公开(公告)号：WO2013033034A3

公开(公告)日：2013-03-07

申请号：PCT/US2012/052552

申请日：2012-08-27

Applicant: LAWRENCE LIVERMORE NATIONAL SECURITY, LLC ,  SHAH, Kedar G. ,  PANNU, Satinderpall S. ,  TOOKER, Angela C.

Inventor： SHAH, Kedar G. ,  PANNU, Satinderpall S. ,  TOOKER, Angela C.

IPC: H01L21/60 ,  H05K3/40 ,  H05K3/32

Abstract: A method of making high-density electrical interconnects between micro-electronic components using rivet bonds, by positioning a first substrate over a second substrate to align a through-hole and adjacent first metal bond pad of the first substrate with a second metal bond pad of the second substrate, and forming a metal bump through the through-hole so that the metal bump bonds to and electrically connects the first and second metal bond pads via the through-hole.

公开(公告)号：WO2013033034A2

公开(公告)日：2013-03-07

申请号：PCT/US2012052552

申请日：2012-08-27

Applicant: L LIVERMORE NAT SECURITY LLC ,  SHAH KEDAR G ,  PANNU SATINDERPALL S ,  TOOKER ANGELA C

Inventor： SHAH KEDAR G ,  PANNU SATINDERPALL S ,  TOOKER ANGELA C

IPC: H01L21/60 ,  H05K3/32 ,  H05K3/40

CPC classification number: H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/0557 ,  H01L2224/1134 ,  H01L2224/13009 ,  H01L2224/1601 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45178 ,  H01L2224/48091 ,  H01L2224/48453 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2224/811 ,  H01L2224/81193 ,  H01L2224/81365 ,  H01L2224/8192 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K3/328 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01078 ,  H01L2924/00

Abstract: A method of making high-density electrical interconnects between micro-electronic components using rivet bonds, by positioning a first substrate over a second substrate to align a through-hole and adjacent first metal bond pad of the first substrate with a second metal bond pad of the second substrate, and forming a metal bump through the through-hole so that the metal bump bonds to and electrically connects the first and second metal bond pads via the through-hole.

Abstract translation: 一种使用铆钉结合在微电子元件之间形成高密度电互连的方法，通过将第一衬底放置在第二衬底上以使第一衬底的通孔和相邻的第一金属键合焊盘与第二衬底的第二金属键合焊盘对齐， 第二衬底，并且穿过通孔形成金属凸块，使得金属凸块通过通孔结合并电连接第一金属接合焊盘和第二金属接合焊盘。