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    HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS
    3.
    发明申请
    HERMETIC FULLY-FILLED METALLIZED THROUGH-HOLE VIAS 审中-公开

    公开(公告)号：WO2020163078A1

    公开(公告)日：2020-08-13

    申请号：PCT/US2020/014501

    申请日：2020-01-22

    申请人： CORNING INCORPORATED

    发明人： MAZUMDER, Prantik ,  OKORO, Chukwudi Azubuike ,  PARK, Ah-Young ,  POLLARD, Scott Christopher ,  SUBBAIYAN, Navaneetha Krishnan

    IPC分类号： H01L21/48 ,  H01L23/15 ,  H01L23/498

    摘要： According to various embodiments, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, in an axial direction, the via defining an interior surface and a first axial portion, a third axial portion, and a second axial portion disposed between the first axial portion and the third axial portion along the axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface in at least the first axial portion and/or the third axial portion and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, of the via, the via has a maximum diameter, Φ max , of less than or equal to 30 pm, and the axial length, L, and the maximum diameter, Φ max , satisfy an equation:

    METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS
    5.
    发明申请
    METHODS AND APPARATUS FOR MANUFACTURING AN ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：WO2023043608A1

    公开(公告)日：2023-03-23

    申请号：PCT/US2022/041978

    申请日：2022-08-30

    申请人： CORNING INCORPORATED

    发明人： JOSHI, Dhananjay ,  KANUNGO, Mandakini ,  MAZUMDER, Prantik ,  OKORO, Chukwudi Azubuike ,  POLLARD, Scott Christopher ,  SORENSEN, Michael Lesley ,  VADDI, Rajesh

    IPC分类号： H01L23/498 ,  H01L21/48

    摘要： An electronic apparatus includes a substrate including a first major surface, a second major surface, and an interior surface surrounding an opening extending between the first major surface and the second major surface. A first adhesive layer is attached to the interior surface and extends a first distance from the first major surface toward the second major surface. An electrically conductive layer extends through the opening. A first portion of the electrically conductive layer is attached to the first adhesive layer and a second portion of the electrically conductive layer is attached to the interior surface. A first filler layer is positioned within the opening and is surrounded by the electrically conductive layer. A first barrier layer covers the opening adjacent to the first major surface and contacts the first adhesive layer, the electrically conductive layer, and the first filler layer. Methods of manufacturing the electronic apparatus are provided.

    BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
    6.
    发明申请
    BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME 审中-公开

    公开(公告)号：WO2021225850A1

    公开(公告)日：2021-11-11

    申请号：PCT/US2021/029776

    申请日：2021-04-29

    申请人： CORNING INCORPORATED

    发明人： JOSHI, Dhananjay ,  OKORO, Chukwudi Azubuike ,  POLLARD, Scott Christopher

    IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/03 ,  H05K3/42

    摘要： A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.

    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
    7.
    发明申请
    HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY 审中-公开

    公开(公告)号：WO2020163067A1

    公开(公告)日：2020-08-13

    申请号：PCT/US2020/014257

    申请日：2020-01-20

    申请人： CORNING INCORPORATED

    发明人： KANUNGO, Mandakini ,  MAZUMDER, Prantik ,  OKORO, Chukwudi Azubuike ,  PARK, Ah-Young ,  POLLARD, Scott Christopher ,  VADDI, Rajesh

    IPC分类号： C03C17/06 ,  H01L23/15 ,  H01L23/498 ,  H01L21/768

    摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 µm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 µm at the second major surface and fully fills the via between the first cavity and the second cavity.

    GLASS OR GLASS CERAMIC ARTICLES WITH COPPER-METALLIZED THROUGH HOLES AND PROCESSES FOR MAKING THE SAME
    9.
    发明申请
    GLASS OR GLASS CERAMIC ARTICLES WITH COPPER-METALLIZED THROUGH HOLES AND PROCESSES FOR MAKING THE SAME 审中-公开

    公开(公告)号：WO2020171940A1

    公开(公告)日：2020-08-27

    申请号：PCT/US2020/016488

    申请日：2020-02-04

    申请人： CORNING INCORPORATED

    发明人： OKORO, Chukwudi Azubuike

    IPC分类号： C03C17/06 ,  H01L23/15 ,  H01L23/498 ,  H01L21/768

    摘要： A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200 °C and less than or equal to 300 °C, and the second temperature is greater than or equal to 350 °C and less than or equal to 450 °C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0 °C/min and less than 8.7 °C/min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.