ADDITIVE MANUFACTURING OF SILICON COMPONENTS

    公开(公告)号:WO2021225809A1

    公开(公告)日:2021-11-11

    申请号:PCT/US2021/029053

    申请日:2021-04-26

    Abstract: A method of performing 3D printing of a silicon component includes adding powdered silicon to a 3D printing tool. For each layer of the 3D printing, the process includes forming a powder bed of the powdered silicon, forming a layer of the powder bed to a pre-determ ined thickness, directing a high-powered beam in a pre-determ ined pattern into the powder-bed to melt the powdered silicon. After no further layers are needed, the silicon component is cooled at a pre-determ ined temperature ramp-down rate. In a fully dense printing method, buffer layers of silicon are initially printed on a steel substrate, and then layers of silicon for the actual component are printed on top of the buffer layers using a double printing method. In a fully dense and crack free printing method, one or more heaters and thermal insulation are used to minimize temperature gradient during Si printing, in-situ annealing, and cooling.

    CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORS

    公开(公告)号:WO2021206950A1

    公开(公告)日:2021-10-14

    申请号:PCT/US2021/024744

    申请日:2021-03-29

    Abstract: A ceramic gas injector and method of fabrication are described. The gas injector has an inlet portion to which a gas is introduced via an inlet hole and contains a conformal channel between the inlet hole and a sidewall, an outlet portion from which the gas is provided from the gas injector and a collar disposed between the inlet and outlet portions. The channel extends into the collar. The channel has channel sections each of which extends through the inlet portion and terminates at both inlet ends before reaching the inlet face and collar ends before reaching the outlet portion. Alternating adjacent pairs of channel sections are connected via the inlet ends with adjacent pairs that are not connected via the inlet ends connected via the collar ends. Ports in a sidewall of the collar are connected with an adjacent pairs of sections not connected via the inlet ends.

    SEMICONDUCTOR EQUIPMENT MODULE FABRICATION WITH ADDITIVE MANUFACTURING

    公开(公告)号:WO2021081123A1

    公开(公告)日:2021-04-29

    申请号:PCT/US2020/056710

    申请日:2020-10-21

    Abstract: Methods, systems, and computer programs are presented for manufacturing a showerhead for a semiconductor manufacturing system. One method includes an operation for drilling first holes on a faceplate made of a first material, where the first holes have a first diameter. Further, the method includes an operation for cladding the first holes and the faceplate with a second material to cover the first holes and the faceplate with the second material. Further yet, the method includes drilling second holes concentric with the first holes resulting in a part with holes coated with the second material. The second holes have a second diameter that is smaller than the first diameter. Additionally, the method includes an operation for creating the showerhead utilizing the part, where gas is deliverable through the second holes of the faceplate in the showerhead.

    ADDITIVE MANUFACTURING OF THERMAL AND RF ELEMENTS

    公开(公告)号:WO2022204181A1

    公开(公告)日:2022-09-29

    申请号:PCT/US2022/021385

    申请日:2022-03-22

    Abstract: A component constructed by an additive manufacturing process includes an assembly body formed during the additive manufacturing process using a first type of powdered material. Hie component further includes a plurality of thermal management channels within the assembly body, lire plurality of thermal management channels may be constructed during the additive manufacturing process using a. second type of powdered material, the plurality of thermal management channels forming a thermal element.

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