公开(公告)号：WO2016154061A1

公开(公告)日：2016-09-29

申请号：PCT/US2016/023280

申请日：2016-03-18

Applicant: ROHINNI, INC.

Inventor： HUSKA, Andrew ,  CHRISTIE, Kasey ,  PETERSON, Cody ,  OZIAS, Orin ,  ADAMS, Clinton ,  KUPCOW, Sean

IPC: H01L21/50 ,  H01L21/67 ,  H05K3/00

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133606 ,  G02F2001/133612 ,  H01L21/4853 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67196 ,  H01L21/67265 ,  H01L21/67715 ,  H01L21/67778 ,  H01L21/681 ,  H01L21/6836 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20 ,  H01L23/53242 ,  H01L23/544 ,  H01L24/83 ,  H01L24/89 ,  H01L33/62 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/54413 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/83224 ,  H01L2924/12041 ,  H01L2924/405 ,  H01L2933/0066

Abstract: A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.

Abstract translation: 将半导体器件转移到产品基板的方法包括将产品基板的表面定位在其上具有半导体器件的半导体晶片的第一表面上，并且致动传送机构以使传送机构接合第二表面 半导体晶片。 半导体晶片的第二表面与半导体晶片的第一表面相对。 驱动转印机构包括使销钉推到半导体晶片的第二表面上的位置上，该位置对应于位于半导体晶片的第一表面上的特定半导体器件的位置，并将销收回静止位置。 该方法还包括从半导体晶片的第二表面分离特定半导体器件，并将特定的半导体器件附接到产品基板。