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公开(公告)号：WO2018111998A1
公开(公告)日：2018-06-21
申请号：PCT/US2017/066013
申请日：2017-12-13
Applicant: CORNING INCORPORATED
Inventor： WAGNER, Robert Stephen , WIELAND, Kristopher Allen
IPC: C03B33/02 , B23K26/53 , B23K26/0622 , B23K26/064 , B23K26/38 , B23K26/40
CPC classification number: C03B33/0222 , B23K26/364 , B23K2103/54
Abstract: A method for laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece at an impingement location on a first surface of the transparent workpiece such that the pulsed laser beam ablates a portion of material of the transparent workpiece at the impingement location. The laser beam has a pulse energy of from about 5 µJ to about 50 µJ. The method also includes translating the pulsed laser beam relative to the first surface of the transparent workpiece along a desired separation path, thereby ablating additional material of the transparent workpiece to form a score line along the desired separation path, the score line having a score depth of from about 10 µm to about 60 µm.
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公开(公告)号：WO2015095088A1
公开(公告)日：2015-06-25
申请号：PCT/US2014/070429
申请日：2014-12-16
Applicant: CORNING INCORPORATED
Inventor： MARJANOVIC, Sasha , NIEBER, Albert Roth , PIECH, Garrett Andrew , SCHILLINGER, Helmut , TSUDA, Sergio , WAGNER, Robert Stephen
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2203/172 , B23K2203/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于例如以> 1m / sec的速度进行直线切割，以切割尖锐的半径外角（<1mm），并且产生包括形成内部孔和狭槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有0.1-20微米的间隔。
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3.发明申请METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM 审中-公开用于激光激光玻璃中的孔的方法和其制造的产品
公开(公告)号：WO2015100056A1
公开(公告)日：2015-07-02
申请号：PCT/US2014/070459
申请日：2014-12-16
Applicant: CORNING INCORPORATED
Inventor： MARJANOVIC, Sasha , PIECH, Garrett Andrew , PONS SIEPERMANN, Carlos A , SHANMUGAM, Shyamala , TSUDA, Sergio , VARGA, Zsigmond , WAGNER, Robert Stephen
CPC classification number: B23K26/384 , B23K26/0057 , B23K26/006 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K2203/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material (1) includes focusing a pulsed laser beam (2) into a laser beam focal line (2b) oriented along the beam propagation direction and directed into the material, the laser beam focal line (2b) generating an induced absorption within the material (1), the induced absorption producing a defect line along the laser beam focal line (2b) within the material (1), and translating the material (1) and the laser beam (2) relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料（1）中形成孔包括将脉冲激光束（2）聚焦到沿光束传播方向定向并被引导到材料中的激光束焦线（2b）中，激光束焦线（2b）产生诱导吸收 在材料（1）内，感应吸收产生沿着材料（1）内的激光束焦线（2b）的缺陷线，并且相对于彼此平移材料（1）和激光束（2），由此 在材料中形成多条缺陷线，并通过放大材料中的缺陷线，在酸性溶液中蚀刻材料以产生直径大于1微米的孔。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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4.发明申请METHOD OF LASER CUTTING A SAPPHIRE SUBSTRATE BY LASERS AND AN ARTICLE COMPRISING SAPPHIRE WITH EDGE HAVING SERIES OF DEFECTS 审中-公开用激光切割鲷鱼底物的方法和包含具有缺陷系列的边缘的SAPPHIRE的物品
公开(公告)号：WO2015095090A1
公开(公告)日：2015-06-25
申请号：PCT/US2014/070432
申请日：2014-12-16
Applicant: CORNING INCORPORATED
Inventor： MARJANOVIC, Sasha , PIECH, Garrett Andrew , TSUDA, Sergio , WAGNER, Robert Stephen
IPC: B23K26/00 , B23K26/06 , B23K26/073 , C03B33/02
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0057 , B23K26/006 , B23K26/0613 , B23K26/0624 , B23K26/0738 , B23K26/40 , B23K2203/50 , B32B17/06 , B32B2250/02 , B32B2315/02 , Y02P40/57 , Y10T428/21 , Y10T428/24273 , Y10T428/24355
Abstract: A method of laser processing a material to form a separated part is described, with also an article comprising sapphire. The method includes focusing a pulsed laser beam (2a) into a laser beam focal line (2b), viewed along the beam propagation direction, directed into the material (1), the laser beam focal line (7) generating an induced absorption within the material (1), the induced absorption producing a hole or fault line along the laser beam focal line (2b) within the material (1), and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material (1) over the plurality of holes to a proximal edge of the material (1).
