公开(公告)号：WO2018013160A1

公开(公告)日：2018-01-18

申请号：PCT/US2016/053495

申请日：2016-09-23

Applicant: CORNING INCORPORATED

Inventor： LAL, Archit ,  MAUREY, Pamela Arlene ,  NOLAN, Daniel Aloysius ,  SENARATNE, Wageesha

IPC: H01L51/52

Abstract: Disclosed herein are OLED devices (100) comprising waveguides (160) including at least one waveguide layer (390) comprising at least one inorganic nanoparticle and at least one binder and having an RMS surface roughness of less than about 20 nm. Lighting and display devices comprising such OLED devices are further disclosed herein as well as methods for making the waveguides.

Abstract translation: 本文公开了包括波导（160）的OLED器件（100），所述波导（160）包括至少一个波导层（390），所述波导层（390）包含至少一种无机纳米粒子和至少一种粘合剂并且RMS表面粗糙度小于 约20nm。 本文进一步公开了包括这种OLED器件的照明和显示装置以及制造波导的方法。

公开(公告)号：WO2018067920A1

公开(公告)日：2018-04-12

申请号：PCT/US2017/055523

申请日：2017-10-06

Applicant: CORNING INCORPORATED

Inventor： DEMARTINO, Steven Edward ,  HAWTOF, Daniel Warren ,  LAL, Archit ,  LI, Xinghua ,  MAUREY, Daniel L. ,  UHLIG, Kevin William

IPC: C03B19/06 ,  C04B41/00

Abstract: A method for processing material includes sintering a portion of a sheet of material at a location on the sheet, moving the sintering location along the sheet of material at a first rate, and pulling the sintered material away from the sintering location at a second rate that is greater than the first rate.

Abstract translation: 用于处理材料的方法包括在片材上的位置烧结片材的一部分，以第一速率沿着片材移动烧结位置，并且将烧结的材料从第一速率 以大于第一速率的第二速率烧结位置。

公开(公告)号：WO2017132299A1

公开(公告)日：2017-08-03

申请号：PCT/US2017/015006

申请日：2017-01-26

Applicant: CORNING INCORPORATED

Inventor： HAWTOF, Daniel Warren ,  LAL, Archit ,  LIN, Jen-Chieh ,  TROTT, Gary Richard

IPC: H05K1/03 ,  H05K1/16 ,  H05K3/00

CPC classification number: C03C3/06 ,  C03C17/06 ,  C03C2204/08 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/0029 ,  H05K2201/0108 ,  H05K2201/10098 ,  H05K2201/2072 ,  H05K2203/0307 ,  H05K2203/107 ,  H05K2203/1131

Abstract: A high silica content substrate, such as for a device, is provided. The substrate has a high silica content and is thin. The substrate may include a surface with a topography or profile that facilitates bonding with a conductive metal layer, such as a metal layer for a circuit or antenna. The substrate may be flexible, have high temperature resistance, very low CTE, high strength and/or be non-reactive. The substrate may be suitable for use in circuits intended for use in high temperature environments, low temperature environments, reactive environments, or other harsh environments. The substrate may be suitable for high frequency antenna applications.

Abstract translation: 提供高二氧化硅含量的衬底，例如用于器件的衬底。 基材具有高的二氧化硅含量并且很薄。 衬底可以包括具有便于与导电金属层（例如用于电路或天线的金属层）结合的形貌或轮廓的表面。 基材可以是柔性的，具有耐高温性，非常低的CTE，高强度和/或不反应性。 衬底可适用于旨在用于高温环境，低温环境，反应环境或其他恶劣环境中的电路。 基板可能适用于高频天线应用。

公开(公告)号：WO2016168049A1

公开(公告)日：2016-10-20

申请号：PCT/US2016/026372

申请日：2016-04-07

Applicant: CORNING INCORPORATED

Inventor： HAWTOF, Daniel Warren ,  LAL, Archit

IPC: H01M4/66 ,  H01M10/0525 ,  H01M10/0585 ,  H01M6/40

CPC classification number: H01M10/0436 ,  H01M4/387 ,  H01M4/485 ,  H01M4/505 ,  H01M4/525 ,  H01M4/5815 ,  H01M4/5825 ,  H01M4/587 ,  H01M4/664 ,  H01M4/667 ,  H01M6/40 ,  H01M10/0525 ,  H01M10/0585 ,  H01M2004/027 ,  H01M2004/028 ,  H01M2220/30

Abstract: A high silica content substrate, such as for a thin-film battery, is provided. The substrate has a high silica content, such as over 90% by weight silica, and is thin, for example less than 500 µm. The substrate may include a surface with a topography or profile that facilitates bonding with a coating layer, such as a coating of an electrochemical battery material. The high silica content substrate may be flexible, have high temperature resistance, high strength and/or be non-reactive The substrate may be suitable for use in the high temperature environments used in many chemical deposition or formation processes, such as electrochemical battery material formation processes.

Abstract translation: 提供高二氧化硅含量的基底，例如薄膜电池。 基板具有高的二氧化硅含量，例如超过90重量％的二氧化硅，并且薄，例如小于500μm。 衬底可以包括具有促进与涂层（例如电化学电池材料的涂层）的粘合的形貌或轮廓的表面。 高二氧化硅含量的基底可以是柔性的，具有耐高温性，高强度和/或非反应性的底物可适用于许多化学沉积或形成过程中使用的高温环境，例如电化学电池材料形成 流程。

公开(公告)号：WO2016077289A1

公开(公告)日：2016-05-19

申请号：PCT/US2015/059860

申请日：2015-11-10

Applicant: CORNING INCORPORATED

Inventor： BHAGAVATULA, Venkata Adiseshaiah ,  HAWTOF, Daniel Warren ,  LAL, Archit ,  LI, Xinghua ,  STONE, John, III ,  THOMAS, Windsor Pipes, III

IPC: C03C3/06 ,  C01B31/02 ,  C03B19/14 ,  B23K26/00 ,  C03C23/00

CPC classification number: C03C23/0025 ,  B01J21/08 ,  B01J35/002 ,  B01J35/0026 ,  B01J35/023 ,  B01J35/06 ,  B01J35/10 ,  B01J35/1004 ,  B01J37/349 ,  C01B32/16 ,  C01B32/162 ,  C01B33/12 ,  C03B19/1453 ,  C03C3/06 ,  C03C17/22 ,  C03C17/36 ,  C03C17/3605 ,  C03C17/3634 ,  C03C23/0095 ,  C03C2201/3488

Abstract: An assembly for making and/or using carbon nanotubes includes a substrate and at least one of carbon nanotubes and precursors thereof. The substrate is SiO2 and has a thickness of less than 500 µm. Further, the substrate is bendable and has a surface with non-flat or non-polished texture such that surface comprises raised and recessed features. Carbon nanotubes and/or precursors thereof are coupled to recessed features of the substrate.

Abstract translation: 用于制造和/或使用碳纳米管的组件包括底物和碳纳米管及其前体中的至少一种。 基板是SiO 2，厚度小于500μm。 此外，基板是可弯曲的并且具有非平坦或非抛光纹理的表面，使得表面包括凸起和凹陷的特征。 碳纳米管和/或其前体与衬底的凹陷特征耦合。