公开(公告)号：WO2007091582A1

公开(公告)日：2007-08-16

申请号：PCT/JP2007/052085

申请日：2007-02-07

Applicant: 日立化成工業株式会社 ,  品田 詠逸 ,  加藤 雅広 ,  渡邊 了晃

Inventor： 品田 詠逸 ,  加藤 雅広 ,  渡邊 了晃

IPC: H05K3/46

CPC classification number: H05K3/4614 ,  H05K3/3484 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/043 ,  H05K2203/061 ,  H05K2203/063 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49149

Abstract: Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board (1) is provided with a wiring, which has a wiring section and a bump mounting pad (14), and a substrate section. The method is provided with a step of forming a solder bump (3) on at least a bump mounting pad on the first printed board or a pad section of a second printed board (2) having the pad section (15) by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive (4) between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.

Abstract translation: 提供一种多层布线基板的制造方法，能够有效地进行层间连接，同时可以形成具有中空结构或贯通孔的非贯通孔，而不会损坏内壁上的电镀部 通孔。 第一印刷电路板（1）具有布线，布线部分和凸块安装焊盘（14）以及基板部分。 该方法具有以下步骤：在第一印刷电路板上的至少凸块安装焊盘或具有焊盘部分（15）的第二印刷电路板（2）的焊盘部分上形成焊料凸块（3） 并且通过在第一印刷电路板和第二印刷电路板之间具有绝缘粘合剂（4）并将第一印刷电路板与第二印刷电路板电连接，将第一印刷电路板和第二印刷电路板接合在一起的步骤。