Abstract translation: 还描述了一种激光加工材料以形成分离部件的方法，还包括包含蓝宝石的制品。 该方法包括将脉冲激光束（2a）沿着光束传播方向观察到激光束焦线（2b），被引导到材料（1）中，激光束焦线（7）在内部产生感应吸收 材料（1），所述诱导吸收在所述材料（1）内沿着所述激光束焦线（2b）产生孔或断层线，以及从所述材料（1）的远端引导散焦的二氧化碳（CO 2）激光， 在所述多个孔之上到所述材料（1）的近侧边缘。
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公开(公告)号：WO2018125624A1
公开(公告)日：2018-07-05
申请号：PCT/US2017/066923
申请日：2017-12-18
Applicant: CORNING INCORPORATED
Inventor： BOOKBINDER, Dana Craig , ROSENBLUM, Steven S , VENKATARAMAN, Natesan , WAGNER, Robert Stephen , WEST, James Andrew , WETMORE, Nathaniel David
IPC: F21V8/00
Abstract: Disclosed herein are light guide plates (100, 100`, 100``) comprising a transparent substrate (110) having an edge surface (150), a light emitting first major surface (160), and an opposing second major surface (170); and a polymeric film (120) disposed on at least one of the first (160) and second (170) major surfaces of the transparent substrate, wherein the polymeric film (120) comprises a plurality of microstructures (130) and/or a plurality of light extraction features. At least one light source (140) may be coupled to the edge surface (150) of the transparent substrate (110). Display and lighting devices comprising such light guide plates are further disclosed, as well as methods for manufacturing such light guide plates.
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Patent Agency Ranking6.发明申请GLASS ARTICLES COMPRISING LIGHT EXTRACTION FEATURES AND METHODS FOR MAKING THE SAME 审中-公开包含光提取特征的玻璃制品及其制造方法
公开(公告)号：WO2017172685A1
公开(公告)日：2017-10-05
申请号：PCT/US2017/024428
申请日：2017-03-28
Applicant: CORNING INCORPORATED
Inventor： WAGNER, Robert Stephen , WATKINS, James Joseph , WEST, James Andrew
Abstract: A method for making a glass article comprising contacting a first surface of a glass substrate with a laser to produce a plurality of light extraction features having a diameter and a depth, wherein the light extraction features produce a color shift Δy of extracted light where Δy
Abstract translation: 一种用于制造玻璃制品的方法，包括使玻璃基板的第一表面与激光接触以产生具有直径和深度的多个光提取特征，其中所述光提取特征产生颜色 提取光的偏移Δy，其中Δy< 0.01每500毫米的长度。 所描述的玻璃制品可以包括第一表面和相对的第二表面，其中第一表面包括多个激光诱导光提取特征，并且其中多个激光诱导光提取特征产生色移Δy< 0.01每500毫米的长度。
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公开(公告)号：WO2015095151A2
公开(公告)日：2015-06-25
申请号：PCT/US2014/070531
申请日：2014-12-16
Applicant: CORNING INCORPORATED
Inventor： MARJANOVIC, Sasha , PIECH, Garrett Andrew , TSUDA, Sergio , WAGNER, Robert Stephen
IPC: C03B33/02
CPC classification number: C03B33/082 , B23K26/0057 , B23K26/0087 , B23K26/0608 , B23K26/0622 , B23K26/382 , B23K26/389 , B23K26/53 , B23K26/55 , B23K2203/54 , C03B33/0222 , C03B33/04 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24273
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO 2 laser beam to promote full separation about the perforated line.
