Abstract:
A sensor and fabrication process are provided for forming reference layers with substantially orthogonal magnetization directions having zero offset with a small compensation angle. An exemplary embodiment includes a sensor layer stack of a magnetoresistive thin-film based magnetic field sensor, the sensor layer stack comprising a pinning layer; a pinned layer including a layer of amorphous material over the pinning layer, and a first layer of crystalline material over the layer of amorphous material; a nonmagnetic coupling layer over the pinned layer; a fixed layer over the nonmagnetic coupling layer; a tunnel barrier over the fixed layer; and a sense layer over the nonmagnetic intermediate layer. Another embodiment includes a sensor layer stack where a pinned layer including two crystalline layers sepatared by a amorphous layer.
Abstract:
A magnetoresistive stack includes a seed region formed above a base region, a fixed magnetic region formed above the seed region and an intermediate region positioned between the fixed magnetic region and a free magnetic region. The base region may be formed of a material having a lower standard tree energy of oxidation than iron.
Abstract:
A magnetically free region of magnetoresistive device includes at least a first ferromagnetic region and a second ferromagnetic region separated by a non-magnetic insertion region. At least one of the first ferromagnetic region and the second ferromagnetic region may include at least a boron-rich ferromagnetic layer positioned proximate a boron-free ferromagnetic layer.
Abstract:
A magnetoresistive stack/ structure and method of manufacturing same comprising wherein the stack/structure includes a seed region, a fixed magnetic region disposed on and in contact with the seed region, a dielectric layer(s) disposed on the fixed magnetic region and a free magnetic region disposed on the dielectric layer(s). In one embodiment, the seed region comprises an alloy including nickel and chromium having (i) a thickness greater than or equal to 40 Angstroms (+/- 10%) and less than or equal to 60 Angstroms (+/- 10%), and (ii) a material composition or content of chromium within a range of 25-60 atomic percent (+/- 10%) or 30-50 atomic percent (+/- 10%).
Abstract:
A magnetoresistive stack (100) includes a free magnetic region (70), an intermediate region (60), and a fixed magnetic region (50), preferably comprising a reference region (58), a transition region (56), and a synthetic antiferromagnetic (SAF) structure (52A, 54, 52B), formed above a seed region (40) on a base region (30). At least one of the base region, transition region, and reference region is formed of a material having a lower standard free energy of oxidation than iron, preferably an iron boron alloy.
Abstract:
The disclosed magnetoresistive device (200) includes a magnetically fixed region (214, 240) and a magnetically free region (250) positioned on opposite sides of a tunnel barrier region (230), and at least a first transition region (220) and a second transition region (221) positioned between the magnetically fixed region and the tunnel barrier region. The first transition region includes a non- ferromagnetic transition metal, preferably pure Ta, and the second transition region includes an alloy including iron and boron, preferably FeB with at least 50 at% boron.
Abstract:
A magnetoresistive stack/structure and method of manufacturing same comprising wherein the stack/structure includes a seed region, a fixed magnetic region disposed on and in contact with the seed region, a dielectric layer(s) disposed on the fixed magnetic region and a free magnetic region disposed on the dielectric layer(s). In one embodiment, the seed region comprises an alloy including nickel and chromium having (i) a thickness greater than or equal to 40 Angstroms (+/- 10%) and less than or equal to 60 Angstroms (+/- 10%), and (ii) a material composition or content of chromium within a range of 25-60 atomic percent (+/- 10%) or 30-50 atomic percent (+/- 10%).
Abstract:
A spin-torque magnetoresistive memory element has a high magnetoresistance and low current density. A free magnetic layer is positioned between first and second spin polarizers. A first tunnel barrier is positioned between the first spin polarizer and the free magnetic layer and a second tunnel barrier is positioned between the second spin polarizer and the free magnetic layer. The magnetoresistance ratio of the second tunnel barrier has a value greater than double the magnetoresistance ratio of the first tunnel barrier.
Abstract:
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a "Z" axis magnetic field onto sensors orientated in the XY plane.
Abstract:
A magnetic tunnel junction structure includes a layer of iron having a thickness in the range of 1 0 to 5 0 A disposed between a tunnel barrier and a free magnetic element resulting in high magnetoresistance, low damping and an improved ratio VcΛ/bd of critical switching voltage to tunnel barrier breakdown voltage for improved spin torque yield and reliability while requiring only a low temperature anneal This improved structure also has a very low resistance-area product MgON diffusion barrier between the free magnetic element and an electrode to prevent diffusion of the electrode into the free layer, which assists in keeping the damping, and therefore also the switching voltage, low With the low annealing temperature, the breakdown voltage is high, resulting in a favorable ratio of VcΛ/bd and in a high proportion of devices switching before breakdown, therefore improving the yield and reliability of the devices