Abstract:
Embodiments are generally directed to Heusler alloy based magnetic tunnel junctions and refractory interconnects. An embodiment of an apparatus includes a magnetic tunnel junction (MTJ) stack of an MRAM (Magnetoresistive Random Access Memory), the MTJ stack including a free magnetic layer and a fixed magnetic later, wherein the magnetic tunnel junction stack including one or more Heusler alloys; and metal interconnects for the MRAM, wherein the metal interconnects include one or more refractory metals, Silicides or Germinides of Nickel or Cobalt, refractory Heusler alloy, or Silicides of Heusler alloy.
Abstract:
Damascene-based approaches for embedding spin hall MTJ devices into a logic processor, and the resulting structures, are described. In an example, a logic processor includes a logic region including a metallization layer. The logic processor also includes a memory array including a plurality of two-transistor one magnetic tunnel junction (MTJ) spin hall effect electrode (2T-1MTJ SHE electrode) bit cells. The spin hall effect electrodes of the 2T-1MTJ SHE electrode bit cells are disposed in a lower dielectric layer laterally adjacent to the metallization layer of the logic region. The MTJs of the 2T-1MTJ SHE electrode bit cells are disposed in an upper dielectric layer laterally adjacent to the metallization layer of the logic region.
Abstract:
A seed layer stack (24) with a smooth top surface having a peak to peak roughness of 0.5 nm is formed by sputter depositing an amorphous layer (22) on a seed layer (21) such as Mg where the seed layer has a resputtering rate 2 to 30X that of the amorphous layer. The uppermost seed layer (23) is a template layer that is NiCr or NiFeCr. As a result, perpendicular magnetic anisotropy in an overlying magnetic layer that is a reference layer, free layer, or dipole layer is substantially maintained during high temperature processing up to 400°C and is advantageous for magnetic tunnel junctions in embedded MRAMs, spintronic devices, or in read head sensors. The amorphous seed layer is SiN, TaN, or CoFeM where M is B or another element with a content that makes CoFeM amorphous as deposited. The seed layer stack may include a bottommost Ta or TaN buffer layer.
Abstract:
A magnetic device (100) configured to perform an analog adder circuit function and comprising a plurality of magnetic units, each including n magnetic tunnel junction (2, 2', 2", 2"',...) electrically connected in series via a current line (3), each magnetic tunnel junction comprising a storage magnetic layer (23) having a storage magnetization (230), a sense magnetic layer (21) having a sense magnetization (210), and a tunnel barrier layer (22); n input lines (4, 4', 4", 4"',...), each being configured to generate a magnetic field (42, 42', 42", 42'",...) adapted for varying a direction of the sense magnetization (210) and a resistances (R 1 , R 2 ) of a corresponding one of the n magnetic tunnel junctions, based on a corresponding input (41, 41', 41 ", 41 "',...) wherein the junction resistance of said corresponding one of said n magnetic tunnel junctions varies linearly based on said corresponding input; wherein each of the n magnetic units is configured to add said n inputs (41, 41', 41 ", 41'",...) to generate an output signal (V out ) that varies in response to the n resistances (R 1 , R 2 , R 3 , R 4 ,...); the n input lines being configured to conduct n independent signals so that the output signal can vary as a function of the n independent input signals.
Abstract:
수직자기이방성을 갖는 MTJ 구조를 제공한다. 수직자기이방성을 갖는 MTJ 구조는 기판, 상기 기판 상에 위치하는 인위적 반강자성층, 상기 인위적 반강자성층 상에 위치하되, W 또는 W를 포함하는 합금을 포함하는 버퍼층, 상기 버퍼층 상에 위치하고, 수직자기이방성을 갖는 제1 강자성층, 상기 제1 강자성층 상에 위치하는 터널링 배리어층 및 상기 터널링 배리어층 상에 위치하고, 수직자기이방성을 갖는 제2 강자성층을 포함할 수 있다. 따라서, 인위적 반강자성층을 CoFeB/MgO/CoFeB 구조와 접합시키는 적용에 있어서 그 사이에 버퍼층을 사용함으로써 고온에서의 열적 안정성이 향상된 MTJ 구조를 제공할 수 있다.
Abstract:
The present invention is in the field of spintronics, and relates to a highly efficient spin filter device, such as a spin-polarizer or a spin valve, and a method for fabrication thereof.
Abstract:
Disclosed herein are magnetic materials comprising rare earth nitrides and, more particularly, magnetic materials comprising multilayer-structured materials comprising one relatively soft and one relatively hard magnetic layer. The magnetic materials comprise a first ferromagnetic layer, a second ferromagnetic layer, and a blocking layer between and in contact with each of the first 5 and second ferromagnetic layers. The first and second ferromagnetic layers have different coercive fields. The first ferromagnetic layer comprises a first rare earth nitride material and the second ferromagnetic layer comprises a second rare earth nitride material. Also disclosed are methods for preparing the materials. The materials are useful in the fabrication of devices, such as GMR magnetic field sensors, MRAM devices, TMR magnetic field sensors, and magnetic 10 tunnel junctions.
Abstract:
The invention relates to a spin torque magnetic integrated circuit (1), comprising a shared free layer (2) with a magnetic anisotropy such as a shape anisotropy or a crystal anisotropy with at least two stable magnetic states disposed on a substrate, a first non-magnetic layer (3) disposed on a first side of the free layer (2), input regions disposed on the non-magnetic layer (3), at least one output region (5) disposed on the non-magnetic layer (3), comprising at least one output layer (6), capping layers (8) to electrically contact the input regions (4a, 4b) and output region (5), wherein two input regions (4a, 4b) are disposed on the non-magnetic layer (3), at least one of the input regions (4a, 4b) comprises at least one magnetic input reference layer (6), and the orientation of the magnetization vectors of the input reference layers, the output reference layer, and the orientation of the magnetic anisotropy of the free layer are collinear. The invention further relates to a flip flop circuit comprising such a circuit, a shift register comprising such a flip flop, and methods to operate these circuits.
Abstract:
A TMR stack or a GMR stack, ultimately formed into a sensor or MRAM element, include insertion layers of Fe or iron rich layers of FeX in its ferromagnetic free layer and/or the AP1 layer of its SyAP pinned layer. X is a non-magnetic, metallic element (or elements) chosen from Ta, Hf, V, Co, Mo, Zr, Nb or Ti whose total atom percent is less than 50%. The insertion layers are between 1 and 10 angstroms in thickness, with between 2 and 5 angstroms being preferred and, in the TMR stack, they are inserted adjacent to the interfaces between a tunneling barrier layer and the ferromagnetic free layer or the tunneling barrier layer and the AP1 layer of the SyAP pinned layer in the TMR stack. The insertion layers constrain interdiffusion of B and Ni from CoFeB and NiFe layers and block NiFe crystalline growth.
Abstract:
A MTJ for a spintronic device is disclosed and includes a thin seed layer that enhances perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (Co/X) n or (CoX) n composition where n is from 2 to 30, X is one of V, Rh, Ir, Os, Ru, Au, Cr, Mo, Cu, Ti, Re, Mg, or Si, and CoX is a disordered alloy. A CoFeB layer may be formed between the laminated layer and a tunnel barrier layer to serve as a transitional layer between a (111) laminate and (100) MgO tunnel barrier. The laminated layer may be used as a reference layer, dipole layer, or free layer in a MTJ. Annealing between 300°C and 400°C may be used to further enhance PMA in the laminated layer.