公开(公告)号：WO2014039926A1

公开(公告)日：2014-03-13

申请号：PCT/US2013/058647

申请日：2013-09-07

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： HOANG, Dinhphuoc Vu ,  ZHANG, Guohao ,  ENOMOTO, Dean Kazuo ,  NGUYEN, Hoang Mong ,  CHEN, Howard E.

IPC: G01R29/08 ,  G01R1/06

CPC classification number: G01R27/32 ,  G01R1/07 ,  G01R27/02 ,  G01R27/04 ,  G01R29/0821 ,  G01R29/0871 ,  G01R29/0878 ,  G01R29/10 ,  G01R31/001 ,  G01R31/002

Abstract: Disclosed are systems, devices and methods related to mapping of electromagnetic (EM) field near a radio-frequency (RF) module. In some embodiments, a miniature probe such as a magnetic probe can be configured to obtain near-field measurements at different areas over the RF module, with each area being smaller than an overall lateral area of the RF module. In some embodiments, such measurements can be performed by a scanning system. In some implementations, such a scanning system can be utilized to facilitate applications such as evaluation and/or development of EM shielding designs.

Abstract translation: 公开了与射频（RF）模块附近的电磁（EM）场的映射相关的系统，设备和方法。 在一些实施例中，诸如磁探针的微型探针可以被配置为在RF模块上的不同区域获得近场测量，每个区域小于RF模块的整个横向面积。 在一些实施例中，这样的测量可以由扫描系统执行。 在一些实施方案中，可以利用这种扫描系统来促进诸如评估和/或开发EM屏蔽设计的应用。

公开(公告)号：WO2018144655A1

公开(公告)日：2018-08-09

申请号：PCT/US2018/016326

申请日：2018-02-01

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： DARVEAUX, Robert Francis ,  CHEN, Howard E. ,  NGUYEN, Hoang Mong ,  FREYMAN, Bruce Joseph ,  LIU, Yi

IPC: H01L23/66 ,  H01L21/56 ,  H01L25/065 ,  H01L25/07 ,  H01L23/498 ,  H01L23/485

Abstract: Technologies are described for fabrication of dual-sided packaged electronic modules that control the distribution of an under-fill material between components and a packaging substrate. The disclosed technologies include applying a film to targeted areas on the packaging substrate prior to under-filling one or more components and prior to attaching solder balls; under-filling one or more components and deflashing a portion of the under-fill to remove under-fill material prior to attaching solder balls; using a dam on a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material; forming a trench in a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material; and using an encapsulant on solder balls to control the distribution of an under-fill material.

公开(公告)号：WO2016053981A1

公开(公告)日：2016-04-07

申请号：PCT/US2015/052850

申请日：2015-09-29

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： CHEN, Howard E. ,  READ, Matthew Sean

IPC: H01L23/48 ,  H01L23/06

CPC classification number: H01L23/552 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/05013 ,  H01L2224/06181 ,  H01L2224/45016 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Shielded radio-frequency (RF) module having reduced area. In some embodiments, an RF module can include a packaging substrate configured to receive a plurality of components, and a plurality of shielding wirebonds implemented on the packaging substrate and configured to provide RF shielding functionality for one or more regions on the packaging substrate. The packaging substrate can include a first area associated with implementation of each shielding wirebond. The RF module can further include one or more devices mounted on the packaging substrate. The packaging substrate can further include a second area associated with mounting of each of the one or more devices. Each device can be mounted with respect to a corresponding shielding wirebond such that the second area associated with the device overlaps at least partially with the first area associated with the corresponding shielding wirebond.

Abstract translation: 屏蔽射频（RF）模块具有减小的面积。 在一些实施例中，RF模块可以包括被配置为接收多个组件的封装衬底以及在封装衬底上实现的并被配置为为封装衬底上的一个或多个区域提供RF屏蔽功能的多个屏蔽线扣。 封装衬底可以包括与每个屏蔽引线键的实施相关联的第一区域。 RF模块还可以包括安装在封装衬底上的一个或多个器件。 所述包装衬底还可以包括与所述一个或多个装置中的每一个的安装相关联的第二区域。 每个装置可以相对于相应的屏蔽引线键安装，使得与该装置相关联的第二区域至少部分地与与相应的屏蔽引线键合的第一区域重叠。

公开(公告)号：WO2017059189A1

公开(公告)日：2017-04-06

申请号：PCT/US2016/054652

申请日：2016-09-30

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： LIU, Yi ,  LOBIANCO, Anthony James ,  READ, Matthew Sean ,  NGUYEN, Hoang Mong ,  CHEN, Howard E.

IPC: H01L23/552 ,  H01L23/053 ,  H01L23/13 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/66

CPC classification number: H01L21/78 ,  B23K26/38 ,  H01L21/32051 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/14 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2224/81

Abstract: Devices and methods related to fabrication of shielded modules. In some embodiments, a carrier assembly can be provided for processing of packaged modules. The carrier assembly can include a plate having a first side that defines a plurality of openings, and an adhesive layer implemented on the first side of the plate. The adhesive layer can define a plurality of openings arranged to substantially match the openings of the plate, with each opening of the adhesive layer being dimensioned such that the adhesive layer is capable of providing an adhesive engagement between an underside perimeter portion of a package and a perimeter portion about the corresponding opening of the first side of the plate.

Abstract translation: 与屏蔽模块制造有关的设备和方法。 在一些实施例中，可以提供载体组件用于处理封装的模块。 载体组件可以包括具有限定多个开口的第一侧的板和在板的第一侧上实现的粘合剂层。 粘合剂层可以限定布置成基本上匹配板的开口的多个开口，粘合剂层的每个开口的尺寸使得粘合剂层能够在包装的下侧周边部分和 围绕板的第一侧的对应开口的周边部分。

公开(公告)号：WO2013181280A2

公开(公告)日：2013-12-05

申请号：PCT/US2013/043164

申请日：2013-05-29

Applicant: SKYWORKS SOLUTIONS , INC.

Inventor： READ, Matthew Sean ,  NGUYEN, Hoang Mong ,  LOBIANCO, Anthony James ,  CHEN, Howard E. ,  HOANG, Dinhphuoc Vu

CPC classification number: H01L23/552 ,  H01L21/563 ,  H01L21/565 ,  H01L23/66 ,  H01L24/27 ,  H01L24/32 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2223/6672 ,  H01L2224/29139 ,  H01L2224/29194 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/19107 ,  H01Q1/526 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00

Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmoid structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF components) and the RF-shielding wirebonds. The overmoid structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmoid structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF components).

Abstract translation: 公开了与导电涂料层相关的装置和方法，其被配置为为封装的半导体模块提供射频（RF）屏蔽。 这样的模块可以包括封装衬底，安装在封装衬底上的一个或多个RF组件，设置在封装衬底内的接地平面以及设置在封装衬底上并电连接到接地面的多个RF屏蔽线圈。 该模块还可以包括形成在封装衬底上并被设计成基本上封装RF部件的过氧化物结构）和RF屏蔽引线键。 上覆层结构可以限定暴露RF屏蔽线束的上部的上表面。 该模块还可以包括具有设置在上覆盖结构的上表面上的银薄片的导电涂料层，使得导电涂料层，RF屏蔽引线键和接地平面形成用于RF部件的RF屏蔽）。