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    DRY ADHESIVE JOINING OF LAYERS OF ELECTRONIC DEVICES
    1.
    发明申请
    DRY ADHESIVE JOINING OF LAYERS OF ELECTRONIC DEVICES 审中-公开
    干燥粘合电子设备层

    公开(公告)号：WO1996032246A1

    公开(公告)日：1996-10-17

    申请号：PCT/US1996005065

    申请日：1996-04-11

    Applicant: IRVINE SENSORS CORPORATION

    Inventor： IRVINE SENSORS CORPORATION ,  PEPE, Angel, A. ,  REINKER, David, M. ,  WOJTUSZEWSKI, Paul

    IPC: B30B13/00

    CPC classification number: B32B7/12 ,  B32B25/04 ,  B32B25/20 ,  B32B27/281 ,  B32B37/12 ,  B32B37/153 ,  B32B2379/08 ,  B32B2457/08 ,  B32B2553/00 ,  Y10T29/49126 ,  Y10T156/1075 ,  Y10T156/1092

    Abstract: There is disclosed an efficient, cost effective production method to bond layers of electronic devices (52) into an integral stack (38), or for joining electronic devices to other devices or substrates with use of an adhesive material (21), preferably an appropriate polyimide, to provide, in effect, a two-stage bonding process. In the first stage, the electronic device is coated, preferably at the wafer level, with a liquid solution of the adhesive material, the coated device is heated to remove solvent, forming a dry adhesive coating of sufficient thickness to fill all spaces between metal traces on the electronic device. Coated wafers can be stacked and bonded, or preferably diced to yield individual chips, which are cut and stacked in a suitable fixture, and heat and pressure are applied in a second stage, to cause viscous flow of the adhesive, filling all voids, and to cure the adhesive, creating an integral, adhesively bonded stack. The adhesive selected for use in the process is one which can be dried to a solvent free layer, which has good B stage properties, exhibits viscous flow at temperatures below its curing temperature, and which is substantially free of volatile release during curing to form a substantially void-free adhesive bond having high film strength, high adhesion, chemical resistance and good dielectric properties.

    Abstract translation: 公开了一种将电子设备（52）的层结合成整体堆叠（38）或使用粘合剂材料（21）将电子设备连接到其它设备或基板的有效且成本有效的生产方法，优选适当的 聚酰亚胺，实际上提供两阶段粘合工艺。 在第一阶段中，电子器件优选地在晶片级上用粘合剂材料的液体溶液涂覆，涂覆的器件被加热以除去溶剂，形成足够厚度的干燥粘合剂涂层以填充金属迹线之间的所有空间 在电子设备上。 涂覆的晶片可以堆叠和粘合，或优选切割以产生单个切屑，其切割并堆叠在合适的夹具中，并且在第二阶段中施加热和压力，以引起粘合剂的粘性流动，填充所有空隙，以及 固化粘合剂，形成整体的，粘合的叠层。 选择用于该方法的粘合剂是可以干燥成无溶剂层的粘合剂，其具有良好的B阶级性能，在低于其固化温度的温度下显示粘性流动，并且其在固化期间基本上不含挥发性脱模以形成 具有高膜强度，高粘合性，耐化学性和良好介电性能的基本上无空隙的粘合剂粘结。

    FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK
    2.
    发明申请
    FABRICATING STACKS OF IC CHIPS BY SEGMENTING A LARGER STACK 审中-公开
    通过分隔大堆堆栈来制作集成电路板块

    公开(公告)号：WO1994015358A1

    公开(公告)日：1994-07-07

    申请号：PCT/US1993012268

    申请日：1993-12-16

    Applicant: IRVINE SENSORS CORPORATION

    Inventor： IRVINE SENSORS CORPORATION ,  MINIHAN, Joseph, A. ,  PEPE, Angel, A.

    IPC: H01L21/58

    CPC classification number: H01L21/67121 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method for fabricating stacks of IC chips (20) into modules providing high density electronics. A relatively large number of layers (26) are stacked, and then integrated by curing adhesive (44) applied between adjacent layers (26). A large stack (20) is formed, various processing steps are performed on the access plane face (24) of the large stack (20), and then the large stack (20) is segmented to form a plurality of smaller, or short, stacks (22). Means (134) are provided for causing separation of the larger stack (20) into smaller stacks (22), without disturbing the adhesive (44) which binds the layers (26) within each small stack (22).

    Abstract translation: 一种用于将IC芯片（20）堆叠制成提供高密度电子器件的模块的方法。 堆叠相对大量的层（26），然后通过施加在相邻层（26）之间的固化粘合剂（44）来整合。 形成大堆（20），在大堆（20）的进入面（24）上进行各种处理步骤，然后将大堆（20）分割成多个较小的或短的， 堆栈（22）。 提供装置（134）用于使较大堆叠（20）分离成更小的堆叠（22），而不会干扰在每个小堆叠（22）内结合层（26）的粘合剂（44）。

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