Abstract translation: 本发明涉及一种用于在透明材料，特别是玻璃的薄基底中切割和分离内部轮廓的方法。 该方法涉及利用超短脉冲激光在衬底中形成穿孔或孔，接着可使用CO 2激光束来促进围绕穿孔线的完全分离。 / p>
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公开(公告)号：WO2017027784A1
公开(公告)日：2017-02-16
申请号：PCT/US2016/046713
申请日：2016-08-12
Applicant: CORNING INCORPORATED
Inventor： DREWNOWSKI, Christopher William , GALLAGHER, Michael Thomas , JARVIS, Scott Michael , LI, Xinghua , NGOM, Moussa , WAGNER, Robert Stephen , WHEELER, Nicholas Ryan
Abstract: A method of printing a 3D object includes feeding one or more preformed materials from a feed outlet into a build zone in which a hot spot is located and using the hot spot to selectively heat the one or more preformed materials to a viscous state. Object layers are formed by depositing portions of the preformed materials on a build surface, or on another object layer on the build surface, while effecting relative motion between the build surface and the feed outlet.
Abstract translation: 打印3D对象的方法包括将一个或多个预成型材料从进料出口进料到其中定位热点的构建区域中，并使用该热点将一个或多个预成型材料选择性地加热至粘性状态。 通过将预成型材料的部分沉积在构建表面上或构建表面上的另一个物体层上，同时实现构建表面和进料出口之间的相对运动而形成对象层。
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公开(公告)号：WO2016154284A1
公开(公告)日：2016-09-29
申请号：PCT/US2016/023738
申请日：2016-03-23
Applicant: CORNING INCORPORATED
Inventor： HACKERT, Thomas , LI, Xinghua , MARJANOVIC, Sasha , NGOM, Moussa , PASTEL, David Andrew , PIECH, Garrett Andrew , SCHNITZLER, Daniel , WAGNER, Robert Stephen , WATKINS, James Joseph
IPC: C03B33/02 , B23K26/00 , C03C3/091 , B23K103/00
CPC classification number: C03B33/0222 , B23K26/0057 , B23K26/364 , B23K26/53 , B23K2203/54 , C03B33/0215 , C03C3/093 , Y02P40/57
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (
Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于直线切割，例如以> 0.25m / sec的速度切割锋利的半径外角（<1mm），并且产生包括形成内部孔和槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 脉冲激光产生每脉冲脉冲5-20个脉冲和每个脉冲串300-600微焦耳的脉冲爆发能量的脉冲脉冲串。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有5-15微米的间隔。
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公开(公告)号：WO2015095091A1
公开(公告)日：2015-06-25
申请号：PCT/US2014/070434
申请日：2014-12-16
Applicant: CORNING INCORPORATED
Inventor： MARJANOVIC, Sasha , PIECH, Garrett Andrew , TSUDA, Sergio , WAGNER, Robert Stephen
IPC: C03B33/02 , B23K26/00 , B23K26/06 , B23K26/40 , C03B33/07 , C03B33/09 , C03B25/087 , C03B29/10 , C03B17/02 , C03B17/06
CPC classification number: B23K26/0057 , B23K26/0006 , B23K26/0087 , B23K26/0622 , B23K26/0624 , B23K26/402 , B23K26/53 , B23K26/55 , B23K26/57 , B23K2203/172 , B23K2203/50 , B23K2203/54 , B32B7/02 , B32B17/00 , B32B2457/20 , C03B17/02 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/0222 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: The present disclosure relates to a process for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets, and the disclosure also relates to a glass article prepared by the method. The developed laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermally stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO 2 laser (coupled with high pressure air flow) for fully automated separation.
Abstract translation: 本公开涉及一种用于切割和分离任意形状的透明材料的薄基板，特别是定制的复合融合拉制玻璃板的方法，并且本公开还涉及通过该方法制备的玻璃制品。 开发的激光方法可以通过热应力所需的轮廓来定制，从面板手动分离零件或完全激光分离。 自分离方法涉及利用可以跟随CO 2激光器（与高压空气流耦合）的超短脉冲激光器进行全自动分离。
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