公开(公告)号：WO1994008442A1

公开(公告)日：1994-04-14

申请号：PCT/US1993009190

申请日：1993-09-27

Applicant: IRVINE SENSORS CORPORATION

Inventor： IRVINE SENSORS CORPORATION ,  PEPE, Angel, A. ,  REINKER, David, M. ,  MINAHAN, Joseph, A.

IPC: H05K03/36

CPC classification number: H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/1465 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16237 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A method and product are disclosed in which multiple solder bumps (76) on a first planar surface (66) are guided into engagement with terminals (76) on a second planar surface (72) by means of holes (80) formed (by a photolithographic process) in a dielectric layer (78), which has been added to the second surface (72) to provide the holes (80) (or sockets) through which the solder bumps (76) (or plugs) extend. The perforated (hole-providing) layer may be formed of one of several materials. The preferred perforated layer material is a photo-definable polyamide, which is hardened by heating after the holes have been formed. Small solder bumps (84) may be formed inside the holes (80) on the second surface (72), in order to facilitate bonding between the solder bumps (76) on the first surface (66) and the terminals (70) on the second surface (72).

Abstract translation: 公开了一种方法和产品，其中第一平面表面（66）上的多个焊料凸块（76）通过孔（80）引导到与第二平坦表面（72）上的端子（76）接合，所述孔（80）形成 已经添加到第二表面（72）中以提供焊料凸块（76）（或插塞）延伸穿过的孔（或插座）的电介质层（78）中的光刻工艺。 穿孔（空穴提供）层可以由几种材料之一形成。 优选的穿孔层材料是光可定义的聚酰胺，其在形成孔之后通过加热而硬化。 可以在第二表面（72）上的孔（80）内部形成小的焊料凸点（84），以便促进第一表面（66）上的焊料凸点（76）与第一表面（66）上的端子 第二表面（72）。

公开(公告)号：WO1996032246A1

公开(公告)日：1996-10-17

申请号：PCT/US1996005065

申请日：1996-04-11

Applicant: IRVINE SENSORS CORPORATION

Inventor： IRVINE SENSORS CORPORATION ,  PEPE, Angel, A. ,  REINKER, David, M. ,  WOJTUSZEWSKI, Paul

IPC: B30B13/00

CPC classification number: B32B7/12 ,  B32B25/04 ,  B32B25/20 ,  B32B27/281 ,  B32B37/12 ,  B32B37/153 ,  B32B2379/08 ,  B32B2457/08 ,  B32B2553/00 ,  Y10T29/49126 ,  Y10T156/1075 ,  Y10T156/1092

Abstract: There is disclosed an efficient, cost effective production method to bond layers of electronic devices (52) into an integral stack (38), or for joining electronic devices to other devices or substrates with use of an adhesive material (21), preferably an appropriate polyimide, to provide, in effect, a two-stage bonding process. In the first stage, the electronic device is coated, preferably at the wafer level, with a liquid solution of the adhesive material, the coated device is heated to remove solvent, forming a dry adhesive coating of sufficient thickness to fill all spaces between metal traces on the electronic device. Coated wafers can be stacked and bonded, or preferably diced to yield individual chips, which are cut and stacked in a suitable fixture, and heat and pressure are applied in a second stage, to cause viscous flow of the adhesive, filling all voids, and to cure the adhesive, creating an integral, adhesively bonded stack. The adhesive selected for use in the process is one which can be dried to a solvent free layer, which has good B stage properties, exhibits viscous flow at temperatures below its curing temperature, and which is substantially free of volatile release during curing to form a substantially void-free adhesive bond having high film strength, high adhesion, chemical resistance and good dielectric properties.

Abstract translation: 公开了一种将电子设备（52）的层结合成整体堆叠（38）或使用粘合剂材料（21）将电子设备连接到其它设备或基板的有效且成本有效的生产方法，优选适当的 聚酰亚胺，实际上提供两阶段粘合工艺。 在第一阶段中，电子器件优选地在晶片级上用粘合剂材料的液体溶液涂覆，涂覆的器件被加热以除去溶剂，形成足够厚度的干燥粘合剂涂层以填充金属迹线之间的所有空间 在电子设备上。 涂覆的晶片可以堆叠和粘合，或优选切割以产生单个切屑，其切割并堆叠在合适的夹具中，并且在第二阶段中施加热和压力，以引起粘合剂的粘性流动，填充所有空隙，以及 固化粘合剂，形成整体的，粘合的叠层。 选择用于该方法的粘合剂是可以干燥成无溶剂层的粘合剂，其具有良好的B阶级性能，在低于其固化温度的温度下显示粘性流动，并且其在固化期间基本上不含挥发性脱模以形成 具有高膜强度，高粘合性，耐化学性和良好介电性能的基本上无空隙的粘合剂粘结。