公开(公告)号：WO2014032228A1

公开(公告)日：2014-03-06

申请号：PCT/CN2012/080668

申请日：2012-08-28

Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. ,  WANG, Li ,  ZHU, Wenqiang ,  NIAN, Peter ,  PIADUCHE, Robertito ,  ARMENTANO, Aj ,  ZHANG, Jianjian

Inventor： WANG, Li ,  ZHU, Wenqiang ,  NIAN, Peter ,  PIADUCHE, Robertito ,  ARMENTANO, Aj ,  ZHANG, Jianjian

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/488 ,  H01L23/50

CPC classification number: H01L24/06 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/06179 ,  H01L2224/2919 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48482 ,  H01L2224/4903 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83101 ,  H01L2224/85048 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor device and a method of fabricating the semiconductor device are provided by the implementation of the present invention. The semiconductor device comprises: a substrate, a semiconductor die disposed above the substrate, and a bonding member. The substrate further comprises a bonding finger. The semiconductor die further comprises a first and an adjacent second bonding pads. The bonding member further comprises a single bonding wire having a ball disposed on a first end that electrically connects the first bonding pad and the second bonding pad and an opposite second end bonded directly on the bonding finger.

Abstract translation: 通过实施本发明提供半导体器件和制造半导体器件的方法。 半导体器件包括：衬底，设置在衬底上方的半导体管芯，以及接合构件。 基板还包括粘结指状物。 半导体管芯还包括第一和第二相邻的第二接合焊盘。 接合构件还包括单个接合线，其具有设置在电连接第一接合焊盘和第二接合焊盘的第一端上的球，以及直接接合在接合指状物上的相对的第二端。