公开(公告)号：WO2017196781A1

公开(公告)日：2017-11-16

申请号：PCT/US2017/031656

申请日：2017-05-09

Applicant: MATERION CORPORATION

Inventor： KOBA, Richard J. ,  LEE, Chee Kong ,  GOH, Wei Chuan ,  CHIN, Sin Yee

IPC: H01L23/04 ,  H01L23/047 ,  H01L23/10

CPC classification number: H01L23/14 ,  H01L23/04 ,  H01L23/047 ,  H01L23/10 ,  H01L23/28 ,  H01L23/36 ,  H01L23/3738

Abstract: An air cavity package includes a dielectric frame that is formed from an alumina ceramic, a polyimide, or a semi-crystalline thermoplastic. The dielectric frame is joined to a flange using a high temperature silicone adhesive. Leads may be bonded to the dielectric frame using a high temperature organic adhesive, a direct bond, or by brazing.

Abstract translation: 气室封装包括由氧化铝陶瓷，聚酰亚胺或半结晶热塑性塑料形成的介电框架。 介电框架使用高温硅酮粘合剂连接到法兰。 引线可以使用高温有机粘合剂，直接粘合或钎焊粘合到介电框架上。

公开(公告)号：WO2017143168A1

公开(公告)日：2017-08-24

申请号：PCT/US2017/018339

申请日：2017-02-17

Applicant: MATERION CORPORATION

Inventor： KOTHANDAPANI, Ramesh ,  TAN, SinLi ,  LEE, Chee Kong

IPC: B23K35/02 ,  B23K35/30 ,  H01L23/10

CPC classification number: B23K35/0222 ,  B23K1/19 ,  B23K26/16 ,  B23K26/38 ,  B23K26/40 ,  B23K35/0233 ,  B23K35/268 ,  B23K35/3013 ,  B23K2203/52 ,  C22C5/02 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/10

Abstract: Methods of making solder preforms are disclosed. A ribbon (102) of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges (112,114) of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

Abstract translation: 公开了制造焊料预制件的方法。 接收原料带（102），并且通过激光切割带来形成第一环形焊料预成型件。 然后可以清洁第一环形焊料预制件的边缘（112,114）。 然后可以激光切割从第一环形焊料预制件的中间去除的切口部分，以形成比第一环形焊料预制件小的第二环形焊料预制件。

公开(公告)号：WO2017201260A1

公开(公告)日：2017-11-23

申请号：PCT/US2017/033289

申请日：2017-05-18

Applicant: MATERION CORPORATION

Inventor： KOBA, Richard J. ,  LEE, Chee Kong ,  GOH, Wei Chuan ,  CHIN, Sin Yee

IPC: H01L23/047 ,  H01L23/10 ,  H01L21/52

CPC classification number: H01L23/10 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/047

Abstract: An air cavity package includes a flange and a pedestal extending upward from the flange. A dielectric frame is joined to the flange and surrounds the pedestal. The semiconductor die is placed on the pedestal, which reduces the length of the wires joining the die to the leads of the air cavity package.

Abstract translation: 气室组件包括凸缘和从凸缘向上延伸的基座。 电介质框架连接到法兰并围绕基座。 半导体管芯被放置在基座上，这减少了将管芯连接到空腔封装的引线的长度。

公开(公告)号：WO2015179733A1

公开(公告)日：2015-11-26

申请号：PCT/US2015/032124

申请日：2015-05-22

Applicant: MATERION CORPORATION

Inventor： KOBA, Richard J. ,  LEE, Chee Kong ,  GOH, Wei Chuan ,  NG, Joelle

IPC: H01L23/10 ,  H01L23/14 ,  H01L23/28

CPC classification number: H01L23/373 ,  H01L21/4807 ,  H01L21/4871 ,  H01L23/047 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3738 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An air cavity package includes a dielectric frame that is formed from a polyimide or a liquid crystal polymer (LCP). The dielectric frame is joined to a flange and to electrical leads using a polyimide adhesive.

Abstract translation: 气腔封装包括由聚酰亚胺或液晶聚合物（LCP）形成的电介质框架。 使用聚酰亚胺粘合剂将电介质框架连接到凸缘和电引线。