公告)号：WO2008008177A3

公开(公告)日：2008-01-17

申请号：PCT/US2007/014861

申请日：2007-06-27

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  WILLSHERE, Richard ,  PERAULT, Joseph, A. ,  LYNCH, James

Inventor： WILLSHERE, Richard ,  PERAULT, Joseph, A. ,  LYNCH, James

IPC: B41F15/18 ,  B41F15/26 ,  H05K3/12 ,  H05K13/00

Abstract: A stencil printer (10) for printing viscous material on a substrate includes a frame (12), a stencil (16) coupled to the frame, and a print head (18), coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support (28) to support a substrate in a print position and a substrate clamping assembly (28) to clamp the substrate in the print position. In a certain embodiment, the substrate clamping assembly includes a pair of rail members (22, 24) coupled to the frame. The rail members are adapted to engage opposite edges of the substrate (26). The substrate clamping assembly further includes a pair of foils, one for each rail member, with each foil being releasably secured to the rail member (82) in a position so that the foil (80) overlies the substrate. The substrate clamping assembly also includes a pair of clamping member's (84), one for each rail member and foil, to releasably secure the foil in place on the rail member.

公开(公告)号：WO2007092325A3

公开(公告)日：2007-08-16

申请号：PCT/US2007/002925

申请日：2007-02-01

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  PRINCE, David, P.

Inventor： PRINCE, David, P.

IPC: H05K3/12 ,  B41F15/08 ,  G01N21/84

Abstract: A stencil printer for depositing solder paste onto an electronic substrate includes a frame and a stencil coupled to the frame. A dispenser is coupled to the frame, with the dispenser and the stencil being configured to deposit solder paste onto the plurality of pads of the electronic substrate. An imaging system is configured to capture images of regions of interest of at least one of the electronic substrate and the stencil. The stencil printer further includes a controller coupled to the imaging system, with the controller being configured to control movement of the imaging system to capture images of regions of interest (86) of at least one of the electronic substrate and the stencil extending generally along a first axis (84) before moving the imaging system in another direction. A method for dispensing material on a substrate is further disclosed.

公开(公告)号：WO2005107355A3

公开(公告)日：2006-03-23

申请号：PCT/US2005013763

申请日：2005-04-22

Applicant: SPEEDLINE TECHNOLOGIES INC ,  PRENTICE THOMAS C ,  PRINCE DAVID P

Inventor： PRENTICE THOMAS C ,  PRINCE DAVID P

IPC: B05C5/00 ,  B05C11/00 ,  H05K13/04 ,  H05K13/08

CPC classification number: H05K13/0469 ,  H05K13/08

Abstract: Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.

公开(公告)号：WO2006019802A1

公开(公告)日：2006-02-23

申请号：PCT/US2005/024828

申请日：2005-07-13

Applicant: SPEEDLINE TECHNOLOGIES, INC. ,  WILLSHERE, Richard

Inventor： WILLSHERE, Richard

IPC: B23K3/06

CPC classification number: B41F15/42 ,  B23K3/0638 ,  B41P2215/132 ,  H05K3/0097 ,  H05K3/1233 ,  H05K2203/0126 ,  H05K2203/0139

Abstract: A method for printing a viscous material on substrates within a stencil printer includes supplying viscous material to a dispensing region of a print head, positioning a first substrate into a print position, printing on the first substrate by means of a pair of blades (52, 54) in contact with a stencil (16) during a first print stroke in which the pair of blades travel in a first direction (80), the dispensing region being defined between the pair of blades, positioning a second substrate into a print position, and printing on the second substrate during a second print stroke in which the pair of blades travel in a second direction (82), opposite to the first direction, the pair of blades maintaining contact with the stencil when transitioning between the first and second print strokes. A print head and a stencil printer are further disclosed.

Abstract translation: 一种用于在模板印刷机中的基板上印刷粘性材料的方法包括：将粘性材料供应到打印头的分配区域，将第一基板定位到打印位置，借助于一对叶片（52,52）在第一基板上进行印刷， 54）在第一打印行程期间与模板（16）接触，其中所述一对刀片沿着第一方向（80）行进，所述分配区域被限定在所述一对刀片之间，将第二衬底定位到打印位置， 并且在第二打印行程期间在第二打印行程中打印第二打印行程，其中所述一对刀片沿与第一方向相反的第二方向（82）行进，所述一对刀片在第一和第二打印笔划之间转换时保持与模板的接触 。 进一步公开了打印头和模版印刷机。