公开(公告)号：WO2018080870A1

公开(公告)日：2018-05-03

申请号：PCT/US2017/057199

申请日：2017-10-18

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： DE, Binod B. ,  MALIK, Sanjay ,  REINERTH, William A. ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A. ,  SAKAMURI, Raj

IPC: C08L79/08 ,  C08G73/14 ,  C08J5/18 ,  H01L23/29

Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), [insert formula here](la) or [insert formula here] (lb), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

Abstract translation: （a）选自结构（Ia）的二胺和结构（Ib）的二胺的至少一种二胺， （b）至少一种结构（II）的二胺，（c）至少一种四羧酸二酐，和任选地（d）至少一种 含有与胺或酐反应的第一官能团和至少一个选自取代或未取代的链烯基和取代或未取代的炔基的第二官能团的化合物。 上述公式中的每个变量均在说明书中定义。

公开(公告)号：WO2017023677A1

公开(公告)日：2017-02-09

申请号：PCT/US2016/044423

申请日：2016-07-28

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： SAKAMURI, Raj ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A. ,  MALIK, Sanjay ,  DE, Binod B. ,  REINERTH, William A.

IPC: C11D11/00 ,  C09G1/02 ,  C11D7/32 ,  C11D7/50 ,  H01L21/304

CPC classification number: C09G1/02 ,  C09D5/08 ,  C11D3/0073 ,  C11D7/32 ,  C11D7/3209 ,  C11D7/3218 ,  C11D7/3281 ,  C11D7/50 ,  C11D7/5004 ,  C11D11/00 ,  C11D11/0047 ,  G03F7/027 ,  G03F7/2053 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02063 ,  H01L21/31133

Abstract: This disclosure relates to a composition (e.g., a cleaning and/or stripping composition) containing (a) 0.5 - 25 percent by weight an alkaline compound; (b) 1 - 25 percent by weight an alcohol amine compound; (c) 0.1 - 20 percent by weight a hydroxylammonium compound; (d) 5 - 95 percent by weight an organic solvent; (e) 0.1 - 5 percent by weight a corrosion inhibitor compound; and (f) 2 -25 percent by weight water.

Abstract translation: 本公开涉及含有（a）0.5-25重量％碱性化合物的组合物（例如清洁和/或汽提组合物） （b）1〜25重量％的醇胺化合物; （c）0.1-20重量％的羟基铵化合物; （d）5-95重量％的有机溶剂; （e）0.1-5重量％的腐蚀抑制剂化合物; 和（f）2〜25重量％的水。

公开(公告)号：WO2022086752A1

公开(公告)日：2022-04-28

申请号：PCT/US2021/054471

申请日：2021-10-12

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： DE, Binod B. ,  SAKAMURI, Raj ,  MALIK, Sanjay ,  DILOCKER, Stephanie ,  REINERTH, William A.

IPC: C04B35/491 ,  C23C30/00 ,  H01L27/108

Abstract: This disclosure relates to a dielectric film-forming composition that includes (a) at least one cyanate ester compound, the at least one cyanate ester compound containing at least two cyanate groups; and (b) at least one dielectric polymer including a polybenzoxazole precursor polymer, a polyimide precursor polymer, or a fully imidized polyimide polymer.

公开(公告)号：WO2018232214A1

公开(公告)日：2018-12-20

申请号：PCT/US2018/037712

申请日：2018-06-15

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： MALIK, Sanjay ,  REINERTH, William, A.

IPC: H01L21/02 ,  C08L59/00 ,  G03F7/004 ,  H01L23/538

Abstract: This disclosure relates to a multilayer structure containing: a substrate; a coupling layer deposited on the substrate; and a dielectric layer deposited on the coupling layer, wherein shear strength is increased by a factor of at least about 2 in the presence of the coupling layer compared to a multilayer in the absence of the coupling layer.

公开(公告)号：WO2022015695A1

公开(公告)日：2022-01-20

申请号：PCT/US2021/041376

申请日：2021-07-13

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： MALIK, Sanjay ,  DE, Binod B. ,  REINERTH, William A. ,  DIMOV, Ognian ,  DILOCKER, Stephanie

IPC: C08G73/10 ,  C08J3/24 ,  C08K3/36 ,  C08F283/04 ,  G03F7/0035 ,  G03F7/0037 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/037 ,  H01L2224/27436 ,  H01L2224/29147 ,  H01L2224/2969 ,  H01L2224/2979 ,  H01L24/27 ,  H01L24/29 ,  H01L2924/12041

Abstract: This disclosure relates to a dielectric film forming composition that includes a plurality of (meth)acrylate containing compounds, at least one fully imidized polyimide polymer, and at least one solvent.

