公开(公告)号：WO2007141686A1

公开(公告)日：2007-12-13

申请号：PCT/IB2007/051884

申请日：2007-05-16

Applicant: NXP B.V. ,  SCHERABON, Christian ,  SALFELNER, Anton ,  STEINBAUER, Wolfgang ,  SCHOBER, Joachim

Inventor： SCHERABON, Christian ,  SALFELNER, Anton ,  STEINBAUER, Wolfgang ,  SCHOBER, Joachim

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  H01L23/49855 ,  H01L23/642 ,  H01L23/645 ,  H01L24/06 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/13013 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/17106 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/29075 ,  H01L2924/00

Abstract: A semiconductor chip (1, 91) for a transponder (3, 93) comprises a chip substrate (4) with a surface (5), chip terminals (6, 7) arranged on the surface (5), and a passivation layer (22) covering the surface (5) and completely covering the chip terminals (6, 7), so that an antenna (2, 30) with antenna terminals (24, 25) can be attached to the chip (1, 91) above the chip terminals (6, 7), so that the chip terminals (6, 7), the passivation layer (22) and the antenna terminal (24, 25) form first capacitors.

Abstract translation: 用于应答器（3,93）的半导体芯片（1,91）包括具有表面（5）的芯片衬底（4），布置在表面（5）上的芯片端子（6,7）和钝化层 22）覆盖所述表面（5）并完全覆盖所述芯片端子（6,7），使得具有天线端子（24,25）的天线（2,30）可以附接到所述芯片（1,91）上方的所述芯片 芯片端子（6,7），使得芯片端子（6,7），钝化层（22）和天线端子（24,25）形成第一电容器。