公开(公告)号：WO2018026689A1

公开(公告)日：2018-02-08

申请号：PCT/US2017/044607

申请日：2017-07-31

Applicant: BOURNS, INC.

Inventor： AHEARNE, Brian ,  CHU, Stelar

IPC: H01C1/028 ,  H01C1/14 ,  H01C1/142 ,  H01C1/148 ,  H01C7/02 ,  H01C7/13 ,  H01C17/02 ,  H01C17/28 ,  H05K1/05 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44

Abstract: A connector for providing electronic communication with an electronic device is disclosed. The connector can comprise a substrate comprising layers of non-conductive material and conductive material. The connector can include an interface member mounted to the substrate and electrically connected with the conductor. A positive temperature coefficient (PTC) fuse can be embedded in the substrate and electrically connected with the conductor and the interface member. At least a portion of the PTC fuse can be disposed directly below the interface member.

Abstract translation: 公开了一种用于提供与电子设备的电子通信的连接器。 连接器可以包括包含非导电材料层和导电材料层的基板。 连接器可以包括安装到基板并与导体电连接的接口构件。 正温度系数（PTC）熔丝可以嵌入基板中并与导体和接口构件电连接。 至少一部分PTC熔断器可以直接设置在界面构件的下面。

公开(公告)号：WO2022150342A1

公开(公告)日：2022-07-14

申请号：PCT/US2022/011249

申请日：2022-01-05

Applicant: BOURNS, INC.

Inventor： SU, Che-Yi ,  CHIEN, Jeff ,  CHU, Stelar ,  CHUNG, Simon

IPC: H01C1/14 ,  H01C7/02 ,  H01C7/18 ,  H01C17/28

Abstract: In some embodiments, a multi-layer electrical device can include multiple electrodes connected to respective terminals, with at least two selected terminals being configured to allow movement relative to each other to accommodate a change in separation distance of the respective electrodes resulting from a change in temperature, and to allow a solder to provide a connection therebetween when the multi-layer electrical device is soldered on a mounting surface. In some embodiments, the multi-layer electrical device can further include a layer having a temperature-dependent electrical property implemented between each neighboring pair of electrodes.

公开(公告)号：WO2007121412A3

公开(公告)日：2007-10-25

申请号：PCT/US2007/066729

申请日：2007-04-16

Applicant: BOURNS, INC. ,  BOURNS, Gordon L. ,  CHU, Stelar ,  GRINDELL, Daniel E. ,  HUANG, David ,  KELLY, John ,  MEIJER, Erik

Inventor： BOURNS, Gordon L. ,  CHU, Stelar ,  GRINDELL, Daniel E. ,  HUANG, David ,  KELLY, John ,  MEIJER, Erik

IPC: H05K1/00

Abstract: Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.

公开(公告)号：WO2004053899A1

公开(公告)日：2004-06-24

申请号：PCT/US2003/007875

申请日：2003-03-14

Applicant: BOURNS, INC. ,  BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

IPC: H01C1/14

CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

Abstract translation: 使用印刷电路板制造工艺制造电子设备。 特别地，层状器件包括第一金属层（12），第二金属层（14），夹在第一和第二金属层之间的至少一层器件材料。 第一层绝缘材料（40）基本上覆盖第一金属层（12）。 第三金属层（48）设置在第一绝缘材料层（40）上。 该第三金属层（48）被分割以提供第一端子（90）和第二端子（92）。 第一端子（90）通过通过所述第一绝缘材料层（40）形成的导电互连（84）与第一金属层（12）电连接，并且第二端子（92）电连接到所述第二金属 层（14）由包括绝缘导电通道的导电路径（68）穿过并与所述第一金属层（12）和所述至少一层装置材料（16）绝缘。 使用绝缘通道提供了一种成本有效的制造方法，并使所使用的器件材料的有效面积最大化。 通过此方法构建PTC组件。