公开(公告)号：WO2018093827A1

公开(公告)日：2018-05-24

申请号：PCT/US2017/061692

申请日：2017-11-15

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： SAKAMURI, Raj ,  MALIK, Sanjay ,  DIMOV, Ognian

IPC: H01L21/30 ,  H01L21/311 ,  G03F7/42

Abstract: This disclosure relates to a process for stripping an organic film on a patterned semiconductor substrate. The process includes treating the organic film with an aqueous stripper composition to remove the organic film in one step. The organic film includes at least a first layer and a second layer, the first layer has a dissolution rate of at most about 0.01 μ/min in a developer at 25°C, and the second layer has a dissolution rate of greater than about 0.01 μ/min in the developer at 25°C.

公开(公告)号：WO2017116858A1

公开(公告)日：2017-07-06

申请号：PCT/US2016/067822

申请日：2016-12-20

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： MALIK, Sanjay ,  SAKAMURI, Raj ,  DIMOV, Ognian N. ,  DE, Binod B. ,  REINERTH, William A. ,  NAIINI, Ahmad A.

IPC: H01L21/02 ,  H01L21/033 ,  G03F7/095 ,  H05K3/46

CPC classification number: G03F7/095 ,  G03F7/027 ,  G03F7/033 ,  G03F7/037 ,  G03F7/0755 ,  G03F7/325 ,  H01L21/311

Abstract: This disclosure relates to a photosensitive stacked structure that includes first and second layers, in which the first layer is a photosensitive, dielectric layer and the second layer is a photosensitive layer. The dissolution rate of the first layer in a developer is less than the dissolution rate of the second layer in the developer.

Abstract translation: 本公开涉及一种感光堆叠结构，其包括第一层和第二层，其中第一层是光敏介电层并且第二层是感光层。 第一层在显影剂中的溶解速率小于第二层在显影剂中的溶解速度。

公开(公告)号：WO2018085099A1

公开(公告)日：2018-05-11

申请号：PCT/US2017/058388

申请日：2017-10-26

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： MALIK, Sanjay ,  REINERTH, William A. ,  DE, Binod B. ,  SAKAMURI, Raj ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A.

IPC: C08G69/32 ,  C08L79/08 ,  C09D179/08

Abstract: This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (I) Structure (I) (b) at least one tetracarboxylic acid dianhydride, and optionally (c) at least one compound containing a first functional group reactive with an amine or an anhydride and at least one second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formula is defined in the specification.

Abstract translation: 本公开涉及一种聚酰亚胺聚合物，其包含以下物质的反应产物：（a）至少一种选自结构（I）结构（I）（b）的二胺 至少一种四羧酸二酐，和任选的（c）至少一种含有可与胺或酸酐反应的第一官能团和至少一个选自取代或未取代的链烯基和取代或未取代的 未被取代的炔基。 上述公式中的每个变量均在说明书中定义。

公开(公告)号：WO2017151160A1

公开(公告)日：2017-09-08

申请号：PCT/US2016/028245

申请日：2016-04-19

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： MALIK, Sanjay ,  REINERTH, William A.

IPC: H01L21/31 ,  C08G61/12 ,  C08J7/04 ,  G03C1/73

Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, a protective layer, and a polymeric layer between the carrier substrate and the protective layer. The polymeric layer includes at least one protected polybenzoxazole precursor polymer.

Abstract translation: 本公开涉及一种干膜结构，其包括载体基底，保护层以及位于载体基底和保护层之间的聚合物层。 聚合物层包括至少一种受保护的聚苯并恶唑前体聚合物。

公开(公告)号：WO2016172089A1

公开(公告)日：2016-10-27

申请号：PCT/US2016/028258

申请日：2016-04-19

Applicant: FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.

Inventor： DE, Binod B. ,  MALIK, Sanjay ,  SAKAMURI, Raj ,  REINERTH, William A. ,  DIMOV, Ognian N. ,  NAIINI, Ahmad A.

IPC: G03F7/075 ,  G03F7/027 ,  G03F7/004 ,  C08G73/10

CPC classification number: G03F7/0387 ,  B29C67/00 ,  C08G73/1014 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1067 ,  C09D179/08 ,  G03C1/805 ,  G03F7/037 ,  G03F7/11 ,  G03F7/16 ,  G03F7/325 ,  G03F7/343 ,  H01L21/02118 ,  H01L21/0273 ,  H01L21/311 ,  C08L79/08

Abstract: This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Abstract translation: 本公开涉及一种干膜结构，其包括载体基底和由载体基底支撑的聚合物层。 聚合物层包括至少一种完全酰亚胺化的聚酰亚胺聚合物。